- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Data Bus Width (bit) | Data Cache Size | ECCN (US) | Family Name | HTS | I/O Voltage (V) | I2C | I2S | Ihs Manufacturer | Instruction Cache Size | Instruction Set Architecture | Interface Type | Lead Shape | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature (°C) | Maximum Speed (MHz) | Memory Card Interface | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | Multiply Accumulate | Number of CPU Cores | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | PCB changed | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage (V) | UART | Usage Level | USART | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Seated Height-Max | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | SPI | CAN | Device Core | Height Seated (Max) | Length | Width | RoHS Status |
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 KMPC8379CVRALG NXP USA Inc. | In Stock | - | Datasheet | - | 689-BBGA Exposed Pad | - | 689-TEPBGA II (31x31) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2012 | MPC83xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8379 | - | - | - | - | - | 667MHz | - | PowerPC e300c4s | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | SATA 3Gbps (4) | - | - | - | - | - | - | ROHS3 Compliant | ||
 P5010NXE7TNB NXP USA Inc. | In Stock | - | - | 18 Weeks | 1295-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Bulk | 2002 | QorIQ P5 | e1 | Last Time Buy | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.1V | 1mm | - | 30 | - | - | S-PBGA-B1295 | 1.15V | - | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (5), 10Gbps (1) | 1 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 4.2 | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | SATA 3Gbps (2) | - | - | - | 3.53mm | 37.5mm | - | ROHS3 Compliant | ||
 LS102MASE7BFA NXP USA Inc. | In Stock | - | - | - | 448-FBGA Exposed Pad | - | 448-PBGA w/Heat Spreader (23x23) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | - | QorlQ LS1 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 650MHz | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | GbE (2) | 2 Core 32-Bit | No | DDR2 | USB 2.0 + PHY (1) | I2C, PCIe, PCM/TDM, SPI, UART | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC5200VR400B NXP USA Inc. | 16003 | - | Datasheet | - | 272-BBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2003 | MPC52xx | e1 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | PC5200 | - | S-PBGA-B272 | 1.58V | - | 1.42V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | - | - | - | 2.65mm | 27mm | - | ROHS3 Compliant | ||
 MCIMX6Z0DVM09AB NXP USA Inc. | 760 | - | Datasheet | 18 Weeks | 289-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Commercial grade | - | 0°C~95°C TJ | Tray | - | i.MX6 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 900MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB | Multimedia; NEON™ SIMD | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Keypad | - | - | - | - | - | - | - | - | ||
 MCIMX7S3EVK08SC NXP USA Inc. | 241 | - | Datasheet | 17 Weeks | 488-TFBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2012 | i.MX7S | - | Active | 3 (168 Hours) | 488 | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.4mm | - | 40 | - | - | S-PBGA-B488 | 1.155V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | - | 16 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | - | 1.1mm | 12mm | - | ROHS3 Compliant | ||
MPC5200VR400 NXP USA Inc. | 1000 |
| Datasheet | 10 Weeks | 272-BBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2003 | MPC52xx | e1 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | PC5200 | - | S-PBGA-B272 | 1.58V | - | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | - | - | - | 13 | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | - | - | - | 2.65mm | 27mm | - | ROHS3 Compliant | ||
 LS1020ASE7HNB NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 525 | 5A002.A.1 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | - | - | S-PBGA-B525 | 1.03V | - | 0.97V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | - | 16 | - | YES | YES | 32 | FLOATING POINT | YES | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | Multimedia; NEON™ SIMD | - | Secure Boot, TrustZone® | - | SATA 3Gbps (1) | - | - | - | 2.07mm | 19mm | - | ROHS3 Compliant | ||
MCIMX6Y2CVM08AB NXP USA Inc. | 2607 | - | Datasheet | 18 Weeks | 289-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TJ | Tray | 2015 | i.MX6 | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | - | 260 | - | - | - | - | - | - | - | - | - | - | 792MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX7U5DVK07SC NXP USA Inc. | 7 | - | Datasheet | 16 Weeks | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~95°C | - | - | i.MX7ULP | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 720MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 (2) | FlexIO, GPIO, I2C, I2S, SPI, UART | ARM® Cortex®-M4 | - | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | MIPI-DSI | - | - | - | - | - | - | - | - | ||
MCIMX7U5DVP07SC NXP USA Inc. | 20000 | - | Datasheet | 16 Weeks | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Commercial grade | - | 0°C~95°C | - | - | i.MX7ULP | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 720MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 (2) | FlexIO, GPIO, I2C, I2S, SPI, UART | ARM® Cortex®-M4 | - | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | MIPI-DSI | - | - | - | - | - | - | - | - | ||
 MCIMX6D6AVT08AC NXP USA Inc. | 500 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | 2.16mm | 21mm | - | ROHS3 Compliant | ||
P5040NXE7VNC NXP USA Inc. | In Stock | - | - | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2012 | QorIQ P5 | e1 | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.1V | 1mm | - | 30 | - | - | S-PBGA-B1295 | 1.15V | - | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | 1.0V 1.1V | 1Gbps (10), 10Gbps (2) | 4 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | - | 3.53mm | 37.5mm | - | ROHS3 Compliant | ||
 MC68HC001EI12 NXP USA Inc. | In Stock | - | Datasheet | - | 68-LCC (J-Lead) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tube | 1995 | M680x0 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | MC68HC001 | - | - | - | - | - | 12MHz | - | EC000 | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
SAF1504ABS/V1S,118 NXP USA Inc. | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 MCIMX255AVM4 NXP USA Inc. | In Stock | - | - | - | 400-LFBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2002 | i.MX25 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | MCIMX255 | - | - | - | - | - | 400MHz | - | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad, LCD, Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LS1043ASN7MNLA NXP Semiconductors | In Stock | - | - | - | - | YES | - | 621 | 100 MHz | 64 | 32KB | 3A991.a.1 | QorIQ LS1043A | 8542.31.00.01 | - | 4 | 0 | NXP SEMICONDUCTORS | 32KB | RISC | Ethernet/I2C/SPI/UART/USB | - | NXP Semiconductors | LS1043ASN7MNLA | 105 | 1200 | SD/MMC | 0 | 3 | Surface Mount | No | 4 | - | PLASTIC/EPOXY | HBGA | 21 X 21 MM, 2.07 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FCBGA-621 | 1.62 | 21 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 21 | Obsolete | 621 | NOT SPECIFIED | 5.66 | Yes | - | FBGA | 0.93 V | 0.87 V | 0.9 V | - | 8 | - | 0 | - | Tray | - | - | - | Obsolete | - | - | 3A991.A.1 | - | - | 8542.31.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | - | 0.8 mm | compliant | - | - | 621 | S-PBGA-B621 | - | - | - | 1200 MHz | MICROPROCESSOR, RISC | - | - | 32 | 2.07 mm | 16 | ARM | YES | YES | 32 | FIXED POINT | YES | - | 0 | - | - | - | 3 | - | - | - | - | - | - | 4 | 0 | ARM Cortex A53 | - | 21 mm | 21 mm | RoHS Compliant | ||
 LS1023ASE8KQA NXP Semiconductors | In Stock | - | - | - | - | YES | - | 780 | 1400 MHz | 64 | 32KB | 5A002.a.1 | QorIQ LS1023A | 8542.31.00.01 | - | 4 | 0 | NXP SEMICONDUCTORS | 32KB | RISC | Ethernet/I2C/SPI/UART/USB | - | NXP Semiconductors | LS1023ASE8KQA | 105 | 1000 | SD/MMC | 0 | - | Surface Mount | No | 2 | 105 °C | PLASTIC/EPOXY | FBGA | FBGA, | 1.62 | 23 | SQUARE | GRID ARRAY, FINE PITCH | 23 | Active | 780 | - | 5.73 | - | - | FBGA | 0.93 V | 0.87 V | 0.9 V | - | 8 | - | 0 | - | Tray | - | - | - | Active | - | - | - | - | ALSO OPERATES AT 1V SUPPLY NOM | - | CMOS | BOTTOM | BALL | - | - | 0.8 mm | unknown | - | - | 780 | S-PBGA-B780 | - | OTHER | - | - | - | - | - | - | 2.07 mm | 14 | ARM | YES | - | 32 | - | - | - | 6 | - | - | - | 3 | - | - | ETHERNET, I2C, PCI, SATA, SPI, UART, USB | - | - | - | 4 | 0 | ARM Cortex A53 | - | 23 mm | 23 mm | RoHS Compliant | ||
 XPC823EZT66B2 NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | 32 | - | 3A991 | PowerPC MPC8xx Processor | - | 3.3 | - | - | - | - | RISC | - | Ball | - | - | - | 66 | - | - | - | Surface Mount | - | 1 | - | - | - | - | 1.65(Max) | 23 | - | - | 23 | - | 256 | - | - | - | BGA | BGA | - | - | - | 3.3 | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PowerPC | - | - | - | RoHS non-compliant | ||
 MPC8247CVRPIEA NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2004 | MPC82xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8247 | - | - | - | - | - | 300MHz | - | PowerPC G2_LE | - | - | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |