- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 P2010NSN2HFC NXP USA Inc. | 63 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | - | 1.1V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | - | 16 | YES | YES | 64 | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX6Q6AVT08AC NXP USA Inc. | 502 |
| Datasheet | - | 624-FBGA, FCBGA | YES | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MCIMX6L2DVN10AB NXP USA Inc. | 800 |
| Datasheet | 15 Weeks | 432-TFBGA | YES | 162 | 0°C~95°C TJ | Tray | 2011 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | - | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.1mm | 13mm | ROHS3 Compliant | ||
P1021NXE2HFB NXP USA Inc. | 2616 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine, Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8245LZU350D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 352-LBGA | YES | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 2.2V | 23.3V | 1.9V | 350MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | 1.65mm | 35mm | Non-RoHS Compliant | ||
 MPC8309CVMAHFCA NXP USA Inc. | 25 | - | - | 10 Weeks | 489-LFBGA | YES | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 489 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8309 | S-PBGA-B489 | - | 1.05V | 1V | 0.95V | 417MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | Communications; QUICC Engine | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
P1021NSE2HFB NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine, Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC860SRVR50D4 NXP USA Inc. | 125 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MC9328MX21SVK NXP USA Inc. | 10000 | - | - | 10 Weeks | 289-LFBGA | YES | - | 0°C~70°C TA | Tray | 1994 | i.MX21 | e1 | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | 40 | MC9328MX21 | S-PBGA-B289 | - | 1.65V | - | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | Keypad, LCD | - | 1.49mm | 14mm | ROHS3 Compliant | ||
MPC8377EVRAJFA NXP USA Inc. | 41 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 533MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | - | Cryptography, Random Number Generator | - | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC875CVR133 NXP USA Inc. | 200 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8541EPXAPF NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8541 | R-PBGA-B783 | - | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.75mm | 29mm | Non-RoHS Compliant | ||
MPC852TCVR100A NXP USA Inc. | 76 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | -40°C~100°C TA | Tray | 2004 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | - | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8260ACZUMHBB NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | - | 2.2V | - | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MC68EN360AI25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 240-BFQFP | YES | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | 40 | MC68EN360 | S-PQFP-G240 | - | - | - | - | 25MHz | RISC MICROCONTROLLER | CPU32+ | - | - | - | - | - | - | - | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6X4CVM08AB NXP USA Inc. | 5000 | - | Datasheet | 15 Weeks | 529-LFBGA | YES | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | - | Active | 3 (168 Hours) | 529 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | S-PBGA-B529 | - | 1.5V | - | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | 16 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | 1.5mm | 19mm | ROHS3 Compliant | ||
MPC8255ACZUMHBB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8255 | S-PBGA-B480 | - | 2.2V | - | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MCIMX27MOP4A NXP USA Inc. | 32 |
| Datasheet | - | 473-LFBGA | YES | - | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | Not Qualified | 1.52V | - | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | 26 | YES | YES | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | 1.54mm | 19mm | ROHS3 Compliant | ||
MPC860DEZQ50D4R2 NXP USA Inc. | 191 | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MPC8377CVRANGA NXP USA Inc. | 2443 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | MPC8377 | S-PBGA-B689 | - | 1.1V | 1.051.8/2.52.5/3.3V | 1V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant |