- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S08QE32CFM NXP USA Inc. | 45 |
| Datasheet | 10 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 10x12b | 26 | - | 32768 | - | -40°C~85°C TA | Tray | 2008 | S08 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | OPERATES AT 2.4V TO 2.1V SUPPLY AT 40 MHZ, 2.1V TO 1.8V SUPPLY AT 20 MHZ | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QE32 | - | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 MKL46Z128VMC4 NXP USA Inc. | 5 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D - 16bit; D/A - 12bit | 84 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL4 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 40 | MKL46Z128 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 S9S12GA240F0VLF NXP USA Inc. | 37 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b; D/A 2x8b | 40 | - | 245760 | Automotive grade | -40°C~105°C TA | Tray | 2007 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GA240 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 S9S12XS256J0VAE NXP USA Inc. | 703 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 44 | - | - | Automotive grade | -40°C~105°C TA | Tray | 2004 | HCS12X | - | Active | 3 (168 Hours) | 64 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.5mm | - | S9S12XS256 | - | S-PQFP-G64 | Not Qualified | 1.98V | 1.83.3/5V | 1.72V | External | 40MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, SCI, SPI | 35mA | 16 | YES | YES | YES | - | - | - | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK20DN64VFT5 NXP USA Inc. | 2000 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 11x16b | 29 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK20DN64 | - | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
 LPC11U35FHN33/401, NXP USA Inc. | 210 | - | Datasheet | 16 Weeks | Surface Mount | 32-VQFN Exposed Pad | YES | A/D 8x10b | 26 | - | 65536 | - | -40°C~85°C TA | Tray | 2010 | LPC11Uxx | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | NO LEAD | - | 3.3V | 0.635mm | - | LPC11U | - | S-PQCC-N32 | Not Qualified | - | 3.3V | - | Internal | 50MHz | 10K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | - | 32 | - | - | - | - | - | 4K x 8 | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S912XEG128J2MAAR NXP USA Inc. | 33 |
| Datasheet | 16 Weeks | Surface Mount | 80-QFP | YES | A/D 8x12b | 59 | - | 131072 | - | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | 40 | S912XEG128 | - | S-PQFP-G80 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 16 | YES | YES | YES | - | - | 2K x 8 | - | CPU12 | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 LPC1833JBD144E NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x10b; D/A 1x10b | 83 | - | 524288 | - | -40°C~105°C TA | Tray | 2010 | LPC18xx | - | Active | 3 (168 Hours) | 144 | - | - | - | - | QUAD | GULL WING | - | 3.3V | 0.5mm | - | LPC1833 | 144 | S-PQFP-G144 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | 16K x 8 | - | CORTEX-M3 | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 LPC804M101JHI33Y NXP USA Inc. | 832 | - | Datasheet | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x12b; D/A 1x10b | 30 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | - | LPC80xM | - | Active | 3 (168 Hours) | 32 | - | - | - | - | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | NOT SPECIFIED | - | - | - | - | 3.6V | - | 1.71V | Internal | 15MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 15MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MKL14Z64VFT4R NXP USA Inc. | 268 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 15x12b | 40 | 8192 | 65536 | - | -40°C~105°C TA | Tape & Reel (TR) | 2014 | Kinetis KL1 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | - | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
MK21FX512AVLQ12 NXP USA Inc. | 18 | - | - | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 SPC5643LF2MMM1R NXP USA Inc. | 2300 | - | Datasheet | 12 Weeks | Surface Mount | 257-LFBGA | YES | A/D 32x12b | - | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | - | Active | 3 (168 Hours) | 257 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.8mm | NOT SPECIFIED | SPC5643 | - | - | - | 3.63V | - | 3V | Internal | 120MHz | 128K x 8 | 3V~5.5V | MICROCONTROLLER | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | 32 | - | - | - | - | - | - | 64 | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 SCF5249VM140 NXP USA Inc. | 17 | - | Datasheet | 10 Weeks | Surface Mount | 160-BGA | YES | A/D 4x12b | 47 | - | - | - | 0°C~70°C TA | Bulk | 2001 | MCF524x | e1 | Not For New Designs | 3 (168 Hours) | 160 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | - | - | S-PBGA-B160 | Not Qualified | - | - | - | External | 140MHz | 96K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, I2S, POR, Serial Audio, WDT | 33.86MHz | ROMless | 32-Bit | - | I2C, IDE, Memory Card, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | - | YES | YES | - | 16 | FIXED POINT | YES | 1.75mm | 15mm | 15mm | ROHS3 Compliant | ||
MCF52211CAE66 NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 43 | - | 131072 | - | -40°C~85°C TA | Tray | 2007 | MCF5221x | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MCF52211 | - | S-PQFP-G64 | Not Qualified | 3.6V | 3/3.3V | 3V | Internal | 66MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12GC64MPBE NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 52-LQFP | YES | A/D 8x10b | 35 | - | 65536 | - | -40°C~125°C TA | Tray | 2010 | HCS12 | e3 | Active | 3 (168 Hours) | 52 | EAR99 | MATTE TIN | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12GC64 | - | S-PQFP-G52 | Not Qualified | 2.75V | 2.53.3/5V | - | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | - | CPU12 | - | - | - | - | - | - | 1.7mm | 10mm | 10mm | ROHS3 Compliant | ||
MK21FX512AVMC12 NXP USA Inc. | 823 | - | - | 13 Weeks | Surface Mount | 121-LFBGA | - | A/D 42x16b; D/A 2x12b | 81 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK10DX128VMD10 NXP USA Inc. | 1500 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | - | 131072 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DX128 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 MCF5274LVM166 NXP USA Inc. | 31 | - | Datasheet | 12 Weeks | Surface Mount | 196-LBGA | YES | - | 61 | - | - | - | 0°C~70°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 196 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5274 | - | S-PBGA-B196 | Not Qualified | 1.6V | - | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | - | 32 | - | - | - | - | 24 | - | - | - | YES | YES | - | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||
MKE14Z256VLH7 NXP USA Inc. | 3482 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | 32768 | 262144 | - | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xZ | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 72MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | FlexIO, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | 34K x 8 | 8 | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MCF51JM128EVLK NXP USA Inc. | 2 | - | Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 12x12b | 66 | - | 131072 | - | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | Active | 3 (168 Hours) | 80 | 5A992 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MCF51JM128 | - | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI, USB OTG | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | 1.74mm | 14mm | 14mm | ROHS3 Compliant |