- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature (Max.) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC68360CAI25L NXP USA Inc. | 800 | - | Datasheet | - | 240-BFQFP | YES | - | - | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | 40 | MC68360 | S-PQFP-G240 | - | - | - | - | - | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | - | - | - | - | 32 | - | YES | YES | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | 68000 | - | 1.25 MBps | - | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | - | - | - | - | ROHS3 Compliant | ||
 MPC8280VVUPEA NXP USA Inc. | 2577 |
| Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | - | 1.6V | 1.53.3V | - | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 32 | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | ROHS3 Compliant | ||
 MCIMX6U6AVM10AC NXP USA Inc. | 8 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2017 | i.MX6DL | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | - | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | 1.6mm | 21mm | - | ROHS3 Compliant | ||
 MPC8360CVVAJDGA NXP USA Inc. | 105 | - | Datasheet | 12 Weeks | 740-LBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | - | 1.35V | 1.8/2.53.3V | - | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.69mm | 37.5mm | - | ROHS3 Compliant | ||
 MPC8358EVRAGDDA NXP USA Inc. | 77 |
| Datasheet | 12 Weeks | 668-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | - | 1.26V | 1.21.8/2.52.5/3.3V | - | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 29mm | - | ROHS3 Compliant | ||
 MPC8247ZQMIBA NXP USA Inc. | 189 | - | Datasheet | 12 Weeks | 516-BBGA | YES | - | 57 | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | - | 1.575V | 1.53.3V | - | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | - | 30 | - | - | - | 64 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | 27mm | - | Non-RoHS Compliant | ||
 MCIMX6D6AVT10AC NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | - | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | 2.16mm | 21mm | - | ROHS3 Compliant | ||
 MCIMX7D2DVK12SC NXP USA Inc. | 40 | - | Datasheet | 18 Weeks | 488-TFBGA | YES | - | - | - | - | 0°C~85°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 488 | - | - | - | BOTTOM | BALL | 260 | 1.225V | 0.4mm | 40 | - | S-PBGA-B488 | - | 1.25V | - | - | 1.2V | 1.2GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | - | - | - | - | 26 | - | YES | YES | 16 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | - | Keypad, LCD, MIPI | - | - | 1.1mm | 12mm | - | ROHS3 Compliant | ||
 MPC8313VRAGDC NXP USA Inc. | 40 | - | - | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | 105°C | - | - | Tray | 2002 | - | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | Not Qualified | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | 400 MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | 15 | - | YES | YES | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
 T1042NXE7WQB NXP USA Inc. | 2536 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | - | 2014 | QorIQ T1 | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | - | 1.03V | - | - | 0.97V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | - | ROHS3 Compliant | ||
 MVF50NN151CMK50 NXP USA Inc. | 450 | - | Datasheet | 15 Weeks | 364-LFBGA | YES | - | 131 | - | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF50NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | - | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | - | - | 16 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | 17mm | - | ROHS3 Compliant | ||
MPC8313VRAFFB NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA Exposed Pad | - | 516-TEPBGA (27x27) | - | - | - | 0°C~105°C TA | Tray | 2008 | MPC83xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8313 | - | - | - | - | - | - | 333MHz | - | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC860TZQ50D4 NXP USA Inc. | 4250 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | - | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | Non-RoHS Compliant | ||
 MC9328MX21CVK NXP USA Inc. | 45 | - | - | 15 Weeks | 289-LFBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2006 | i.MX21 | e1 | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | 40 | MC9328MX21 | S-PBGA-B289 | - | 1.65V | - | - | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | - | - | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | Keypad, LCD | - | - | 1.49mm | 14mm | - | ROHS3 Compliant | ||
 MCIMX6D5EYM10ADR NXP USA Inc. | 1200 | - | Datasheet | 15 Weeks | 624-LFBGA, FCBGA | - | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2011 | i.MX6D | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | ROHS3 Compliant | ||
MPC8280CZUUPEA NXP USA Inc. | 198 | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | - | 1.6V | 1.53.3V | - | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 100MHz | 32 | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | Non-RoHS Compliant | ||
MPC8250ACZUMHBC NXP USA Inc. | In Stock | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | - | 2.2V | - | - | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | 32 | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | Non-RoHS Compliant | ||
 P2041NSN7NNC NXP USA Inc. | 2061 | - | Datasheet | 12 Weeks | 780-BBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | Active | 3 (168 Hours) | - | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | - | 245 | - | - | 30 | P2041 | - | - | - | - | - | - | 1.3GHz | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | ROHS3 Compliant | ||
 MPC852TZT50A NXP USA Inc. | 578 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | - | 1.9V | 1.83.3V | - | 1.7V | 50MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | - | - | - | - | - | - | - | 2.54mm | 23mm | - | Non-RoHS Compliant | ||
 MPC8378CVRAGDA NXP USA Inc. | 23 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | - | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | - | - | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | ROHS3 Compliant |