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  • Moisture Sensitivity Level (MSL)
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  • RoHS Status
  • Series
  • Speed
  • Core Processor
  • Published

Attribute column

Manufacturer

NXP Embedded - Microprocessors

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5314 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Package / Case

Surface Mount

Supplier Device Package

Number of I/Os

ROM(word)

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Speed

uPs/uCs/Peripheral ICs Type

Core Processor

Clock Frequency

Bit Size

Has ADC

DMA Channels

PWM Channels

DAC Channels

Address Bus Width

CPU Family

Boundary Scan

Low Power Mode

External Data Bus Width

Format

Integrated Cache

Voltage - I/O

Ethernet

Number of Cores/Bus Width

Graphics Acceleration

RAM Controllers

USB

Additional Interfaces

Co-Processors/DSP

ROM Programmability

Security Features

Display & Interface Controllers

SATA

Height Seated (Max)

Length

RoHS Status

MC68LC302CAF16CT
MC68LC302CAF16CT

NXP USA Inc.

880

-

Datasheet

8 Weeks

100-LQFP

-

-

-

-

-40°C~85°C TA

Tray

1995

M683xx

e3

-

Not For New Designs

3 (168 Hours)

-

3A991.A.2

Matte Tin (Sn)

8542.31.00.01

-

-

260

-

-

40

MC68LC302

-

-

-

-

-

16MHz

MICROCONTROLLER, RISC

M68000

-

-

-

-

-

-

-

-

-

-

-

-

-

5.0V

-

1 Core 8/16-Bit

No

DRAM

-

GCI, IDL, ISDN, NMSI, PCM, SCPI

Communications; RISC CPM

-

-

-

-

-

-

ROHS3 Compliant

MPC859DSLVR50A
MPC859DSLVR50A

NXP USA Inc.

751

-

Datasheet

8 Weeks

357-BBGA

YES

-

-

-

0°C~95°C TA

Tray

1999

MPC8xx

e1

-

Last Time Buy

3 (168 Hours)

357

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

30

MPC859

S-PBGA-B357

-

1.9V

1.83.3V

1.7V

50MHz

MICROPROCESSOR, RISC

-

-

32

-

-

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (1), 10/100Mbps (1)

1 Core 32-Bit

No

DRAM

-

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

-

2.52mm

25mm

ROHS3 Compliant

P1013NSN2EFB
P1013NSN2EFB

NXP USA Inc.

2554
Datasheet

12 Weeks

689-BBGA Exposed Pad

YES

-

-

-

0°C~105°C TA

Tray

2002

QorIQ P1

e2

-

Active

3 (168 Hours)

689

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

40

P1013

S-PBGA-B689

-

1.05V

-

0.95V

1.055GHz

MICROPROCESSOR

PowerPC e500v2

-

32

-

-

-

-

16

-

YES

YES

64

FIXED POINT

YES

-

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, I2S, MMC/SD, SPI

-

-

-

LCD

SATA 3Gbps (2)

2.46mm

31mm

ROHS3 Compliant

MPC8572ELVJAVNE
MPC8572ELVJAVNE

NXP USA Inc.

In Stock

-

Datasheet

18 Weeks

1023-BBGA, FCBGA

-

-

-

-

0°C~105°C TA

Box

1998

MPC85xx

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

MPC8572

-

-

-

-

-

1.5GHz

-

PowerPC e500

-

-

-

-

-

-

-

-

-

-

-

-

-

1.5V 1.8V 2.5V 3.3V

10/100/1000Mbps (4)

2 Core 32-Bit

No

DDR2, DDR3

-

DUART, HSSI, I2C, RapidIO

Signal Processing; SPE, Security; SEC

-

Cryptography, Random Number Generator

-

-

-

-

ROHS3 Compliant

MCIMX6DP4AVT8AA
MCIMX6DP4AVT8AA

NXP USA Inc.

7

-

Datasheet

15 Weeks

624-FBGA, FCBGA

YES

-

-

-

-40°C~125°C TJ

Tray

2002

i.MX6DP

-

-

Active

3 (168 Hours)

624

5A992

-

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

1.4V

0.8mm

NOT SPECIFIED

-

S-PBGA-B624

-

1.5V

-

1.225V

852MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

-

32

-

-

-

-

26

-

YES

YES

64

FLOATING POINT

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

Yes

LPDDR2, DDR3L, DDR3

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

-

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MPC852TZT66A
MPC852TZT66A

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

256-BBGA

YES

-

-

-

0°C~95°C TA

Tray

1999

MPC8xx

e0

-

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

30

MPC852

S-PBGA-B256

-

1.9V

1.83.3V

1.7V

66MHz

MICROPROCESSOR, RISC

-

66MHz

32

-

-

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (1)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, PCMCIA, SPI, UART

Communications; CPM

-

-

-

-

2.54mm

23mm

Non-RoHS Compliant

MCIMX6QP4AVT1AA
MCIMX6QP4AVT1AA

NXP USA Inc.

2948

-

Datasheet

15 Weeks

624-FBGA, FCBGA

YES

-

-

-

-40°C~125°C TJ

Tray

2002

i.MX6QP

-

-

Active

3 (168 Hours)

624

5A992

-

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

-

0.8mm

NOT SPECIFIED

-

S-PBGA-B624

-

1.5V

-

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

-

32

-

-

-

-

26

-

YES

YES

64

FLOATING POINT

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

4 Core 32-Bit

Yes

LPDDR2, DDR3L, DDR3

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

-

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MCIMX257CJM4AR2
MCIMX257CJM4AR2

NXP USA Inc.

7
Datasheet

15 Weeks

400-LFBGA

YES

-

-

-

-40°C~85°C TA

Tape & Reel (TR)

2008

i.MX25

e1

-

Active

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.45V

0.8mm

40

-

S-PBGA-B400

-

1.52V

-

1.38V

400MHz

MICROPROCESSOR

ARM926EJ-S

24MHz

32

-

-

-

-

26

-

YES

YES

16

FIXED POINT

YES

2.0V 2.5V 2.7V 3.0V 3.3V

10/100Mbps (1)

1 Core 32-Bit

No

LPDDR, DDR, DDR2

USB 2.0 + PHY (2)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

-

-

-

Keypad, LCD, Touchscreen

-

1.6mm

17mm

ROHS3 Compliant

MPC860DECVR50D4
MPC860DECVR50D4

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

357-BBGA

YES

-

-

-

-40°C~95°C TA

Tray

1995

MPC8xx

e1

-

Not For New Designs

3 (168 Hours)

357

3A991.A.2

TIN SILVER COPPER

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

30

MPC860

S-PBGA-B357

-

3.465V

3.3V

3.135V

50MHz

MICROPROCESSOR, RISC

-

50MHz

32

-

-

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (2)

1 Core 32-Bit

No

DRAM

-

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

-

2.52mm

25mm

ROHS3 Compliant

T1024NSE7MQA
T1024NSE7MQA

NXP USA Inc.

7
Datasheet

18 Weeks

780-FBGA

YES

-

-

-

0°C~105°C TA

Tray

2014

QorIQ T1

e1

-

Active

3 (168 Hours)

780

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

250

1V

0.8mm

30

-

S-PBGA-B780

-

1.03V

-

0.97V

1.2GHz

MICROPROCESSOR, RISC

PowerPC e5500

133.33MHz

64

-

-

-

-

16

-

YES

YES

64

-

YES

-

GbE (8)

2 Core 64-Bit

No

DDR3L, DDR4

USB 2.0 + PHY (2)

I2C, MMC/SD, PCIe, SPI, UART

-

-

Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage

-

SATA 3Gbps (2)

2.07mm

23mm

ROHS3 Compliant

SVF532R2K1CMK4
SVF532R2K1CMK4

NXP USA Inc.

40

-

Datasheet

15 Weeks

364-LFBGA

YES

-

-

-

-40°C~85°C TA

Tray

2014

Vybrid, VF5xxR

e1

-

Active

3 (168 Hours)

364

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.23V

-

40

-

S-PBGA-B364

-

1.26V

-

1.16V

400MHz, 133MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A5 + Cortex®-M4

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

3.3V

10/100Mbps (2)

2 Core 32-Bit

Yes

LPDDR2, DDR3, DRAM

USB 2.0 OTG + PHY (1)

CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART

Multimedia; NEON™ MPE

-

ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG

DCU, GPU, LCD, VideoADC, VIU

-

-

-

ROHS3 Compliant

P2010NSE2MHC
P2010NSE2MHC

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

689-BBGA Exposed Pad

YES

-

-

-

0°C~125°C TA

Tray

2002

QorIQ P2

e2

-

Active

3 (168 Hours)

689

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.05V

1mm

40

P2010

S-PBGA-B689

-

1.1V

-

1V

1.2GHz

MICROPROCESSOR, RISC

PowerPC e500v2

100MHz

-

-

-

-

-

16

-

YES

YES

64

FLOATING POINT

YES

-

10/100/1000Mbps (3)

1 Core 32-Bit

No

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

Security; SEC 3.3

-

Cryptography, Random Number Generator

-

-

2.46mm

31mm

ROHS3 Compliant

MPC8347CVRADDB
MPC8347CVRADDB

NXP USA Inc.

2532
  • 1:$141.381641
  • 10:$133.378907
  • 100:$125.829157
  • 500:$118.706752
  • View all price
Datasheet

12 Weeks

620-BBGA Exposed Pad

YES

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

620

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8347

S-PBGA-B620

-

1.26V

1.2V

1.14V

266MHz

MICROPROCESSOR

PowerPC e300

66MHz

32

-

-

-

-

32

-

YES

YES

32

FLOATING POINT

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

-

-

-

-

-

2.46mm

29mm

ROHS3 Compliant

MCIMX27LMJP4A
MCIMX27LMJP4A

NXP USA Inc.

7
Datasheet

15 Weeks

473-LFBGA

YES

-

-

-

-40°C~85°C TA

Tray

-

i.MX27

e1

-

Not For New Designs

3 (168 Hours)

473

5A992.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.45V

0.8mm

40

-

S-PBGA-B473

Not Qualified

1.52V

-

1.38V

400MHz

MICROPROCESSOR

ARM926EJ-S

26MHz

32

-

-

-

-

26

-

YES

YES

16

FIXED POINT

YES

2.0V 2.5V 2.7V 3.0V

10/100Mbps (1)

1 Core 32-Bit

Yes

DDR

USB 2.0 + PHY (3)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

Security; SAHARAH2

-

Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory

Keypad, LCD

-

1.54mm

19mm

ROHS3 Compliant

P2010NXE2KHC
P2010NXE2KHC

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

689-BBGA Exposed Pad

YES

-

-

-

-40°C~125°C TA

Tray

2002

QorIQ P2

e2

-

Active

3 (168 Hours)

689

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.05V

1mm

40

P2010

S-PBGA-B689

-

1.1V

-

1V

1.2GHz

MICROPROCESSOR, RISC

PowerPC e500v2

100MHz

-

-

-

-

-

16

-

YES

YES

64

FLOATING POINT

YES

-

10/100/1000Mbps (3)

1 Core 32-Bit

No

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

Security; SEC 3.3

-

Cryptography, Random Number Generator

-

-

2.46mm

31mm

ROHS3 Compliant

MPC8572LVJAVNE
MPC8572LVJAVNE

NXP USA Inc.

2266

-

Datasheet

18 Weeks

1023-BBGA, FCBGA

-

-

-

-

0°C~105°C TA

Tray

1998

MPC85xx

-

yes

Active

3 (168 Hours)

-

-

-

-

-

-

245

-

-

30

MPC8572

-

-

-

-

-

1.5GHz

MICROPROCESSOR

PowerPC e500

-

-

-

-

-

-

-

-

-

-

-

-

-

1.5V 1.8V 2.5V 3.3V

10/100/1000Mbps (4)

2 Core 32-Bit

No

DDR2, DDR3

-

DUART, HSSI, I2C, RapidIO

Signal Processing; SPE

-

-

-

-

-

-

ROHS3 Compliant

MPC852TCZT50A
MPC852TCZT50A

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

256-BBGA

YES

-

-

-

-40°C~100°C TA

Tray

1999

MPC8xx

e0

-

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

30

MPC852

S-PBGA-B256

-

1.9V

1.83.3V

1.7V

50MHz

MICROPROCESSOR, RISC

-

66MHz

32

-

-

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (1)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, PCMCIA, SPI, UART

Communications; CPM

-

-

-

-

2.54mm

23mm

Non-RoHS Compliant

MC68020RC16E
MC68020RC16E

NXP USA Inc.

27

-

Datasheet

-

114-BPGA

-

114-PGA (34.55x34.55)

-

-

0°C~70°C TA

Tray

1995

M680x0

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

MC68020

-

-

-

-

-

16MHz

-

68020

-

-

-

-

-

-

-

-

-

-

-

-

-

5.0V

-

1 Core 32-Bit

No

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MCIMX6X3CVN08AC
MCIMX6X3CVN08AC

NXP USA Inc.

In Stock

-

Datasheet

15 Weeks

400-LFBGA

-

-

-

-

-40°C~105°C TA

Tray

2017

i.MX6SX

-

-

Active

3 (168 Hours)

-

-

-

8542.39.00.01

-

-

260

-

-

40

-

-

-

-

-

-

200MHz, 800MHz

-

ARM® Cortex®-A9, ARM® Cortex®-M4

-

-

-

-

-

-

-

-

-

-

-

-

-

1.8V 2.5V 2.8V 3.15V

10/100/1000Mbps (2)

2 Core 32-Bit

Yes

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART

Multimedia; NEON™ MPE

-

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Keypad, LCD

-

-

-

ROHS3 Compliant

MVF30NS151CKU26
MVF30NS151CKU26

NXP USA Inc.

7

-

Datasheet

15 Weeks

176-LQFP Exposed Pad

YES

-

111

0

-40°C~85°C TA

Tray

2002

Vybrid, VF3xx

e3

-

Active

3 (168 Hours)

176

5A002.A.1

Matte Tin (Sn)

8542.31.00.01

QUAD

GULL WING

260

1.23V

0.5mm

40

MVF30NS151

S-PQFP-G176

Not Qualified

1.26V

3.3V

1.16V

266MHz

MICROCONTROLLER, RISC

ARM® Cortex®-A5

-

16

YES

YES

NO

YES

-

CORTEX-A5

-

-

-

-

-

3.3V

10/100Mbps (2)

1 Core 32-Bit

Yes

LPDDR2, DDR3, DRAM

USB 2.0 OTG + PHY (1)

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Multimedia; NEON™ MPE

FLASH

ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG

DCU, GPU, LCD, VideoADC, VIU

-

-

-

ROHS3 Compliant