- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S912ZVML64F3WKH NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tray | - | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 4K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK24FN1M0VDC12 NXP USA Inc. | 1740 | - | - | 13 Weeks | Surface Mount | 121-XFBGA | YES | A/D 37x16b; D/A 2x12b | 83 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | - | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MCF5232CVM100 NXP USA Inc. | 1 | - | Datasheet | 10 Weeks | Surface Mount | 196-LBGA | YES | - | 97 | - | - | - | -40°C~85°C TA | Tray | 1999 | MCF523x | e1 | - | Not For New Designs | 3 (168 Hours) | 196 | 5A992 | TIN SILVER COPPER | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5232 | - | S-PBGA-B196 | Not Qualified | 1.6V | - | 1.4V | External | 100MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, I2C, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | YES | YES | - | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||
 XC68C812A4PVE5 NXP USA Inc. | 651 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 8x8b | 83 | - | - | - | 0°C~70°C TA | Tray | 1994 | HC12 | e3 | - | Not For New Designs | 3 (168 Hours) | 112 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | XC68C812A | - | S-PQFP-G112 | Not Qualified | 5.5V | - | 4.5V | Internal | 5MHz | 1K x 8 | 3V~3.6V | MICROCONTROLLER | CPU12 | POR, WDT | - | EEPROM | 16-Bit | 4KB 4K x 8 | SCI, SPI | - | 16 | YES | NO | NO | NO | 22 | - | - | - | - | - | 16 | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 S9S12GN32F1VLCR NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 8x10b | 26 | 2048 | 32768 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 1997 | HCS12 | - | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.8mm | - | - | - | S-PQFP-G32 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | - | - | 1K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MCF5270CVM150 NXP USA Inc. | 299 | - | Datasheet | 9 Weeks | Surface Mount | 196-LBGA | YES | - | 97 | - | - | - | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | - | Not For New Designs | 3 (168 Hours) | 196 | 5A992 | TIN SILVER COPPER OVER NICKEL | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5270 | - | S-PBGA-B196 | Not Qualified | 1.6V | - | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | YES | YES | - | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||
 MKL02Z32VFK4R NXP USA Inc. | 10086 | - | Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b | 22 | - | 32768 | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL02 | - | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL02Z32 | - | S-PQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 4mm | 4mm | ROHS3 Compliant | ||
 MC56F8247VLH NXP USA Inc. | 1500 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | 54 | - | 49152 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F8247 | - | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 24K x 16 | CANbus, I2C, LINbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MCF5249CVM140 NXP USA Inc. | 615 | - | Datasheet | 10 Weeks | Surface Mount | 160-BGA | YES | A/D 4x12b | 47 | - | - | - | -40°C~85°C TA | Tray | 2001 | MCF524x | e1 | - | Obsolete | 3 (168 Hours) | 160 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | REQUIRES 3.3V SUPPLY FOR I/O | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | MCF5249 | - | S-PBGA-B160 | Not Qualified | - | - | - | External | 140MHz | 96K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, I2S, POR, Serial Audio, WDT | 33.86MHz | ROMless | 32-Bit | - | I2C, IDE, Memory Card, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | YES | YES | - | 16 | FIXED POINT | YES | 1.75mm | 15mm | 15mm | ROHS3 Compliant | ||
 SPC5746CSK1MKU6 NXP USA Inc. | 33 | - | Datasheet | 18 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | - | - | - | -40°C~125°C TA | Bulk | 2016 | MPC57xx | - | yes | Active | 3 (168 Hours) | 176 | - | - | - | - | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | - | - | - | - | 1.32V | - | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | - | 32 | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
 MC9S08QE96CLD NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 10x12b | 34 | - | 98304 | - | -40°C~85°C TA | Tray | 2009 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08QE96 | - | S-PQFP-G44 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 6K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 96KB 96K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12GC64CFUE NXP USA Inc. | 10641 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | A/D 8x10b | 60 | - | - | - | -40°C~85°C TA | Tray | 2010 | HCS12 | e3 | - | Active | 3 (168 Hours) | 80 | EAR99 | MATTE TIN | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12GC64 | - | S-PQFP-G80 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | - | - | - | 16 | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MK63FN1M0VMD12 NXP USA Inc. | 105 | - | - | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 41x16b; D/A 2x12b | 95 | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | - | - | S-PBGA-B144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
MKL14Z64VLH4 NXP USA Inc. | 1600 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 54 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AVAILABLE | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL14Z64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9RS08KB8CWJ NXP USA Inc. | 33 | - | Datasheet | 10 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 12x10b | 18 | - | 8192 | - | -40°C~85°C TA | Tube | 2009 | RS08 | e3 | - | Active | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9RS08KB8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 254 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | 12.8mm | 7.5mm | ROHS3 Compliant | ||
 MKL17Z256VMP4R NXP USA Inc. | 18 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 20x16b; D/A 1x12b | 54 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2011 | Kinetis KL1 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | - | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
MC9S08AC60CFJE NXP USA Inc. | 7656 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 6x10b | 22 | - | 63280 | - | -40°C~85°C TA | Tray | 2000 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08AC60 | - | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08QG84CDTER NXP USA Inc. | 21 | - | - | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 8192 | - | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QG84 | - | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 LPC1765FBD100,551 NXP USA Inc. | 3000 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x12b; D/A 1x10b | 70 | - | 262144 | - | -40°C~85°C TA | Tray | 2009 | LPC17xx | e3 | - | Discontinued | 3 (168 Hours) | 100 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | LPC1765 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 2.5/3.33/3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | - | 32 | YES | YES | YES | YES | - | - | ARM7 | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
MK20DX32VMP5 NXP USA Inc. | 30 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 13x16b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MK20DX32 | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | 1.2mm | 5mm | 5mm | ROHS3 Compliant |