- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 P2010NSN2HHC NXP USA Inc. | 2550 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | - | - | - | - | 16 | YES | YES | 64 | FLOATING POINT | YES | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC860SRZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | 357-BBGA | YES | - | 0°C~95°C TA | Tray | 2004 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MPC855TCVR50D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MPC8343CVRAGDB NXP USA Inc. | 47 |
| - | 12 Weeks | 620-BBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 2010 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MPC8540VT833LC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 784-BBGA, FCBGA | YES | - | 0°C~105°C TA | Tray | 2001 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8540 | S-PBGA-B783 | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR | PowerPC e500 | 166MHz | 32 | - | - | - | 64 | YES | YES | 64 | FIXED POINT | YES | 2.5V 3.3V | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | 3.85mm | 29mm | ROHS3 Compliant | ||
 FS32V232BMN1VUB NXP USA Inc. | 2250 | - | - | 22 Weeks | 621-FBGA, FCBGA | YES | - | -40°C~125°C TA | Tray | 2015 | - | - | - | Active | 3 (168 Hours) | 621 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.65mm | 40 | - | S-PBGA-B621 | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53, Cortex®-M4 | - | 64 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V | GbE | 4 Core 64-Bit/1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | - | I2C, SPI, PCI, UART | - | Multimedia; NEON™ MPE | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | - | LCD, Video | - | 2.44mm | 17mm | ROHS3 Compliant | ||
P1012NXE2HFB NXP USA Inc. | 2606 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | - | yes | Active | 3 (168 Hours) | 689 | - | - | - | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1012 | S-PBGA-B689 | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | 16 | YES | YES | 32 | FLOATING POINT | YES | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Communications; QUICC Engine, Security; SEC 3.3 | Cryptography, Random Number Generator | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8275CVRMIBA NXP USA Inc. | 2311 |
| Datasheet | 12 Weeks | 516-BBGA | YES | - | -40°C~105°C TA | Tray | 2004 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8275 | S-PBGA-B516 | 1.6V | 1.53.3V | 1.45V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 266MHz | 32 | - | - | - | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 T1022NSE7MQB NXP USA Inc. | 44 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 0°C~105°C TA | Bulk | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | 1.03V | - | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (5) | 2 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||
 MPC8555EVTAPF NXP USA Inc. | 1514 | - | Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8555 | S-PBGA-B783 | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | - | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | - | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
 P2040NXE7MMC NXP USA Inc. | 600 | - | Datasheet | 12 Weeks | 780-BFBGA | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | yes | Active | 3 (168 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 245 | - | - | 30 | P2040 | - | - | - | - | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 MPC8349EVVAJDB NXP USA Inc. | 2249 |
| - | 12 Weeks | 672-LBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 1.26V | 1.22.5/3.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | Cryptography, Random Number Generator | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
 M68LC302CAF16VCT NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 100-LQFP | YES | - | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.5mm | 40 | M68LC302 | S-PQFP-G100 | - | - | - | 166MHz | SERIAL IO/COMMUNICATION CONTROLLER, LAN | M68000 | 16MHz | - | - | - | - | 24 | YES | NO | 16 | - | - | 3.3V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | 4 | Communications; RISC CPM | - | 1.25 MBps | - | - | 1.7mm | 14mm | ROHS3 Compliant | ||
MPC8555EPXALF NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.26V | - | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | - | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | - | - | - | 3.75mm | 29mm | Non-RoHS Compliant | ||
MPC8315CVRADDA NXP USA Inc. | 40 | - | Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | - | - | - | - | SATA 3Gbps (2) | 2.46mm | 29mm | ROHS3 Compliant | ||
MPC8321ECVRAFDCA NXP USA Inc. | 47 | - | - | 12 Weeks | 516-BBGA | YES | - | -40°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | - | S-PBGA-B516 | 1.05V | - | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 MCIMX6G3DVK05AB NXP USA Inc. | 30 |
| Datasheet | 15 Weeks | 272-LFBGA | YES | - | 0°C~95°C TJ | Tray | 2016 | i.MX6UL | - | - | Active | 3 (168 Hours) | 272 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.5mm | - | - | S-PBGA-B272 | 1.3V | - | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | 26 | YES | YES | 16 | FIXED POINT | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LCD, LVDS | - | 1.23mm | 9mm | ROHS3 Compliant | ||
MPC8271VRTIEA NXP USA Inc. | 300 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8271 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | - | - | 64 | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | 27mm | ROHS3 Compliant | ||
MPC8347ZUAJFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 672-LBGA | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | 3A991.A.2 | - | 8542.31.00.01 | - | - | - | - | - | - | MPC8347 | - | - | - | - | 533MHz | - | PowerPC e300 | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
MPC860DEZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | 0°C~95°C TA | Tray | 2004 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant |