- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC68360AI33L NXP USA Inc. | 20 | - | Datasheet | 8 Weeks | 240-BFQFP | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | 40 | MC68360 | S-PQFP-G240 | - | - | - | 33MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | 32 | YES | YES | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | 68000 | - | 1.25 MBps | - | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | - | - | - | ROHS3 Compliant | ||
 MPC8250AVVPIBC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 1.27mm | 40 | MPC8250 | S-PBGA-B480 | - | - | - | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant | ||
 LS1023AXE7QQB NXP USA Inc. | 10 |
| Datasheet | 18 Weeks | 621-FBGA, FCBGA | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 MC9328MXSCVP10 NXP USA Inc. | In Stock | - | Datasheet | - | 225-LFBGA | YES | -40°C~85°C TA | Tray | 1994 | i.MXS | e1 | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 40 | MC9328MXS | S-PBGA-B225 | 1.9V | - | 1.7V | 100MHz | MICROPROCESSOR | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | NO | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, UART | - | - | - | - | LCD | - | - | 1.6mm | 13mm | ROHS3 Compliant | ||
 MPC8347VVAJDB NXP USA Inc. | 414 |
| Datasheet | 12 Weeks | 672-LBGA | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | 8542.31.00.01 | - | - | - | - | - | - | MPC8347 | - | - | - | - | 533MHz | - | PowerPC e300 | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC8378CVRANGA NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 1.051.8/2.52.5/3.3V | 0.95V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MCIMX6G3DVK05AA NXP USA Inc. | 8 | - | Datasheet | 14 Weeks | 272-LFBGA | YES | 0°C~95°C TJ | Tray | 2015 | i.MX6UL | - | Obsolete | 3 (168 Hours) | 272 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.5mm | - | - | S-PBGA-B272 | 1.5V | - | 1.275V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | 16 | YES | YES | 16 | FIXED POINT | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LCD, LVDS | - | - | 1.23mm | 9mm | ROHS3 Compliant | ||
 MPC855TVR66D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | 0°C~95°C TA | Tray | 2002 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MPC8544VTARJA NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | - | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | MPC8544 | S-PBGA-B783 | - | 11.8/2.53.3V | - | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500 | - | 32 | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MPC8548ECPXAUJD NXP USA Inc. | 1 | - | Datasheet | - | 783-BBGA, FCBGA | - | -40°C~105°C TA | Tray | 2009 | MPC85xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8548 | - | - | - | - | 1.333GHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | - | Non-RoHS Compliant | ||
MPC8555EVTAJD NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8555 | S-PBGA-B783 | 1.26V | - | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
MPC8349VVAJFB NXP USA Inc. | In Stock | - | - | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
 MC9328MX21VK NXP USA Inc. | 3600 | - | - | 10 Weeks | 289-LFBGA | YES | 0°C~70°C TA | Tray | 1994 | i.MX21 | e1 | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | 40 | MC9328MX21 | S-PBGA-B289 | 1.65V | - | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | Keypad, LCD | - | - | 1.49mm | 14mm | ROHS3 Compliant | ||
 P1015NSE5DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 561-FBGA | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P1015 | - | - | - | - | 667MHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC8306VMAFDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | 369-LFBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | - | - | - | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, SPI, TDM | Communications; QUICC Engine | - | - | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
MPC8347EVVALFB NXP USA Inc. | 9 | - | Datasheet | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.22.53.3V | 1.14V | 667MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
MPC860SRCVR50D4 NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 P1010NXN5HHA NXP USA Inc. | In Stock | - | Datasheet | - | 425-FBGA | YES | -40°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1010 | S-PBGA-B425 | 1.05V | - | 0.95V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||
 MCIMX6G1AVM07AB NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 289-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6UL | - | Active | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B289 | 1.3V | - | 1.25V | 696MHz | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | 26 | YES | YES | 16 | FIXED POINT | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LVDS | - | - | 1.32mm | 14mm | ROHS3 Compliant | ||
 MC68302AG16C NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 144-LQFP | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC68302 | - | - | - | - | 16MHz | - | M68000 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | - | - | - | - | - | ROHS3 Compliant |