- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8270CVVQLDA NXP USA Inc. | 2687 | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | - | - | - | - | 32 | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant | ||
 MPC8347CVRAGDB NXP USA Inc. | 47 |
| Datasheet | 12 Weeks | 620-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | - | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 LS1046ASN8T1A NXP USA Inc. | 2606 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1.8GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | 14 | YES | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
 P4080NSE7PNAC NXP USA Inc. | 304 | - | Datasheet | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P4080 | S-PBGA-B1295 | - | 1.05V | - | 0.95V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | - | - | - | - | - | 32 | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | Security; SEC 4.0 | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 P2020NSN2KFC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX6G2AVM05AA NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | 289-LFBGA | YES | 131 | - | -40°C~125°C TJ | Tray | 2013 | i.MX6UL | - | Obsolete | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B289 | - | 1.3V | - | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 528MHz | - | - | - | - | - | 16 | YES | - | 16 | - | - | 32000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | 9 | Multimedia; NEON™ SIMD | - | CAN, ETHERNET, I2C, I2S, SPI, UART, USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | 1.32mm | 14mm | ROHS3 Compliant | ||
 MPC5200CVR400 NXP USA Inc. | 5105 | - | Datasheet | 10 Weeks | 272-BBGA | YES | - | - | -40°C~85°C TA | Tray | 2003 | MPC52xx | e1 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | PC5200 | S-PBGA-B272 | - | 1.58V | - | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 35MHz | - | - | - | - | - | 13 | YES | YES | 32 | FIXED POINT | YES | - | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | - | - | 2.65mm | 27mm | ROHS3 Compliant | ||
 MPC8309VMAGDCA NXP USA Inc. | 217 |
| - | 10 Weeks | 489-LFBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 489 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8309 | S-PBGA-B489 | - | 1.05V | 1V | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
P2020NXE2KFC NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | - | 1.05V | - | 1.2GHz | MICROPROCESSOR | PowerPC e500v2 | - | 32 | - | - | - | - | - | YES | - | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8349EVVALFB NXP USA Inc. | 2745 | - | - | 12 Weeks | 672-LBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | - | 1.26V | 1.22.5/3.3V | 1.14V | 667MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | Cryptography, Random Number Generator | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
 LS1043ASN7QQB NXP USA Inc. | 73 |
| Datasheet | 18 Weeks | 621-FBGA, FCBGA | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 MPC8247ZQTIEA NXP USA Inc. | 50 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | - | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | - | 30 | - | - | 64 | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | 27mm | Non-RoHS Compliant | ||
MPC8314CVRAGDA NXP USA Inc. | 200 |
| Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | - | 1.05V | 13.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | - | - | - | - | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MPC8569EVJAUNLB NXP USA Inc. | 640 | - | Datasheet | 26 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e1 | Last Time Buy | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | - | S-PBGA-B783 | - | 1.133V | 12.5/3.3V | 1.067V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | - | - | - | - | 16 | YES | YES | 64 | FLOATING POINT | YES | - | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | 3.94mm | 29mm | ROHS3 Compliant | ||
 MPC8245LZU300D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 352-LBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 2.1V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | 1.65mm | 35mm | Non-RoHS Compliant | ||
 MPC860ENCZQ50D4 NXP USA Inc. | 149 | - | Datasheet | - | 357-BBGA | YES | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MVF60NN151CMK40 NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 400MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | 16 | YES | YES | NO | YES | 16 | - | - | 16 | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | 17mm | ROHS3 Compliant | ||
 MC7448HX1400ND NXP USA Inc. | 2184 |
| Datasheet | 12 Weeks | 360-BCBGA, FCCBGA | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.15V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | - | 1.2V | 1.31.8/2.5V | 1.1V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1400MHz | 32 | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | - | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | 2.8mm | 25mm | Non-RoHS Compliant | ||
 MCIMX6X2AVN08AB NXP USA Inc. | 1000 |
| Datasheet | 26 Weeks | 400-LFBGA | YES | 14 | - | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B400 | - | 1.5V | - | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | 15 | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 2 | Multimedia; NEON™ MPE | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | ROHS3 Compliant | ||
 MPC8308VMADDA NXP USA Inc. | 149 |
| - | 10 Weeks | 473-LFBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | 40 | MPC8308 | S-PBGA-B473 | - | - | - | - | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |