- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6Q4AVT10AD NXP USA Inc. | 48 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | 7 | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | 1.5V | - | 1.35V | 1.0GHz | - | ARM® Cortex®-A9 | - | - | 16 | YES | - | 64 | - | - | 272K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MPC8358ECZQAGDGA NXP USA Inc. | 317 | - | Datasheet | - | 668-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2006 | MPC83xx | e0 | - | Obsolete | 3 (168 Hours) | 668 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | - | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | Non-RoHS Compliant | ||
 MC68LC302AF16CT NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 100-LQFP | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | - | - | 260 | - | - | 40 | MC68LC302 | - | - | - | - | 16MHz | MICROCONTROLLER, RISC | M68000 | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | - | - | - | ROHS3 Compliant | ||
 P1024NSE5DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 561-FBGA | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | 5A002.A.1 | - | 8542.31.00.01 | - | - | 260 | - | - | - | P1024 | - | - | - | - | 667MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | - | - | ROHS3 Compliant | ||
 MPC860DTVR50D4 NXP USA Inc. | 2561 |
| Datasheet | - | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MCIMX6DP5EYM1AB NXP USA Inc. | 2727 |
| Datasheet | 15 Weeks | 624-LFBGA, FCBGA | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
 MPC8270ZUQLDA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MPC8541EVTALF NXP USA Inc. | 27 | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | - | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
MPC8541EVTAJD NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | - | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
 MCIMX6S6AVM08ACR NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | 624-LFBGA | YES | 14 | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | yes | Active | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | 1.5V | - | 1.275V | 800MHz | - | ARM® Cortex®-A9 | - | - | 16 | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 P2020NSE2KFC NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | 32 | YES | YES | 16 | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX6QP5EVT2AA NXP USA Inc. | 7 |
| - | 15 Weeks | 624-FBGA, FCBGA | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6QP | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | - | - | - | ||
 MPC8306SCVMABDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | 369-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 133MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
 MPC875VR66 NXP USA Inc. | 4248 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8347VVAJFB NXP USA Inc. | 2489 |
| Datasheet | 12 Weeks | 672-LBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
MPC8280VVQLDA NXP USA Inc. | 2057 |
| Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant | ||
MPC8306SCVMADDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | 369-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
 MPC8313EVRAFF NXP USA Inc. | 3 | - | Datasheet | - | 516-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Obsolete | 1 (Unlimited) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | - | Cryptography | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 LS1088AXE7Q1A NXP USA Inc. | 2200 |
| Datasheet | 18 Weeks | 780-BFBGA, FCBGA | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 250 | - | - | 30 | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 MC9328MXLVP20 NXP USA Inc. | 100 | - | Datasheet | 26 Weeks | 225-LFBGA | YES | - | - | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | - | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.9V | 0.8mm | 40 | MC9328MXL | S-PBGA-B225 | 2V | - | 1.8V | 200MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | LCD | - | 1.6mm | 13mm | ROHS3 Compliant |