- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8270VVQLDA NXP USA Inc. | 2408 | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant | ||
 T1042NXE7PQB NXP USA Inc. | 2176 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2014 | QorIQ T1 | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||
 MPC8555ECPXALF NXP USA Inc. | 780 | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8555 | S-PBGA-B783 | - | 1.26V | - | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | - | - | 64 | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | Non-RoHS Compliant | ||
 MVF30NN151CKU26 NXP USA Inc. | 3941 |
| Datasheet | 15 Weeks | 176-LQFP Exposed Pad | YES | 111 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF3xx | e3 | Active | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.23V | 0.5mm | 40 | MVF30NN151 | S-PQFP-G176 | Not Qualified | 1.26V | 3.3V | 1.16V | 266MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | 16 | YES | YES | NO | YES | - | CORTEX-A5 | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | ROHS3 Compliant | ||
 MPC8572EVJARLE NXP USA Inc. | 480 | - | Datasheet | 18 Weeks | 1023-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC85xx | - | Active | 3 (168 Hours) | - | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | - | MPC8572 | S-PBGA-B1023 | - | 1.155V | - | 1.045V | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.38mm | 33mm | ROHS3 Compliant | ||
 P1013NXN2LFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1013 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 1.067GHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC852TCVR66A NXP USA Inc. | 2500 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MCIMX6U7CVM08AD NXP USA Inc. | 2700 | - | Datasheet | 15 Weeks | 624-LFBGA | YES | 7 | - | - | -40°C~105°C TA | Tray | - | i.MX6DL | - | Active | 3 (168 Hours) | 624 | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | - | YES | - | 64 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | 1.6mm | 21mm | ROHS3 Compliant | ||
MPC8377ECVRALGA NXP USA Inc. | 184 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8377 | - | - | - | - | - | 667MHz | - | PowerPC e300c4s | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | - | Cryptography, Random Number Generator | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
MCIMX6S1AVM08AB NXP USA Inc. | 22 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | - | - | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX6X1AVO08AB NXP USA Inc. | 876 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | 14 | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | - | Active | 3 (168 Hours) | 400 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B400 | - | 1.5V | - | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | 15 | - | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | - | Keypad, LCD | - | - | 1.53mm | 17mm | ROHS3 Compliant | ||
 MPC8306VMADDCA NXP USA Inc. | 7 |
| - | 10 Weeks | 369-LFBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | - | - | - | - | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
 MCIMX357DJQ5C NXP USA Inc. | 200 | - | - | 15 Weeks | 400-LFBGA | YES | 4 | - | Commercial grade | -20°C~70°C TA | Tray | 2002 | i.MX35 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | MCIMX357 | S-PBGA-B400 | Not Qualified | 1.47V | - | 1.33V | 532MHz | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | 24MHz | - | - | - | - | - | - | - | YES | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | - | Keypad, KPP, LCD | - | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MC68360AI25L NXP USA Inc. | 5000 | - | Datasheet | 8 Weeks | 240-BFQFP | YES | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | 40 | MC68360 | S-PQFP-G240 | - | - | - | - | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | - | - | - | - | 32 | - | YES | YES | 32 | - | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | 68000 | - | 1.25 MBps | - | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | - | - | - | ROHS3 Compliant | ||
 MVF60NS151CMK50 NXP USA Inc. | 416 |
| Datasheet | 15 Weeks | 364-LFBGA | YES | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | 16 | YES | YES | NO | YES | 16 | - | - | - | 16 | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | 17mm | ROHS3 Compliant | ||
MCIMX6U6AVM08AB NXP USA Inc. | 39 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DL | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MPC8245LVV333D NXP USA Inc. | 5000 |
| Datasheet | 12 Weeks | 352-LBGA | YES | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 2.2V | 23.3V | 1.9V | 333MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | 1.65mm | 35mm | ROHS3 Compliant | ||
 MCIMX6Q5EYM10ADR NXP USA Inc. | 2600 |
| Datasheet | 15 Weeks | 624-LFBGA, FCBGA | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
 MPC8248CVRTIEA NXP USA Inc. | 10 | - | Datasheet | 12 Weeks | 516-BBGA | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8248 | - | - | - | - | - | 400MHz | - | PowerPC G2_LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC8347EVVAJFB NXP USA Inc. | 4 | - | Datasheet | 12 Weeks | 672-LBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | - | 1.26V | 1.22.53.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant |