- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC885CVR133 NXP USA Inc. | 3000 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MCIMX233DJM4C NXP USA Inc. | 5 |
| Datasheet | 15 Weeks | 169-LFBGA | YES | 95 | - | -10°C~70°C TA | Tray | 2004 | i.MX23 | - | yes | Active | 3 (168 Hours) | 169 | - | - | - | BOTTOM | BALL | - | 1.35V | 0.8mm | - | MCIMX233 | S-PBGA-B169 | 1.55V | - | 1V | 454MHz | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | 24MHz | - | - | YES | - | 16 | - | - | 32768 | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | Cryptography, Hardware ID | LCD, Touchscreen | - | 1.43mm | 11mm | ROHS3 Compliant | ||
 MCIMX6X2EVN10AB NXP USA Inc. | 656 | - | Datasheet | 15 Weeks | 400-LFBGA | YES | 179 | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B400 | 1.5V | - | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | - | 15 | YES | - | 32 | - | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | ROHS3 Compliant | ||
 P4080NSN7PNC NXP USA Inc. | 108 | - | Datasheet | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P4080 | S-PBGA-B1295 | 1.05V | - | 0.95V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | - | 32 | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 MCIMX535DVV2C NXP USA Inc. | In Stock | - | - | 15 Weeks | 529-FBGA | YES | - | - | -20°C~85°C TC | Tray | 2008 | i.MX53 | e2 | - | Not For New Designs | 3 (168 Hours) | 529 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX535 | S-PBGA-B529 | 1.4V | - | 1.3V | 1.2GHz | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | 1.85mm | 19mm | ROHS3 Compliant | ||
 MCIMX6U5EVM10AD NXP USA Inc. | 891 | - | Datasheet | 15 Weeks | 624-LFBGA | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6DL | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
MPC860SRZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 T1042NSN7MQB NXP USA Inc. | 2706 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | - | 0°C~105°C TA | Bulk | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | 1.03V | - | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||
P3041NSN7PNC NXP USA Inc. | 202 |
| Datasheet | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.04V | - | 0.96V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | - | - | YES | YES | - | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||
MPC880VR133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC880 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 P1020NSE2HFB NXP USA Inc. | 10486 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | P1020 | S-PBGA-B689 | 1.05V | 1V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
P1011NSN2DFB NXP USA Inc. | 2419 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1011 | S-PBGA-B689 | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8315CVRAGDA NXP USA Inc. | 4 |
| Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | - | - | - | - | SATA 3Gbps (2) | 2.46mm | 29mm | ROHS3 Compliant | ||
 MCIMX6L8DVN10AA NXP USA Inc. | 7 |
| Datasheet | - | 432-TFBGA | - | - | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | - | Not For New Designs | 3 (168 Hours) | - | 5A992 | TIN SILVER COPPER | 8542.31.00.01 | - | - | 260 | - | - | 40 | MCIMX6 | - | - | - | - | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
MPC885VR133 NXP USA Inc. | 1921 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MC9328MX21SVM NXP USA Inc. | 3600 | - | - | 10 Weeks | 289-LFBGA | YES | - | - | 0°C~70°C TA | Tray | 1994 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | 40 | MC9328MX21 | S-PBGA-B289 | 1.65V | - | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | Keypad, LCD | - | 1.5mm | 17mm | ROHS3 Compliant | ||
MCIMX6U1AVM08AC NXP USA Inc. | 26 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DL | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | - | S-PBGA-B624 | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MPC8543VJANGD NXP USA Inc. | 2279 |
| Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | MPC8543 | S-PBGA-B783 | - | 1.11.8/2.52.5/3.3V | - | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | - | 32 | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC8572EVJAVNE NXP USA Inc. | 102 | - | Datasheet | 18 Weeks | 1023-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Box | 1998 | MPC85xx | e2 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | MPC8572 | S-PBGA-B1023 | 1.155V | - | 1.045V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.38mm | 33mm | ROHS3 Compliant | ||
 MPC8308CVMAFDA NXP USA Inc. | 5880 | - | - | 10 Weeks | 473-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | 40 | MPC8308 | S-PBGA-B473 | - | - | - | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | ROHS3 Compliant |