- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC860TVR66D4 NXP USA Inc. | 5200 |
| Datasheet | 12 Weeks | 357-BBGA | YES | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 P5020NXN7QMB NXP USA Inc. | In Stock | - | - | 26 Weeks | 1295-BBGA, FCBGA | YES | - | -40°C~105°C TA | Tray | 2002 | QorIQ P5 | e1 | Last Time Buy | 3 (168 Hours) | - | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | - | S-PBGA-B1295 | 1.15V | - | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (5), 10Gbps (1) | 2 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | SATA 3Gbps (2) | - | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 MCIMX6U4AVM10AD NXP USA Inc. | 40 | - | Datasheet | 14 Weeks | 624-LFBGA | - | - | -40°C~125°C TJ | Tray | - | i.MX6DL | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | - | - | - | ROHS3 Compliant | ||
 MC68340CAB16E NXP USA Inc. | 9999 |
| Datasheet | 8 Weeks | 144-BQFP | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | 16MHz | - | CPU32 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68MH360AI25L NXP USA Inc. | In Stock | - | Datasheet | - | 240-BFQFP | YES | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Obsolete | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68MH360 | S-PQFP-G240 | 5.25V | - | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | 32 | YES | YES | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 4.15mm | 31.305mm | ROHS3 Compliant | ||
MC68MH360AI25VL NXP USA Inc. | In Stock | - | Datasheet | - | 240-BFQFP | YES | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Obsolete | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68MH360 | S-PQFP-G240 | 5.25V | - | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | 32 | YES | YES | 32 | - | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 4.15mm | 31.305mm | ROHS3 Compliant | ||
 MC68EC030FE25C NXP USA Inc. | 9 | - | Datasheet | - | 132-BCQFP | - | 132-CQFP (24x24) | 0°C~70°C TA | Tray | 1997 | M680x0 | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68EC030 | - | - | - | - | 25MHz | - | 68030 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 MPC8548VUATG NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | - | - | 0°C~105°C TA | Tray | - | MPC85xx | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MPC8548 | - | - | - | - | 1.2GHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 MPC8358EVVAGDG NXP USA Inc. | In Stock | - | Datasheet | - | 740-LBGA | YES | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | Obsolete | 1 (Unlimited) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B740 | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | 1.69mm | 37.5mm | ROHS3 Compliant | ||
 MCIMX6Y2CVM05ABR NXP USA Inc. | 5000 |
| Datasheet | 18 Weeks | 289-LFBGA | - | - | -40°C~105°C TJ | Tape & Reel (TR) | - | i.MX6Y | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR3, DDR3L, LPDDR2 | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | - | Electrophoretic, LCD | - | - | - | - | - | ROHS3 Compliant | ||
MCIMX6G2CVM05ABR NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 289-LFBGA | - | - | -40°C~105°C TJ | Tape & Reel (TR) | - | i.MX6G | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L, LPDDR2 | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LCD, LVDS | - | - | - | - | - | ROHS3 Compliant | ||
MCIMX6G1AVM05ABR NXP USA Inc. | 7 |
| Datasheet | 2 Weeks | 289-LFBGA | - | - | -40°C~125°C TJ | Tape & Reel (TR) | - | i.MX6G | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR3, DDR3L, LPDDR2 | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LVDS | - | - | - | - | - | ROHS3 Compliant | ||
 G4860NXN7QUMD NXP USA Inc. | 562 | - | - | 20 Weeks | 1020-BBGA, FCBGA | - | - | -40°C~105°C TA | - | 2002 | QorIQ Qonverge B | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | PowerPC e6500 | - | - | - | - | - | - | - | - | 1V 1.2V 1.35V 1.5V 1.8V 2.5V | 1/2.5Gbps (4), 1/2.5/10Gbps (2) | 4 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 (1) | I2C, MMC/SD, RapidIO, SPI, UART | Signal Processing; SC3900FP FVP - 6 Core | - | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MIMX8MN3CVTIZAA NXP USA Inc. | 152 | - | Datasheet | 2 Weeks | 486-LFBGA | - | - | -40°C~105°C TJ | - | - | i.MX8MN | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | GbE | 1 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M7 | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | - | LCD, MIPI-CSI, MIPI-DSI | - | - | - | - | - | ROHS3 Compliant | ||
 MC68340FT16E NXP USA Inc. | In Stock | - | Datasheet | - | 144-BQFP | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Obsolete | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | 16MHz | - | CPU32 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68340PV16VE NXP USA Inc. | In Stock | - | Datasheet | - | 144-LQFP | - | - | 0°C~70°C TA | Tray | - | M683xx | - | Obsolete | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | 16MHz | - | CPU32 | - | - | - | - | - | - | - | - | 3.3V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XPC850ZT66BU NXP USA Inc. | In Stock | - | Datasheet | - | 256-BGA | - | - | 0°C~95°C TA | Tray | 2004 | MPC8xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | PC850 | - | - | - | - | 66MHz | - | - | - | - | - | - | - | - | - | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
MPC8360EZUAGDG NXP USA Inc. | In Stock | - | Datasheet | - | 740-LBGA | YES | - | 0°C~105°C TA | Tray | 2006 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.26V | - | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | 1.69mm | 37.5mm | Non-RoHS Compliant | ||
MPC8360CVVAGDG NXP USA Inc. | In Stock | - | Datasheet | - | 740-LBGA | YES | - | -40°C~105°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.69mm | 37.5mm | ROHS3 Compliant | ||
MPC8360VVAGDG NXP USA Inc. | In Stock | - | Datasheet | - | 740-LBGA | YES | - | 0°C~105°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.69mm | 37.5mm | ROHS3 Compliant |