- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8541EVTAPF NXP USA Inc. | 154 | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8541 | R-PBGA-B783 | - | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | - | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | - | Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
 P1022NXE2LFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1022 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 1.055GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | Security; SEC | - | Cryptography, Random Number Generator | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX534AVV8C NXP USA Inc. | 4657 | - | - | 15 Weeks | 529-FBGA | YES | - | Automotive grade | -40°C~125°C TJ | Tray | 2008 | i.MX53 | - | Active | 3 (168 Hours) | 529 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | NOT SPECIFIED | MCIMX534 | S-PBGA-B529 | Not Qualified | 1.15V | 1.11.31.8/3.3V | 1.05V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 27MHz | 32 | 26 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | YES | - | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | 1.85mm | 19mm | ROHS3 Compliant | ||
 MC9328MXLVM15 NXP USA Inc. | 213 | - | Datasheet | 26 Weeks | 256-LFBGA | YES | - | - | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | - | 40 | MC9328MXL | S-PBGA-B256 | - | 1.9V | - | 1.7V | 150MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | - | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD | - | 1.6mm | 14mm | ROHS3 Compliant | ||
P1021NXN2HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1021 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Communications; QUICC Engine | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX6S8DVM10AB NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6S | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 26 | YES | YES | - | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MPC8313EVRAFFC NXP USA Inc. | 10000 |
| Datasheet | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | S-PBGA-B516 | - | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | Security; SEC 2.2 | - | Cryptography | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 MPC870VR66 NXP USA Inc. | 300 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC870 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC855TVR50D4 NXP USA Inc. | 2108 | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 P2041NXN7NNC NXP USA Inc. | 860 | - | Datasheet | 12 Weeks | 780-BFBGA | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | - | - | 245 | - | - | - | 30 | P2041 | - | - | - | - | - | 1.3GHz | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
MPC8548VJAQGD NXP USA Inc. | 2240 |
| Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Active | 3 (168 Hours) | 783 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | - | 40 | MPC8548 | S-PBGA-B783 | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | 3.38mm | 29mm | ROHS3 Compliant | ||
 MCIMX353DJQ5C NXP USA Inc. | 1002 | - | - | 15 Weeks | 400-LFBGA | YES | 4 | - | -20°C~70°C TA | Tray | 2008 | i.MX35 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | MCIMX353 | S-PBGA-B400 | Not Qualified | 1.47V | - | 1.33V | 532MHz | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | 24MHz | - | - | YES | - | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MPC8360EVVAGDGA NXP USA Inc. | 15 | - | Datasheet | 12 Weeks | 740-LBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8360 | S-PBGA-B740 | - | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | 1.69mm | 37.5mm | ROHS3 Compliant | ||
MPC8360EVVAJDGA NXP USA Inc. | 3600 | - | Datasheet | 12 Weeks | 740-LBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | S-PBGA-B740 | - | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | 1.69mm | 37.5mm | ROHS3 Compliant | ||
 P1010NSE5HHB NXP USA Inc. | 555 | - | Datasheet | 12 Weeks | 425-FBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | Active | 3 (168 Hours) | 425 | - | - | 8542.31.00.01 | - | - | - | 1V | - | - | - | P1010 | - | - | - | 1V | - | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.4 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 MIMX8MQ6CVAHZAA NXP USA Inc. | 19 |
| Datasheet | 16 Weeks | 621-FBGA, FCBGA | YES | 16 | - | -40°C~105°C TJ | Tray | - | i.MX8MQ | - | Not For New Designs | 3 (168 Hours) | 621 | - | - | - | BOTTOM | BALL | 260 | 1V | 0.65mm | compliant | NOT SPECIFIED | - | S-PBGA-B621 | - | 1.05V | - | 0.9V | 1.3GHz | - | ARM® Cortex®-A53 | 40MHz | - | - | YES | - | - | - | - | - | 160K | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | - | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | 2.18mm | 17mm | RoHS Compliant | ||
 MC68302EH25C NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 132-BQFP Bumpered | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | 3A991.A.2 | - | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | - | 5V | - | - | - | MC68302 | - | - | 5.5V | - | 4.5V | 25MHz | MICROPROCESSOR CIRCUIT | M68000 | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6DP4AVT1AA NXP USA Inc. | 1 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | 26 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
MPC860PZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MCIMX6S5EVM10ACR NXP USA Inc. | 500 |
| Datasheet | 15 Weeks | 624-LFBGA | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | ROHS3 Compliant |