- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
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Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8377EVRANGA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | 1.05V | 1.051.8/2.52.5/3.3V | 0.95V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | Cryptography, Random Number Generator | - | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||
MPC8377CVRANG NXP USA Inc. | In Stock | - | Datasheet | - | 689-BBGA Exposed Pad | - | - | - | -40°C~125°C TA | Tray | 2012 | MPC83xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8377 | - | - | - | - | 800MHz | - | PowerPC e300c4s | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 P1014NSE5HHA NXP USA Inc. | In Stock | - | Datasheet | - | 425-FBGA | YES | - | - | 0°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 5A002.A | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.4 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||
 MPC860DPZQ80D4 NXP USA Inc. | 38 | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MC7447AVU1420LB NXP USA Inc. | In Stock | - | Datasheet | - | 360-BCBGA, FCCBGA | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | Not For New Designs | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | - | 1.25V | 1.42GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | 2.8mm | 25mm | ROHS3 Compliant | ||
 MPC850SRCVR66BU NXP USA Inc. | 958 | - | Datasheet | - | 256-BBGA | - | - | - | -40°C~95°C TA | Tray | 2004 | MPC8xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC850 | - | - | - | - | 66MHz | - | - | - | - | - | - | - | - | - | - | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | ROHS3 Compliant | ||
P1021NSN2HFB NXP USA Inc. | 35 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Communications; QUICC Engine | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 LS2084AXE7TTB NXP USA Inc. | 2181 | - | - | 18 Weeks | 1292-BFBGA, FCBGA | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | - | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA (2) | - | - | ROHS3 Compliant | ||
 MPC8540VT833LB NXP USA Inc. | 34 | - | Datasheet | - | 784-BBGA, FCBGA | - | 783-FCPBGA (29x29) | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8540 | - | - | - | - | 833MHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LS1020ASE7KQB NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | - | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 525 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | - | S-PBGA-B525 | 1.03V | - | 0.97V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | - | Multimedia; NEON™ SIMD | - | Secure Boot, TrustZone® | - | SATA 3Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | ||
 T4160NSE7QTB NXP USA Inc. | 555 |
| Datasheet | 18 Weeks | 1932-BBGA, FCBGA | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ T4 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | - | - | 8542.31.00.01 | - | - | 250 | - | - | - | - | - | - | - | - | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | - | - | - | - | - | - | - | - | - | - | 1Gbps (13), 10Gbps (2) | 8 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
MPC855TZQ50D4R2 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 357-BBGA | YES | - | - | 0°C~95°C TA | Tape & Reel (TR) | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
 MCIMX6G1AVM05AA NXP USA Inc. | 43 | - | Datasheet | 12 Weeks | 289-LFBGA | YES | - | 131 | -40°C~125°C TJ | Tray | 2014 | i.MX6UL | - | Obsolete | 3 (168 Hours) | 289 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B289 | 1.3V | - | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 528MHz | - | 16 | YES | - | 16 | - | - | 32000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | 9 | Multimedia; NEON™ SIMD | CAN, ETHERNET, I2C, I2S, SPI, UART, USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | - | 1.32mm | 14mm | ROHS3 Compliant | ||
 MPC8323VRAFDC NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA | YES | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8323 | S-PBGA-B516 | 1.05V | - | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 T2080NXN8TTB NXP USA Inc. | 2825 | - | Datasheet | 18 Weeks | 896-BFBGA, FCBGA | - | - | - | 0°C~105°C TA | - | 2002 | QorIQ T2 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | PowerPC e6500 | - | - | - | - | - | - | - | - | - | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | - | DDR3, DDR3L | USB 2.0 + PHY (2) | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
 MPC8544EVTAQGA NXP USA Inc. | 276 | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | 1.05V | - | 0.95V | 1.0GHz | MICROPROCESSOR | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | - | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | 3.38mm | 29mm | ROHS3 Compliant | ||
 MPC603RRX266LC NXP USA Inc. | In Stock | - | Datasheet | - | 255-BCBGA, FCCBGA | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC6xx | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | MPC603 | - | - | - | - | 266MHz | - | PowerPC 603e | - | - | - | - | - | - | - | - | - | 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 MPC7410THX400LE NXP USA Inc. | 310 | - | Datasheet | 8 Weeks | 360-BCBGA, FCCBGA | YES | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Obsolete | 1 (Unlimited) | - | 3A991.A.1 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | - | - | MPC7410 | R-PBGA-B | 1.9V | - | 1.7V | 400MHz | MICROPROCESSOR, RISC | PowerPC G4 | - | - | - | NO | NO | - | FIXED POINT | NO | - | 1.8V 2.5V 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 P5020NSE7QMB NXP USA Inc. | In Stock | - | - | 26 Weeks | 1295-BBGA, FCBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P5 | e1 | Last Time Buy | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | - | S-PBGA-B1295 | 1.15V | - | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | - | 1Gbps (5), 10Gbps (1) | 2 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.2 | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 MCIMX6L8DVN10AC NXP USA Inc. | 5 | - | Datasheet | 12 Weeks | 432-TFBGA | YES | - | - | 0°C~95°C TJ | Tray | - | i.MX6SL | - | Active | 3 (168 Hours) | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | 40 | - | S-PBGA-B | 1.5V | - | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.1mm | 13mm | ROHS3 Compliant |