- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9328MXLCVM15 NXP USA Inc. | 160 | - | Datasheet | - | 256-LFBGA | - | - | - | - | -40°C~85°C TA | Tray | 1994 | i.MXL | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | 150MHz | - | ARM920T | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD | - | - | - | ROHS3 Compliant | ||
 MC9328MXLDVP15 NXP USA Inc. | 1162 |
| Datasheet | 26 Weeks | 225-LFBGA | - | 225-MAPBGA (13x13) | - | - | -30°C~70°C TA | Tray | 1994 | i.MXL | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | 150MHz | - | ARM920T | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD | - | - | - | ROHS3 Compliant | ||
 MC7448VU1250ND NXP USA Inc. | 10086 | - | Datasheet | 12 Weeks | 360-CBGA, FCCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | - | 260 | 1.1V | 1.27mm | 40 | MC7448 | S-CBGA-N360 | 1.15V | 1.31.8/2.5V | 1.05V | 1.25GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1250MHz | 32 | - | NO | YES | - | FIXED POINT | NO | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | 2.8mm | 25mm | ROHS3 Compliant | ||
 MPC8358ECVRAGDGA NXP USA Inc. | 215 |
| Datasheet | 12 Weeks | 668-BBGA Exposed Pad | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | - | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MCIMX6S7CVM08AB NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6S | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | 26 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MPC7410THX500LE NXP USA Inc. | 2 | - | Datasheet | - | 360-BCBGA, FCCBGA | YES | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | - | Obsolete | 1 (Unlimited) | - | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | - | - | MPC7410 | R-PBGA-B | 1.9V | - | 1.7V | 500MHz | MICROPROCESSOR, RISC | PowerPC G4 | - | - | - | NO | NO | - | FIXED POINT | NO | 1.8V 2.5V 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 MPC8250AZUMHBC NXP USA Inc. | 125 | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | 2.2V | - | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MC68340AG25E NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | 144-LQFP | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | 25MHz | - | CPU32 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MPC852TCZT100A NXP USA Inc. | 29 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | 2.54mm | 23mm | Non-RoHS Compliant | ||
 MPC8555PXAPF NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | 3.75mm | 29mm | Non-RoHS Compliant | ||
 MPC8347VRADDB NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MPC855TZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 LS2088AXE7V1B NXP USA Inc. | 2370 |
| - | 18 Weeks | 1292-BFBGA, FCBGA | - | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.0GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | - | SATA 6Gbps (2) | - | - | ROHS3 Compliant | ||
MCIMX6U8DVM10AB NXP USA Inc. | 126 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6DL | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | MCIMX6 | S-PBGA-B624 | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 26 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MPC8572ELVTAVNE NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | 1023-BFBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2008 | MPC85xx | - | Obsolete | 3 (168 Hours) | - | 5A002 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 1mm | - | MPC8572 | S-PBGA-B1023 | 1.155V | - | 1.045V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.38mm | 33mm | ROHS3 Compliant | ||
 MCIMX6X1EVO10AB NXP USA Inc. | 5 | - | Datasheet | 15 Weeks | 400-LFBGA | YES | - | 179 | Commercial grade | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | Active | 3 (168 Hours) | 400 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B400 | 1.5V | - | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | - | 15 | YES | - | 32 | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | ROHS3 Compliant | ||
 MCIMX6Y0DVM05AB NXP USA Inc. | 5313 | - | Datasheet | 12 Weeks | 289-LFBGA | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (1) | I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | ROHS3 Compliant | ||
MCIMX6S6AVM10AD NXP USA Inc. | 3000 | - | - | 14 Weeks | 624-LFBGA | YES | - | - | - | -40°C~125°C TJ | Tray | - | i.MX6S | e1 | Active | 3 (168 Hours) | 624 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | 1.5V | - | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX6Q5EYM10ACR NXP USA Inc. | 32 |
| Datasheet | 15 Weeks | 624-LFBGA, FCBGA | YES | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX6X1CVK08AB NXP USA Inc. | 51 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B400 | 1.5V | - | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.3mm | 14mm | ROHS3 Compliant |