- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 LPC802M001JHI33E NXP USA Inc. | 379 | - | Datasheet | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | A/D 12x12b | 17 | - | - | - | -40°C~105°C TA | Tray | - | LPC80xM | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 15MHz | 2K x 8 | 1.71V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | - | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKV30F64VLH10 NXP USA Inc. | 25 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | 46 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | - | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 LPC1833JET256,551 NXP USA Inc. | 180 | - | Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 16x10b; D/A 1x10b | 164 | - | 524288 | - | -40°C~105°C TA | Tray | 2010 | LPC18xx | e1 | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 3.3V | 1mm | - | LPC1833 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | 16K x 8 | - | CORTEX-M3 | - | - | - | 17mm | 17mm | ROHS3 Compliant | ||
MC9S08PT60AVLH NXP USA Inc. | 19 | - | Datasheet | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 57 | 4096 | 61440 | - | -40°C~105°C TA | Tray | 2012 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC908AP32CFAER NXP USA Inc. | 50 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 32 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908AP32 | - | S-PQFP-G48 | - | 5.5V | - | 4.5V | Internal | 8MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC908AP16CFAE NXP USA Inc. | 123 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 32 | - | - | - | -40°C~85°C TA | Tray | 2007 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908AP16 | - | S-PQFP-G48 | - | 5.5V | - | 4.5V | Internal | 8MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC908LJ12CFBE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 52-LQFP | YES | A/D 4x10b | 20 | - | 12288 | - | -40°C~85°C TA | Tray | 2005 | HC08 | - | Obsolete | 3 (168 Hours) | 52 | EAR99 | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.635mm | - | MC908LJ12 | - | S-PQFP-G52 | Not Qualified | - | 3.3/5V | - | Internal | 8MHz | 512 x 8 | 3V~5.5V | - | - | LCD, LVD, POR, PWM | - | FLASH | 8-Bit | 12KB 12K x 8 | IRSCI, SPI | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S12XEQ512CAGR NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 524288 | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MC9S12XEQ512 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | 23 | 4K x 8 | - | CPU12 | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MCF51AC256BCFUE NXP USA Inc. | 30 | - | Datasheet | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 20x12b | 54 | - | 262144 | - | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MCF51AC256 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 S912ZVML32F3WKH NXP USA Inc. | 1584 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tray | 2012 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC68CK16Z1CAG16 NXP USA Inc. | 70 | - | Datasheet | - | Surface Mount | 144-LQFP | YES | A/D 8x10b | 16 | - | - | - | -40°C~85°C TA | Tray | 1999 | HC16 | e3 | Not For New Designs | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68CK16 | - | S-PQFP-G144 | Not Qualified | 5.5V | - | 4.5V | Internal | 16MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | CPU16 | POR, PWM, WDT | 4.2MHz | ROMless | 16-Bit | - | EBI/EMI, SCI, SPI | - | 16 | NO | NO | YES | NO | 24 | - | - | - | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
S9S12GN16F0CLF NXP USA Inc. | 10 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 40 | - | 16384 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GN16 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 1K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | - | - | 512 x 8 | - | CPU12 | AEC-Q100 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08QG84CDTE NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 8192 | - | -40°C~85°C | Tube | 2005 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QG84 | - | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | HCS08 | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
MC9S12H128VFVE NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x10b | 99 | - | 131072 | - | -40°C~105°C TA | Tray | 1996 | HCS12 | e3 | Obsolete | 3 (168 Hours) | 144 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | 9S12H128 | - | S-PQFP-G144 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 16MHz | 6K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | LCD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 18 | 4K x 8 | - | CPU12 | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
S9S12VRP64F0VLF NXP USA Inc. | 281 | - | - | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 6x10b | 28 | - | - | - | -40°C~105°C TA | Tray | - | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | IrDA, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
S912XEP100BMAG NXP USA Inc. | 2000 | - | - | 16 Weeks | Surface Mount | 144-LQFP | - | A/D 24x12b | 119 | - | - | - | -40°C~125°C TA | Tray | 1996 | HCS12X | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | External | 50MHz | 64K x 8 | 1.72V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08QE16CLD NXP USA Inc. | 2000 |
| Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 10x12b | 34 | - | 16384 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MC9S08QE16 | - | S-PQFP-G44 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 SPC5777CDK3MME3 NXP USA Inc. | 15 | - | Datasheet | 16 Weeks | Surface Mount | 416-BGA | YES | A/D 16b Sigma-Delta, eQADC | - | 524288 | 8388608 | - | -40°C~125°C TA | Tray | - | MPC57xx | - | Active | 3 (168 Hours) | 416 | - | - | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. | - | BOTTOM | BALL | 260 | - | 1mm | 40 | - | - | S-PBGA-B416 | - | 1.32V | - | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | - | 32 | YES | YES | YES | NO | - | - | 8 | - | - | - | 2.02mm | 27mm | 27mm | ROHS3 Compliant | ||
 MC908AP32CFBER NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 44-QFP | YES | A/D 8x10b | 32 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AP32 | - | - | - | 5.5V | - | 4.5V | Internal | 8MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | 8MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
S912XET256J2VAG NXP USA Inc. | 10000 | - | - | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 262144 | - | -40°C~105°C TA | Tray | 2013 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S912XET256 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 16 | YES | YES | YES | - | 23 | 4K x 8 | - | CPU12 | - | 16 | - | 20mm | 20mm | ROHS3 Compliant |