- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
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- Speed
- Core Processor
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Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC885ZP133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MC7448HX1267ND NXP USA Inc. | 2469 | - | Datasheet | 12 Weeks | 360-BCBGA, FCCBGA | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.1V | 1.31.8/2.5V | 1V | 1.267GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1267MHz | 32 | - | - | - | - | NO | YES | - | FIXED POINT | NO | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | 2.8mm | 25mm | Non-RoHS Compliant | ||
 MCIMX6X3CVN08AB NXP USA Inc. | 9 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B400 | 1.5V | - | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | ROHS3 Compliant | ||
MPC860TZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MPC8313CVRAFFB NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA Exposed Pad | - | 516-TEPBGA (27x27) | - | -40°C~105°C TA | Tray | 2006 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8313 | - | - | - | - | 333MHz | - | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | ROHS3 Compliant | ||
 P3041NSE7PNC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.04V | - | 0.96V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 MPC8544VJANGA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | 40 | MPC8544 | - | - | - | - | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | ROHS3 Compliant | ||
 P1012NSN2HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P1012 | - | - | - | - | 800MHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | - | - | - | - | - | ROHS3 Compliant | ||
MPC855TVR80D4 NXP USA Inc. | 44 | - | Datasheet | 13 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MPC870CVR133 NXP USA Inc. | 1500 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC870 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | Communications; CPM | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
P2010NXN2HFC NXP USA Inc. | 2990 |
| Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | - | - | - | - | 32 | YES | YES | 16 | FLOATING POINT | YES | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8321EVRAFDC NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA | YES | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8321 | S-PBGA-B516 | 1.05V | - | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 MPC8347VVAGDB NXP USA Inc. | 2898 |
| Datasheet | 12 Weeks | 620-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
MPC850DECVR66BU NXP USA Inc. | 120 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8306SCVMAFDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | 369-LFBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
MC68EN360VR33L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | - | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | - | - | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | 1.86mm | 25mm | ROHS3 Compliant | ||
MPC860PVR80D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MPC8260AZUPIBB NXP USA Inc. | 2938 |
| Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 2.2V | - | 1.9V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | - | - | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
MPC860SRCVR66D4 NXP USA Inc. | 16 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | - | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MPC8308VMAGD NXP USA Inc. | In Stock | - | - | - | 473-LFBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | 40 | MPC8308 | S-PBGA-B473 | - | - | - | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | ROHS3 Compliant |