- Surface Mount
- Terminal Form
- Terminal Position
- Length
- Terminal Pitch
- Width
- uPs/uCs/Peripheral ICs Type
- Peak Reflow Temperature (Cel)
- Mounting Type
- Part Status
- Time@Peak Reflow Temperature-Max (s)
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Attribute column
Manufacturer
NXP Embedded - Microcontrollers - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Part Status | Moisture Sensitivity Level (MSL) | Applications | Voltage - Supply | Base Part Number | Interface | RAM Size | Core Processor | Program Memory Type | Controller Series | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A7004CGHN1/T1AGBEL NXP USA Inc. | 27 | - | - | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -40°C~90°C TA | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
A7003CGHN1/T1AGBEL NXP USA Inc. | 27 | - | - | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~85°C TA | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
A7001CGHN1/T1AGBWJ NXP USA Inc. | In Stock | - | - | 22 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~85°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
A7001CGHN1/T1AGAEL NXP USA Inc. | In Stock | - | - | 22 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~85°C | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
A7006CGHN1/T1AGBEL NXP USA Inc. | In Stock | - | - | 22 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | -40°C~90°C TA | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
A7101CGHN1/T0B0406 NXP USA Inc. | 27 | - | - | 20 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~90°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~3.6V | - | I2C | - | MX51 | EEPROM (20kB) | A710x | - | ||
A7005CGHN1/T1AGBFJ NXP USA Inc. | 27 | - | - | 26 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~85°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
 A7101CGTK2/T0B0405 NXP USA Inc. | 27 | - | - | - | Surface Mount | 8-VDFN Exposed Pad | - | - | -25°C~90°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~3.6V | - | I2C | - | MX51 | EEPROM (20kB) | A710x | - | ||
A7102CGHN1/T0B041J NXP USA Inc. | 27 | - | - | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -40°C~90°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~3.6V | - | I2C | - | MX51 | EEPROM (20kB) | A710x | - | ||
 MM912H634CM1AER2 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | - | 9 | -40°C~125°C | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | Automotive | 2.25V~5.25V | MM912H634 | LIN, SCI | 6K x 8 | S12 | FLASH (64kB) | HCS12 | ROHS3 Compliant | ||
A7002CGHN1/T1AG502 NXP USA Inc. | 27 | - | - | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -40°C~90°C | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
 MM912G634CM1AER2 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP | - | 9 | -40°C~125°C | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | Automotive | 2.25V~5.25V | MM912G634 | LIN, SCI | 2K x 8 | S12 | FLASH (48kB) | HCS12 | ROHS3 Compliant | ||
A7004CMHN1/T1AGBEL NXP USA Inc. | 27 | - | - | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -40°C~90°C TA | - | 2011 | Active | - | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
 A7002CMHN1/T1AGBEL NXP USA Inc. | 27 | - | Datasheet | 25 Weeks | - | - | - | - | -40°C~90°C | Tape & Reel (TR) | 2011 | Active | 1 (Unlimited) | Authentication | 1.62V~5.5V | - | I2C, 2-Wire Serial | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ROHS3 Compliant | ||
 ASC8849AETE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 484-TFBGA | - | - | - | Tray | 2015 | Obsolete | 3 (168 Hours) | Embedded Multimedia Communication, Security and Entertainment | - | ASC8849 | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | - | ARM9® | - | - | ROHS3 Compliant | ||
A7102CGTK2/T0B042J NXP USA Inc. | In Stock | - | - | - | Surface Mount | 8-VDFN Exposed Pad | - | - | -40°C~90°C TA | Tape & Reel (TR) | 2011 | Active | - | Authentication | 1.62V~3.6V | - | I2C | - | MX51 | EEPROM (20kB) | A710x | - | ||
 EM783-SCE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 22 | -40°C~85°C | Tray | 2003 | Obsolete | 3 (168 Hours) | Energy Measurement | 2.6V~3.6V | - | I2C, IrDA, SPI, UART/USART | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | - | ROHS3 Compliant | ||
A7005CGHN1/T1AGGEL NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 32-VFQFN Exposed Pad | - | - | -25°C~85°C TA | - | 2011 | Obsolete | 1 (Unlimited) | Authentication | 1.62V~5.5V | - | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | - | ||
ASC8851AETK NXP USA Inc. | In Stock | - | - | 26 Weeks | Surface Mount | 484-TFBGA | - | - | - | Tray | 2015 | Obsolete | 3 (168 Hours) | Embedded Multimedia Communication, Security and Entertainment | - | ASC8851 | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | - | ARM9® | - | - | ROHS3 Compliant | ||
ASC8849AETK NXP USA Inc. | In Stock | - | - | - | Surface Mount | 484-TFBGA | - | - | - | Tray | 2015 | Obsolete | 3 (168 Hours) | Embedded Multimedia Communication, Security and Entertainment | - | ASC8849 | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | - | ARM9® | - | - | ROHS3 Compliant |