- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK27FN2M0VMI15 NXP USA Inc. | 17 | - | Datasheet | 16 Weeks | Surface Mount | 169-LFBGA | - | - | A/D 16b SAR; D/A 2x6b, 1x12b | 120 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K27F | - | yes | Discontinued | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal/External | 150MHz | 1M x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, PWM, WDT | - | FLASH | 32-Bit | 2MB 2M x 8 | EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL33Z32VLH4 NXP USA Inc. | 10006 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 20x16b; D/A 1x12b | 54 | 4096 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL3 | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | - | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LCD, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | FlexIO, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 SPC5606SF2VLU6R NXP USA Inc. | 2305 | - | - | 12 Weeks | Surface Mount | 176-LQFP | YES | - | A/D 16x10b | 136 | - | 1048576 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2008 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 176 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | SPC5606 | - | S-PQFP-G176 | Not Qualified | - | 3.3/5V | - | Internal | 64MHz | 48K x 8 | 3V~5.5V | - | e200z0h | DMA, LCD, POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, QSPI, SCI, SPI | 180mA | 32 | - | - | - | - | - | 64K x 8 | - | - | - | AEC-Q100 | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC908JK3ECDWE NXP USA Inc. | 13654 | - | Datasheet | 10 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | - | 20-SOIC | A/D 12x8b | 15 | - | - | - | -40°C~85°C TA | Tube | 1996 | HC08 | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC908JK3 | - | - | - | - | - | - | External | 8MHz | 128 x 8 | 2.7V~3.3V | - | HC08 | LED, LVD, POR, PWM | - | FLASH | 8-Bit | 4KB 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL17Z128VMP4R NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | - | A/D 20x16b; D/A 1x12b | 54 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2011 | Kinetis KL1 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | - | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 S9S12P96J0VFTR NXP USA Inc. | 11897 | - | - | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | - | A/D 10x12b | 34 | - | 98304 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2006 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | NO LEAD | - | 5V | 0.5mm | - | S9S12P96 | - | S-PQCC-N48 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 4K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
SPC5602PEF0VLH6 NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x10b | 45 | - | 262144 | Automotive grade | -40°C~105°C TA | Tray | 2007 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 64 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | SPC5602 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 20K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 65mA | 32 | YES | YES | YES | - | - | 4K x 16 | - | - | - | AEC-Q100 | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
S9S08LG32J0VLH NXP USA Inc. | 6 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 12x12b | 53 | - | 32768 | Automotive grade | -40°C~105°C TA | Tray | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | S9S08LG32 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1.9K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LCD, LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | AEC-Q100 | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC908AZ60AMFUE NXP USA Inc. | 10000 | - | Datasheet | - | Surface Mount | 64-QFP | YES | - | A/D 15x8b | 52 | - | - | - | -40°C~125°C TA | Tray | 2005 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AZ60 | - | S-PQFP-G64 | Not Qualified | 5.5V | - | 4.5V | Internal | 8.4MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 1K x 8 | - | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 SPC5746CHK1AVKU6 NXP USA Inc. | 33 | - | Datasheet | 17 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | - | A/D 80x10b, 64x12b | 129 | - | - | - | -40°C~105°C TA | Tray | - | MPC57xx | - | - | Active | 3 (168 Hours) | 176 | - | - | - | - | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | - | - | - | - | 1.32V | - | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | - | 32 | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
 LPC12D27FBD100/301 NXP USA Inc. | 720 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 8x10b | 40 | - | 131072 | - | -40°C~85°C TA | Tray | 2010 | LPC1200 | - | - | Active | 3 (168 Hours) | 100 | EAR99 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | LPC12D27 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 45MHz | 8K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, SSP, UART/USART | - | 32 | YES | YES | NO | NO | - | - | CORTEX-M0 | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
 SPC5602PEF0MLL6R NXP USA Inc. | 2037 | - | - | 12 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 16x10b | 79 | - | 262144 | Automotive grade | -40°C~125°C | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | SPC5602 | - | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 20K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 65mA | 32 | YES | YES | YES | - | - | 64K x 8 | - | - | - | AEC-Q100 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S08RE8FJE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 32-LQFP | - | - | - | 25 | - | - | - | 0°C~70°C TA | Tray | 2005 | S08 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | MC9S08RE8 | - | - | - | - | - | - | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 8KB 8K x 8 | SCI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S9S12ZVL32F0VLFR NXP USA Inc. | 245 | - | - | 12 Weeks | Surface Mount | 48-LQFP | - | - | A/D 10x10b | 34 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2013 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 32MHz | 1K x 8 | 5.5V~18V | MICROCONTROLLER | S12Z | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | - | - | - | - | - | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S12DJ64MFUE NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | - | A/D 8x10b | 59 | - | 65536 | - | -40°C~125°C TA | Tray | 1998 | HCS12 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DJ64 | - | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 1K x 8 | CPU12 | - | - | - | 16 | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MCF5484CZP200 NXP USA Inc. | 268 |
| Datasheet | 10 Weeks | Surface Mount | 388-BBGA | YES | - | - | 99 | - | - | - | -40°C~85°C TA | Tray | 2001 | MCF548x | e0 | - | Not For New Designs | 3 (168 Hours) | 388 | - | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5484 | - | S-PBGA-B388 | Not Qualified | 3.6V | - | 3V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | - | 32 | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||
MC9S08PA60VLF NXP USA Inc. | 15 | - | Datasheet | - | Surface Mount | 48-LQFP | YES | - | A/D 12x12b | 41 | - | 61440 | - | -40°C~105°C TA | Tray | 2012 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08PA60 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | 256 x 8 | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC9S08DN60ACLF NXP USA Inc. | 11222 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 16x12b | 39 | - | 61440 | - | -40°C~85°C TA | Tray | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.5mm | 40 | MC9S08DN60 | - | S-PQFP-G48 | Not Qualified | - | 3/5V | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI | - | 8 | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S912ZVML64F3WKH NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tray | - | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 4K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK24FN1M0VDC12 NXP USA Inc. | 1740 | - | - | 13 Weeks | Surface Mount | 121-XFBGA | YES | - | A/D 37x16b; D/A 2x12b | 83 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | - | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant |