- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8313VRAFFC NXP USA Inc. | 3000 | - | Datasheet | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | - | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 133MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
MPC8313ECVRAFFC NXP USA Inc. | 2 | - | Datasheet | 8 Weeks | 516-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | - | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | Security; SEC 2.2 | - | - | Cryptography | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 P2020NXE2MHC NXP USA Inc. | 960 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | - | - | 1.05V | - | 1.2GHz | MICROPROCESSOR | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | YES | - | - | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
P1022NXN2LFB NXP USA Inc. | 2628 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1022 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8309CVMAGDCA NXP USA Inc. | 18 | - | - | 10 Weeks | 489-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 489 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8309 | S-PBGA-B489 | - | 1.05V | 1V | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | 1.61mm | 19mm | ROHS3 Compliant | ||
 MCIMX7D3DVK10SC NXP USA Inc. | 5422 |
| Datasheet | 12 Weeks | 488-TFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 488 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 0.4mm | - | - | S-PBGA-B488 | - | 1.25V | - | 1.045V | 1.0GHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | - | - | - | - | 16 | - | YES | - | - | 32 | - | - | - | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | - | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | 1.1mm | 12mm | ROHS3 Compliant | ||
 MPC8314ECVRAGDA NXP USA Inc. | 300 |
| Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | - | 1.05V | 13.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 MCIMX515DJM8C NXP USA Inc. | In Stock | - | - | 15 Weeks | 529-LFBGA | YES | - | - | - | - | -20°C~85°C TC | Tray | 1997 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | MCIMX515 | S-PBGA-B529 | Not Qualified | 1.15V | 1.2V | 1.05V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | - | 1.6mm | 19mm | ROHS3 Compliant | ||
 MPC8548ECVJAQGD NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Active | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 1mm | - | MPC8548 | S-PBGA-B783 | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | 3.38mm | 29mm | ROHS3 Compliant | ||
 MCIMX6L8DVN10AB NXP USA Inc. | 300 | - | Datasheet | 12 Weeks | 432-TFBGA | YES | - | 162 | - | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | - | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | - | - | 16 | - | YES | YES | - | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.1mm | 13mm | ROHS3 Compliant | ||
 MCIMX27LMOP4A NXP USA Inc. | 3688 | - | Datasheet | - | 473-LFBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | - | 1.52V | - | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | - | - | - | - | 26 | - | YES | YES | - | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | - | Security; SAHARAH2 | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | 1.54mm | 19mm | ROHS3 Compliant | ||
 MCIMX6Q6AVT08AD NXP USA Inc. | 2558 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
P1020NXE2HFB NXP USA Inc. | 34 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1020 | S-PBGA-B689 | - | - | 1V | - | 800MHz | MICROPROCESSOR CIRCUIT | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
MCIMX7D5EVM10SC NXP USA Inc. | 11 | - | Datasheet | 18 Weeks | 541-LFBGA | YES | - | - | - | - | -20°C~105°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 541 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 0.75mm | - | - | S-PBGA-B541 | - | 1.155V | - | 1.045V | 1.0GHz | - | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | - | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | 1.4mm | 19mm | ROHS3 Compliant | ||
 MCIMX281AVM4B NXP USA Inc. | 760 | - | Datasheet | 15 Weeks | 289-LFBGA | YES | - | - | - | Automotive grade | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | 40 | MCIMX281 | S-PBGA-B289 | - | 1.55V | 1.41.8V | 1.35V | 454MHz | MICROPROCESSOR, RISC | ARM926EJ-S | 24MHz | 32 | - | - | - | - | - | - | YES | YES | AEC-Q100 | - | FIXED POINT | YES | - | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | - | Boot Security, Cryptography, Hardware ID | Keypad | - | 1.37mm | 14mm | ROHS3 Compliant | ||
MCIMX286DVM4B NXP USA Inc. | 450 |
| Datasheet | 15 Weeks | 289-LFBGA | YES | - | - | - | - | -20°C~70°C TA | Tray | 2002 | i.MX28 | e1 | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | MCIMX286 | S-PBGA-B289 | - | 1.55V | - | 1.35V | 454MHz | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | 24MHz | - | - | - | - | - | - | - | YES | - | - | - | - | - | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | - | 1.37mm | 14mm | ROHS3 Compliant | ||
MPC8548CVJAQGD NXP USA Inc. | 2566 |
| Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Active | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | 40 | MPC8548 | S-PBGA-B783 | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | - | - | 64 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | 3.294mm | 29mm | ROHS3 Compliant | ||
 MVF51NN151CMK50 NXP USA Inc. | 10 | - | Datasheet | 15 Weeks | 364-LFBGA | YES | - | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF51NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | - | - | - | 16 | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | 17mm | ROHS3 Compliant | ||
 MCIMX6Y2DVM09AB NXP USA Inc. | 20 | - | Datasheet | 18 Weeks | 289-LFBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 900MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | ROHS3 Compliant | ||
P1011NXN2DFB NXP USA Inc. | 419 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | - | 689-TEPBGA II (31x31) | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P1011 | - | - | - | - | - | 800MHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |