- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6U5EVM10AB NXP USA Inc. | 22 | - | Datasheet | 15 Weeks | 624-LFBGA | YES | - | Commercial grade | -20°C~105°C TJ | Tray | 2002 | i.MX6DL | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | 26 | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX6D6AVT10AD NXP USA Inc. | 9000 | - | Datasheet | 12 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MCIMX280CVM4B NXP USA Inc. | 3966 | - | Datasheet | 15 Weeks | 289-LFBGA | YES | - | - | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | MCIMX280 | S-PBGA-B289 | - | 1.55V | - | 1.35V | 454MHz | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | 24MHz | - | - | - | - | - | - | YES | - | - | - | - | - | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad | - | 1.37mm | 14mm | ROHS3 Compliant | ||
 P2020NXN2KHC NXP USA Inc. | 2521 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | 32 | YES | YES | - | 16 | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
MCIMX6D6AVT08AD NXP USA Inc. | 1140 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MPC8308CVMAGDA NXP USA Inc. | 420 | - | - | 10 Weeks | 473-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 473 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8308 | S-PBGA-B473 | - | 1.05V | - | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | 1.54mm | 19mm | ROHS3 Compliant | ||
 MPC8248VRMIBA NXP USA Inc. | 166 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8248 | S-PBGA-B516 | - | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | NO | 30 | - | - | - | 64 | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM, Security; SEC | FLASH | - | Cryptography, Random Number Generator | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
P2020NXN2MHC NXP USA Inc. | 2978 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 LS1046AXN8T1A NXP USA Inc. | 2851 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | - | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1.8GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | 14 | YES | - | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
 MPC866PVR133A NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC866 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
MCIMX6QP6AVT1AA NXP USA Inc. | 4 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | - | - | 26 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MPC8313CVRAFFC NXP USA Inc. | 416 | - | Datasheet | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | - | 1.5V | - | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
P2020NXN2KFC NXP USA Inc. | 2105 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8548EVJAUJD NXP USA Inc. | 2747 | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | - | MPC8548 | R-PBGA-B783 | - | 1.155V | - | 1.045V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500 | - | 32 | - | - | - | - | 16 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | 3.294mm | 29mm | ROHS3 Compliant | ||
P2020NSN2MHC NXP USA Inc. | 2491 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
P1020NXN2HFB NXP USA Inc. | 500 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~105°C TA | Tray | 2006 | QorIQ P1 | - | Active | 3 (168 Hours) | 689 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | P1020 | S-PBGA-B689 | - | - | 1V | - | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MCIMX6S4AVM08AC NXP USA Inc. | 9800 | - | Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | - | - | - | - | 16 | YES | YES | - | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX357CJQ5C NXP USA Inc. | In Stock | - | - | 15 Weeks | 400-LFBGA | YES | 4 | - | -40°C~85°C TA | Tray | 2005 | i.MX35 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX357 | S-PBGA-B400 | Not Qualified | 1.47V | - | 1.33V | 532MHz | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | 24MHz | - | - | - | - | - | 26 | YES | - | - | 16 | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | - | 1-WIRE; CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MCIMX536AVV8C NXP USA Inc. | 4 | - | - | 15 Weeks | 529-FBGA | YES | - | Automotive grade | -40°C~125°C TJ | Tray | 2008 | i.MX53 | e2 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | MCIMX536 | S-PBGA-B529 | Not Qualified | 1.15V | 1.11.31.8/3.3V | 1.05V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 27MHz | 32 | - | - | - | - | 26 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | YES | - | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | 1.85mm | 19mm | ROHS3 Compliant | ||
 MCIMX6Q5EYM12AD NXP USA Inc. | 889 |
| Datasheet | 15 Weeks | 624-LFBGA, FCBGA | YES | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | 1.2GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | 64 | - | - | - | - | 26 | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant |