- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC860PCVR66D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
MPC866TZP133A NXP USA Inc. | 8750 | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC866 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | 133MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MPC850SRVR50BU NXP USA Inc. | 42 | - | Datasheet | - | 256-BBGA | YES | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | - | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | - | - | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8347VVALFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 672-LBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | - | 1.26V | 1.3V | 1.14V | 667MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
 MCIMX31LCVMN4C NXP USA Inc. | 80 | - | Datasheet | 15 Weeks | 473-LFBGA | YES | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX31 | e1 | Active | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX31 | S-PBGA-B473 | Not Qualified | 1.47V | 1.53.3V | 1.22V | 400MHz | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | 26 | YES | YES | 16 | FLOATING POINT | YES | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | 1.54mm | 19mm | ROHS3 Compliant | ||
 MCIMX6D6AVT08AE NXP USA Inc. | 8078 | - | Datasheet | 12 Weeks | 624-FBGA, FCBGA | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 852MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
MPC8241TVR200D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC8241 | S-PBGA-B357 | - | 1.9V | - | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | 2.56mm | 25mm | ROHS3 Compliant | ||
 MPC8541EVTAQF NXP USA Inc. | 360 | - | Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8541 | R-PBGA-B783 | - | 1.35V | - | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | - | - | 3.75mm | 29mm | ROHS3 Compliant | ||
 P1014NSN5HFA NXP USA Inc. | In Stock | - | Datasheet | - | 425-FBGA | YES | - | 0°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | - | - | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||
MPC853TVR66A NXP USA Inc. | 2700 | - | Datasheet | 8 Weeks | 256-BBGA | YES | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC853 | S-PBGA-B256 | - | 1.9V | - | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, TDM, UART | Communications; CPM | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MCIMX6S4AVM08AB NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
MPC850DEZQ50BU NXP USA Inc. | 10 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | - | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | - | - | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | 2.54mm | 23mm | Non-RoHS Compliant | ||
MCIMX31LDVMN5D NXP USA Inc. | 2059 | - | - | 15 Weeks | 473-LFBGA | YES | Commercial grade | -20°C~70°C TA | Tray | 2004 | i.MX31 | e1 | Active | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX31 | S-PBGA-B473 | Not Qualified | 1.65V | 1.2/1.51.8/3.3V | 1.52V | 532MHz | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | 26 | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | 1.54mm | 14mm | ROHS3 Compliant | ||
 MCIMX7D3EVK10SD NXP USA Inc. | 23 | - | Datasheet | 16 Weeks | 488-TFBGA | YES | - | -20°C~105°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 488 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.4mm | 40 | - | S-PBGA-B488 | - | 1.25V | - | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | 1.1mm | 12mm | ROHS3 Compliant | ||
 MCIMX507CVM8B NXP USA Inc. | 7600 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | 40 | MCIMX507 | S-PBGA-B400 | Not Qualified | 1.275V | - | 1.175V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 LS1020AXE7HNB NXP USA Inc. | 7 |
| Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 525 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | - | S-PBGA-B525 | - | 1.03V | - | 0.97V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | Multimedia; NEON™ SIMD | Secure Boot, TrustZone® | - | SATA 3Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | ||
 T1022NSN7MQB NXP USA Inc. | 7 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 0°C~105°C TA | Bulk | 2002 | QorIQ T1 | - | Active | 3 (168 Hours) | 780 | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | - | - | 1Gbps (5) | 2 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||
 MPC8250AZUPIBC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 480-LBGA Exposed Pad | YES | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | - | 2.2V | - | 1.9V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 B4860NSE7QUMD NXP USA Inc. | 2074 |
| - | 16 Weeks | 1020-BBGA, FCBGA | - | - | 0°C~105°C TA | Box | 2002 | QorIQ Qonverge B | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | PowerPC e6500 | - | - | - | - | - | - | - | - | - | 1.0V 1.2V 1.35V 1.5V 1.8V 2.5V | 1/2.5Gbps (4), 1/2.5/10Gbps (2) | 4 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 (1) | I2C, MMC/SD, RapidIO, SPI, UART | Signal Processing; SC3900FP FVP - 6 Core | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | - | - | - | - | ROHS3 Compliant | ||
 MCIMX7D2DVM12SC NXP USA Inc. | 24 |
| Datasheet | 18 Weeks | 541-LFBGA | YES | - | 0°C~85°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 541 | - | - | - | BOTTOM | BALL | 260 | 1.225V | 0.75mm | 40 | - | S-PBGA-B541 | - | 1.25V | - | 1.2V | 1.2GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | 26 | YES | YES | 16 | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | 1.42mm | 19mm | ROHS3 Compliant |