- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6D6AVT10ACR NXP USA Inc. | 80 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | - | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | MCIMX6 | - | - | - | - | - | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
 T1024NSE7KNA NXP USA Inc. | 110 |
| Datasheet | 14 Weeks | 780-FBGA | YES | - | - | 0°C~105°C TA | - | 2014 | QorIQ T1 | e1 | Active | 3 (168 Hours) | 780 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.33MHz | 64 | - | - | - | 16 | YES | YES | 64 | - | YES | - | - | GbE (8) | 2 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||
 LS1046ASN8MQA NXP USA Inc. | 2172 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | - | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B780 | - | 0.93V | - | 0.87V | 1.2GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | 14 | YES | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
MCIMX6DP7CVT8AA NXP USA Inc. | 1000 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6DP | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | 26 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MC68340AB25E NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | 144-BQFP | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | - | 25MHz | - | CPU32 | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6Q7CZK08AE NXP USA Inc. | 2558 |
| Datasheet | 15 Weeks | 569-LFBGA | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6Q | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | ROHS3 Compliant | ||
 MPC8569CVJANKGB NXP USA Inc. | 2617 |
| Datasheet | 12 Weeks | 783-BBGA, FCBGA | YES | - | - | -40°C~105°C TA | Tray | 2010 | MPC85xx | e1 | Last Time Buy | 3 (168 Hours) | 783 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | - | 1mm | 30 | - | S-PBGA-B783 | - | - | 12.5/3.3V | - | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | - | - | - | ROHS3 Compliant | ||
 SVF311R3K1CKU2 NXP USA Inc. | 88 |
| - | 15 Weeks | 176-LQFP Exposed Pad | YES | - | - | -40°C~85°C TA | Bulk | 2014 | Vybrid, VF3xxR | e3 | Active | 3 (168 Hours) | 176 | 5A002.A.1 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | SVF311 | S-PQFP-G176 | - | 3.6V | - | 3V | 266MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | 1.6mm | 24mm | ROHS3 Compliant | ||
 MPC8272VRTIEA NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | 516-BBGA | YES | 57 | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | - | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | - | - | 64 | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | ROHS3 Compliant | ||
 MPC8245TVV300D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 352-LBGA | YES | - | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 1.9V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | 1.65mm | 35mm | ROHS3 Compliant | ||
 MPC870CZT66 NXP USA Inc. | 12 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 5A992 | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC870 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | Communications; CPM | - | - | - | - | 2.54mm | 23mm | Non-RoHS Compliant | ||
MPC875CVR66 NXP USA Inc. | 5000 |
| Datasheet | 12 Weeks | 256-BBGA | YES | - | - | -40°C~100°C TA | Tray | 2004 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MC9328MXLDVP20R2 NXP USA Inc. | 5000 | - | Datasheet | - | 225-LFBGA | - | - | Commercial grade | -30°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXL | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | 200MHz | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | LCD | - | - | - | ROHS3 Compliant | ||
 MPC859TZP133A NXP USA Inc. | 100 |
| Datasheet | 8 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC859 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 P1010NXE5KHA NXP USA Inc. | In Stock | - | Datasheet | - | 425-FBGA | YES | - | - | -40°C~105°C TA | Tray | 2011 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | - | Tin/Silver (Sn/Ag) | - | 8542.31.00.01 | - | - | - | 1V | - | - | P1010 | - | - | - | 1V | - | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
LS1043AXE8QQB NXP USA Inc. | 100000 |
| Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | 4 | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | ALSO OPERATES AT 1V SUPPLY NOM | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B780 | - | 0.93V | - | 0.87V | 1.6GHz | - | ARM® Cortex®-A53 | 1600MHz | - | - | - | - | 14 | YES | - | 32 | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | ETHERNET, I2C, PCI, SATA, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.07mm | 23mm | ROHS3 Compliant | ||
 MCIMX508CVM8BR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.8mm | 40 | MCIMX508 | S-PBGA-B400 | Not Qualified | 1.15V | - | 0.95V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | - | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | Boot Security, Cryptography, Secure JTAG | EPDC, LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 LS1043AXN7QQB NXP USA Inc. | 70 | - | Datasheet | 18 Weeks | 621-FBGA, FCBGA | - | - | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
P1010NSN5HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 425-FBGA | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P1010 | - | - | - | - | - | 1.0GHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 P1020NSN2DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | Active | 3 (168 Hours) | 689 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | P1020 | S-PBGA-B689 | - | - | 1V | - | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | ROHS3 Compliant |