- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Package / Case | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Base Part Number | Speed | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 KMPC8247CVRTIEA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8247 | 400MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8250AVRIHBC NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8250 | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
 KMC68LC302AF25CT NXP USA Inc. | In Stock | - | Datasheet | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Obsolete | 3 (168 Hours) | MC68LC302 | 25MHz | M68000 | 5.0V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | ROHS3 Compliant | ||
 KMPC8250ACZUMHBC NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8250 | 266MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8260AVVPIBB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | PC8260 | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8265ACZUMIBC NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8265 | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8264AZUPIBB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8264 | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8260AVVPJDB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | PC8260 | 300MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8255ACZUMHBB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | PC8255 | 266MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8260ACZUMIBB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | PC8260 | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8264AVVPJDB NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8264 | 300MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8247ZQTMFA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8247 | 400MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8248CZQTIEA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8248 | 400MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | Non-RoHS Compliant | ||
KMPC8270CVVQLDA NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 2A (4 Weeks) | MPC8270 | 333MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
 KMC68EN360ZP33L NXP USA Inc. | In Stock | - | Datasheet | 357-BGA | 0°C~70°C TA | Tray | 1995 | M683xx | Obsolete | 3 (168 Hours) | MC68EN360 | 33MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | Non-RoHS Compliant | ||
KMPC8270VRMIBA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8270 | 266MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8270ZQMIBA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8270 | 266MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant | ||
KMPC8270CVVUPEA NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 2A (4 Weeks) | MPC8270 | 450MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8271CVRTIEA NXP USA Inc. | In Stock | - | Datasheet | 516-BBGA | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | MPC8271 | 400MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | ROHS3 Compliant | ||
KMPC8270ZUUPEA NXP USA Inc. | In Stock | - | Datasheet | 480-LBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 2A (4 Weeks) | MPC8270 | 450MHz | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | Non-RoHS Compliant |