- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8379EVRALGA NXP USA Inc. | 72 |
| Datasheet | - | 689-BBGA Exposed Pad | YES | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Not For New Designs | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8379 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | Cryptography, Random Number Generator | - | SATA 3Gbps (4) | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC857DSLZQ50B NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 5A991 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC857 | S-PBGA-B357 | - | 3.465V | - | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MPC866TVR100A NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC866 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
MPC860PCZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
MPC866PVR100A NXP USA Inc. | 8750 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC866 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 P2040NSE7MMC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 780-FCPBGA (23x23) | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P2040 | - | - | - | - | - | 1.2GHz | - | PowerPC e500mc | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | Security; SEC 4.2 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 MPC8245LZU266D NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | 352-LBGA | YES | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC8245 | S-PBGA-B352 | - | 2.1V | 23.3V | 1.7V | 266MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | 1.65mm | 35mm | Non-RoHS Compliant | ||
 MC68302AG20C NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 144-LQFP | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68302 | - | - | - | - | - | 20MHz | - | M68000 | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6Y1DVK05AA NXP USA Inc. | 7 | - | Datasheet | 26 Weeks | 272-LFBGA | YES | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Active | 3 (168 Hours) | 272 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.5mm | compliant | - | - | S-PBGA-B272 | - | 1.5V | - | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | - | 16 | YES | - | 16 | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 8 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | 1.23mm | 9mm | RoHS Compliant | ||
 MPC870CVR66 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC870 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MPC8314ECVRAFDA NXP USA Inc. | 40 | - | Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | S-PBGA-B620 | - | 1.05V | 13.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MCIMX6X4EVM10AB NXP USA Inc. | 37 | - | Datasheet | 15 Weeks | 529-LFBGA | YES | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | - | - | Active | 3 (168 Hours) | 529 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | S-PBGA-B529 | - | 1.5V | - | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | 16 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | 1.5mm | 19mm | ROHS3 Compliant | ||
 P1014NXE5DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 425-FBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 425 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | P1014 | S-PBGA-B425 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.4 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||
 MPC8560VTAQFC NXP USA Inc. | In Stock | - | Datasheet | - | 784-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8560 | S-PBGA-B783 | - | 1.35V | - | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FIXED POINT | YES | - | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | 3.85mm | 29mm | ROHS3 Compliant | ||
 MC9328MX1VM20 NXP USA Inc. | 8 | - | Datasheet | - | 256-MAPBGA | YES | - | - | - | 0°C~70°C TA | Tray | 1994 | i.MX1 | e1 | - | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.9V | 0.8mm | - | 40 | MC9328MX1 | S-PBGA-B256 | - | 2V | - | 1.8V | 200MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD, Touch Panel | - | 1.6mm | 14mm | ROHS3 Compliant | ||
MCIMX535DVV1CR2 NXP USA Inc. | 1889 | - | - | 15 Weeks | 529-FBGA | YES | - | - | - | -20°C~85°C TC | Tape & Reel (TR) | 2007 | i.MX53 | e2 | - | Active | 3 (168 Hours) | 529 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.25V | 0.8mm | - | 40 | MCIMX535 | S-PBGA-B529 | Not Qualified | 1.4V | 0.9/1.251.3V | 1.2V | 1.0GHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | 1.85mm | 19mm | ROHS3 Compliant | ||
 MCIMX6Q4AVT10AC NXP USA Inc. | 10000 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MCIMX6U5DVM10ACR NXP USA Inc. | 2850 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | 14 | - | 0°C~95°C TJ | Tape & Reel (TR) | 2002 | i.MX6DL | e1 | yes | Active | 3 (168 Hours) | 624 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | - | ARM® Cortex®-A9 | - | - | 16 | YES | - | 64 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | ||
 MCIMX6G0DVM05AA NXP USA Inc. | 7296 |
| Datasheet | 12 Weeks | 289-LFBGA | YES | - | 131 | Commercial grade | 0°C~95°C TJ | Tray | 2014 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | S-PBGA-B289 | - | 1.3V | - | 1.15V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 24MHz | - | 16 | YES | - | 16 | - | - | 32000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (1) | EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | 9 | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | - | 1.32mm | 14mm | ROHS3 Compliant | ||
 LS1012AXN7KKB NXP USA Inc. | 368 | - | Datasheet | 24 Weeks | 211-VFLGA | - | - | - | - | -40°C~105°C | - | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | GbE (2) | 1 Core 64-Bit | - | DDR3L | USB 2.0 (1), USB 3.0 + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant |