- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC860DECZQ50D4 NXP USA Inc. | 196 | - | Datasheet | - | 357-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | - | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | - | Non-RoHS Compliant | ||
 MPC8347CVVAJFB NXP USA Inc. | 2225 |
| Datasheet | 12 Weeks | 672-LBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | - | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | 1.69mm | 35mm | - | ROHS3 Compliant | ||
MPC885VR66 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | - | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | - | 32 | FIXED POINT | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.52mm | 25mm | - | ROHS3 Compliant | ||
 T1042NXN7PQB NXP USA Inc. | 2533 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2006 | QorIQ T1 | - | Active | 3 (168 Hours) | 780 | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | 1.03V | - | - | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | - | - | - | 16 | YES | YES | - | 64 | FIXED POINT | YES | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | 2.07mm | 23mm | - | ROHS3 Compliant | ||
 MPC8313CVRAGDC NXP USA Inc. | 1834 |
| - | 8 Weeks | 516-BBGA Exposed Pad | YES | - | 105°C | -40°C | - | - | Tray | 2002 | - | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | - | INDUSTRIAL | 0.95V | 400 MHz | MICROPROCESSOR, RISC | - | - | - | - | - | - | 15 | YES | YES | - | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
MPC860DTZQ80D4 NXP USA Inc. | 5 | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | - | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | - | Non-RoHS Compliant | ||
 MPC8315CVRAFDA NXP USA Inc. | 1 | - | Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | - | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | - | - | - | SATA 3Gbps (2) | 2.46mm | 29mm | - | ROHS3 Compliant | ||
 P2020NSN2KHC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | 2.46mm | 31mm | - | ROHS3 Compliant | ||
 MPC8548EVJAVHD NXP USA Inc. | 9500 | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8548 | - | - | - | - | - | 1.5GHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | ROHS3 Compliant | ||
 MPC8280ZUQLDA NXP USA Inc. | 1627 | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | - | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 32 | - | - | - | 32 | YES | YES | - | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | - | Non-RoHS Compliant | ||
MPC8314CVRADDA NXP USA Inc. | 7 |
| Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | - | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | - | - | - | - | 2.46mm | 29mm | - | ROHS3 Compliant | ||
 MCIMX6G3DVM05AB NXP USA Inc. | 760 | - | Datasheet | 15 Weeks | 289-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6UL | - | Active | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B289 | 1.3V | - | - | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | 26 | YES | YES | - | 16 | FIXED POINT | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | 1.32mm | 14mm | - | ROHS3 Compliant | ||
MPC855TZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | - | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | - | Non-RoHS Compliant | ||
 MCIMX351AVM4B NXP USA Inc. | 800 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | 3 | - | - | Automotive grade | -40°C~85°C TA | Tray | 2008 | i.MX35 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX351 | S-PBGA-B400 | 1.47V | - | - | 1.22V | 400MHz | - | ARM1136JF-S | - | - | - | - | - | - | YES | - | AEC-Q100 | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | Multimedia; VFP | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG | Keypad, KPP, LCD | - | 1.6mm | 17mm | - | ROHS3 Compliant | ||
 MPC8272CVRMIBA NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | 1.575V | 1.53.3V | - | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | - | - | - | 64 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | 27mm | - | ROHS3 Compliant | ||
MPC8272VRTMFA NXP USA Inc. | 768 | - | Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | 1.575V | 1.53.3V | - | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | - | - | - | 64 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | ROHS3 Compliant | ||
MPC8260AVVPIBB NXP USA Inc. | 2674 |
| Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 40 | PC8260 | S-PBGA-B480 | 2.7V | - | - | 2.4V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | - | - | - | - | 32 | YES | YES | - | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | - | ROHS3 Compliant | ||
MPC8321VRAFDCA NXP USA Inc. | 228 | - | - | 12 Weeks | 516-BBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | - | S-PBGA-B516 | 1.05V | - | - | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | - | 2.55mm | 27mm | - | ROHS3 Compliant | ||
MPC8271CVRTIEA NXP USA Inc. | 36 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8271 | S-PBGA-B516 | 1.575V | 1.53.3V | - | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | - | - | - | 64 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | 27mm | - | ROHS3 Compliant | ||
 MC68EN360AI33L NXP USA Inc. | 243 | - | Datasheet | - | 240-BFQFP | YES | 46 | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68EN360 | S-PQFP-G240 | 5.25V | - | - | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | - | - | - | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | 4.15mm | 31.305mm | - | ROHS3 Compliant |