- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
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 MK20DX32VMP5 NXP USA Inc. | 30 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 13x16b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | - | 40 | MK20DX32 | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | 1.2mm | 5mm | 5mm | ROHS3 Compliant | ||
 MC9S08DV16AMLC NXP USA Inc. | 21 | - | Datasheet | 8 Weeks | Surface Mount | 32-LQFP | YES | A/D 10x12b | 25 | - | - | - | -40°C~125°C TA | Tray | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | MC9S08DV16 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MKL24Z32VLK4 NXP USA Inc. | 60 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 14x12b | 66 | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1V | 0.5mm | - | 40 | MKL24Z32 | - | S-PQFP-G80 | Not Qualified | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S08DV48ACLH NXP USA Inc. | 12 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 53 | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MC9S08DV48 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08AC60CFGER NXP USA Inc. | 539 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 63280 | - | -40°C~85°C TA | Tape & Reel (TR) | 2000 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | - | 40 | MC9S08AC60 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08AW16CFGER NXP USA Inc. | 3775 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 16384 | - | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | MC9S08AW16 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 LPC1788FET208,551 NXP USA Inc. | 6530 |
| Datasheet | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x12b; D/A 1x10b | 165 | - | 524288 | - | -40°C~85°C TA | Tray | 2010 | LPC17xx | e1 | - | Active | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | - | NOT SPECIFIED | LPC1788 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | - | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | - | - | - | 32 | - | - | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||
MK22FX512VLK12 NXP USA Inc. | 186 | - | Datasheet | 26 Weeks | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 56 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MK22FX512 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 S912ZVC19F0MLFR NXP USA Inc. | 12 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 10x10b; D/A 1x8b | 28 | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 12K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68HC908QY4CDTE NXP USA Inc. | 3000 | - | Datasheet | - | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 4x8b | 13 | - | - | - | -40°C~85°C TA | Tube | 2004 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 2.7V MINIMUM SUPPLY @ 4MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | MC68HC908 | - | R-PDSO-G16 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MCF52259CVN80 NXP USA Inc. | 100 | - | - | 10 Weeks | Surface Mount | 144-LBGA | YES | A/D 8x12b | 96 | - | 524288 | - | -40°C~85°C TA | Tray | 2004 | MCF5225x | e2 | - | Active | 3 (168 Hours) | 144 | 5A992 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | - | 40 | MCF52259 | - | S-XBGA-B144 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 80MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 S912XEQ512BVALR NXP USA Inc. | 618 | - | Datasheet | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 32768 | 524288 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 112 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.65mm | - | - | - | - | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | - | 4K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
S9S08DZ16F2MLF NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 16x12b | 39 | - | - | - | -40°C~125°C TA | Tray | - | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | - | 40 | S9S08DZ16 | - | - | - | - | - | - | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 FS32K144MNT0CLLT NXP USA Inc. | 450 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | - | -40°C~85°C TA | Tray | 2011 | S32K | - | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | compliant | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 64MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | - | - | - | 14mm | 14mm | RoHS Compliant | ||
MK40DX128VLH7 NXP USA Inc. | 19 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 18x16b; D/A 1x12b | 36 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK40DX128 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MCF51JU32VFM NXP USA Inc. | 330 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 6x12b; D/A 1x12b | 22 | - | 32768 | - | -40°C~105°C TA | Tray | 2004 | MCF51Jx | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | - | 40 | MCF51JU32 | - | S-XQCC-N32 | Not Qualified | 3.6V | 2/3.3V | 1.71V | External | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER | Coldfire V1 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 SPC5742PK1AMLQ8 NXP USA Inc. | 900 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 64x12b | 79 | - | - | - | -40°C~125°C TA | Tray | 2010 | MPC57xx | - | - | Active | 3 (168 Hours) | 144 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | - | - | - | - | 3.6V | - | 3.15V | Internal | 180MHz | 192K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | 32 | - | - | - | - | - | 64 | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MC9S08LC60LH NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x12b | 18 | - | 61440 | - | 0°C~70°C TA | Tray | 2007 | S08 | e3 | - | Obsolete | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MC9S08LC60 | - | S-PQFP-G64 | Not Qualified | 3.6V | 2/3.3V | 1.8V | External | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 17.2mA | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKL26Z256VMC4R NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D - 16bit; D/A - 12bit | 80 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL2 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | - | 40 | - | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MCF5307CAI66B NXP USA Inc. | 2500 | - | Datasheet | 10 Weeks | Surface Mount | 208-BFQFP | YES | - | 16 | - | - | - | -40°C~85°C TA | Tray | 1999 | MCF530x | e3 | - | Active | 3 (168 Hours) | 208 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 250 | 3.3V | 0.5mm | - | 30 | MCF5307 | - | S-PQFP-G208 | Not Qualified | 3.6V | 3.3V | 3V | External | 66MHz | 4K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, POR, WDT | 33.33MHz | ROMless | 32-Bit | - | EBI/EMI, I2C, UART/USART | - | 32 | - | - | - | - | 32 | - | - | YES | YES | - | 32 | FIXED POINT | YES | 4.1mm | 28mm | 28mm | ROHS3 Compliant |