- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 LS1023AXN8MQB NXP USA Inc. | 173 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 LS1023AXN7MQB NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 621-FBGA, FCBGA | - | - | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
LS1043ASN8MQB NXP USA Inc. | 120 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 MC7448HX600ND NXP USA Inc. | 2274 | - | Datasheet | 12 Weeks | 360-BCBGA, FCCBGA | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.05V | 1.31.8/2.5V | 0.95V | 600MHz | MICROPROCESSOR, RISC | PowerPC G4 | 600MHz | 32 | - | NO | YES | - | FIXED POINT | NO | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | 2.8mm | 25mm | Non-RoHS Compliant | ||
LS1026AXE8MQA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 76 | -40°C~105°C | Tray | - | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | - | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B780 | 0.93V | - | 0.87V | 1.2GHz | - | ARM® Cortex®-A72 | - | - | 14 | YES | - | 64 | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
 MPC8378VRALG NXP USA Inc. | In Stock | - | Datasheet | - | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2008 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 T1013NSE7MQA NXP USA Inc. | 44 | - | Datasheet | 18 Weeks | 525-FBGA, FCBGA | - | - | - | 0°C~105°C TA | - | 2014 | QorIQ T1 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | GbE (8) | 1 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 MPC755BPX350LE NXP USA Inc. | In Stock | - | Datasheet | - | 360-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | - | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | 2.77mm | 25mm | Non-RoHS Compliant | ||
 XPC8260CZUIFBC NXP USA Inc. | 194 | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2004 | MPC82xx | - | Obsolete | 3 (168 Hours) | 480 | 5A991 | - | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 1.9V | - | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MPC8313ZQAGDC NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | 32 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | 2.55mm | 27mm | Non-RoHS Compliant | ||
 MPC8536AVJAULA NXP USA Inc. | 32 | - | - | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~90°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | S-PBGA-B783 | 1.05V | - | 0.95V | 1.333GHz | MICROPROCESSOR | PowerPC e500 | - | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||
MPC8533VTARJ NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | - | - | - | 0°C~90°C TA | Tray | 2006 | MPC85xx | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | MPC8533 | - | - | - | - | 1.067GHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, PCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 P1023NSN5CFB NXP USA Inc. | In Stock | - | Datasheet | - | 457-FBGA | YES | - | - | 0°C~105°C TA | Tray | 2012 | QorIQ P1 | - | Obsolete | 3 (168 Hours) | 457 | 3A001.A.3 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 0.8mm | - | P1023 | S-PBGA-B457 | 1.05V | - | 0.95V | 500MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | 1.9mm | 19mm | ROHS3 Compliant | ||
 MPC823ZQ81B2T NXP USA Inc. | In Stock | - | Datasheet | - | 256-BBGA | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC823 | - | - | - | - | 81MHz | - | PowerPC | - | - | - | - | - | - | - | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | - | - | LCD, Video | - | - | - | Non-RoHS Compliant | ||
 MCIMX6DP6AVT8ABR NXP USA Inc. | 2204 | - | Datasheet | 12 Weeks | 624-FBGA, FCBGA | - | 624-FCBGA (21x21) | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6DP | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 852MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
 T2081NSN8T1B NXP USA Inc. | 2490 | - | Datasheet | 18 Weeks | 896-BFBGA, FCBGA | YES | - | - | 0°C~105°C TA | - | - | QorIQ T2 | - | Active | 3 (168 Hours) | 780 | 3A991.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.025V | 0.8mm | 30 | - | S-PBGA-B780 | 1.055V | - | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | - | DDR3, DDR3L | USB 2.0 + PHY (2) | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | 2.61mm | 23mm | ROHS3 Compliant | ||
 MCIMX6S4AVM08ADR NXP USA Inc. | 40 | - | Datasheet | 12 Weeks | 624-LFBGA | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | - | i.MX6S | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
 LS1021AXE7HNB NXP USA Inc. | 11 | - | Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 525 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | - | S-PBGA-B525 | 1.03V | - | 0.97V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | ||
 MPC880ZP80 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A992 | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC880 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 80MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MPC8255ACVVMHBB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 40 | PC8255 | S-PBGA-B480 | 2.7V | - | 2.4V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | - | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant |