- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6X1AVK08AC NXP USA Inc. | 40 | - | Datasheet | 14 Weeks | 400-LFBGA | - | - | - | - | -40°C~125°C TJ | Tray | 2017 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 200MHz, 800MHz | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
 MPC8544VTALFA NXP USA Inc. | 2543 |
| Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | - | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | MPC8544 | S-PBGA-B783 | - | - | 11.8/2.53.3V | - | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | ROHS3 Compliant | ||
 MVF60NN152CMK40 NXP USA Inc. | 8 | - | Datasheet | 15 Weeks | 364-LFBGA | YES | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF6xx | - | yes | Active | 3 (168 Hours) | 364 | - | - | - | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | - | - | - | 3.6V | - | 3V | 400MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 24MHz | 32 | YES | YES | NO | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | 17mm | ROHS3 Compliant | ||
 P1015NSN5DFB NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | 561-FBGA | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P1015 | - | - | - | - | - | 667MHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68040RC33A NXP USA Inc. | 600 | - | Datasheet | - | 179-BEPGA | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68040 | - | - | - | - | - | 33MHz | - | 68040 | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6U5EVM10ABR NXP USA Inc. | 2000 |
| Datasheet | 15 Weeks | 624-LFBGA | YES | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6DL | - | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | - | - | - | - | - | - | MCIMX6 | - | Not Qualified | - | 1.05/1.5V | - | 1.0GHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
 LS1046AXN8MQA NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 76 | - | -40°C~105°C | Tray | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B780 | - | 0.93V | - | 0.87V | 1.2GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | 14 | YES | - | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
 MPC8358VVADDEA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 740-LBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B740 | - | 1.26V | 1.8/2.53.3V | 1.14V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | 1.69mm | 37.5mm | ROHS3 Compliant | ||
SVF521R3K2CMK4 NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | 364-LFBGA | - | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF5xxR | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | ROHS3 Compliant | ||
SVF522R3K2CMK4 NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | 364-LFBGA | - | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF5xxR | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | ROHS3 Compliant | ||
 MPC8313EVRAGDB NXP USA Inc. | 3258 | - | Datasheet | - | 516-BBGA Exposed Pad | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8313 | - | - | - | - | - | 400MHz | - | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | - | Cryptography | - | - | - | - | ROHS3 Compliant | ||
 MCIMX251AJM4AR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2013 | i.MX25 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX251 | S-PBGA-B400 | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | - | - | - | 26 | YES | YES | - | - | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad | - | 1.6mm | 17mm | ROHS3 Compliant | ||
MCIMX507CVM1BR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.275V | 0.8mm | 40 | MCIMX507 | S-PBGA-B400 | Not Qualified | 1.35V | - | 1.2V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1000MHz | - | - | - | - | - | YES | - | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | Boot Security, Cryptography, Secure JTAG | LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MC68EC040FE25A NXP USA Inc. | In Stock | - | Datasheet | - | 184-BCQFP | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68EC040 | - | - | - | - | - | 25MHz | - | 68040 | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MPC8544CVTANG NXP USA Inc. | 4939 | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2007 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | 2.8mm | 29mm | ROHS3 Compliant | ||
 MC9328MXLDVP20 NXP USA Inc. | 448 | - | Datasheet | 26 Weeks | 225-LFBGA | - | 225-MAPBGA (13x13) | - | - | -30°C~70°C TA | Tray | 1994 | i.MXL | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | 200MHz | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | LCD | - | - | - | ROHS3 Compliant | ||
LS1046AXE8P1A NXP USA Inc. | 1511 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 76 | - | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | 1.4GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | 14 | YES | - | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||
 SPC5200CVR400BR2 NXP USA Inc. | In Stock | - | Datasheet | - | 272-BBGA | YES | - | - | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MPC52xx | e1 | - | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | PC5200 | S-PBGA-B272 | - | 1.58V | 1.53.3V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 66MHz | 32 | - | - | - | 32 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | 2.65mm | 27mm | ROHS3 Compliant | ||
 MPC8378ECVRAJFA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 533MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | - | - | - | 15 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8245TZU300D NXP USA Inc. | 2456 |
| Datasheet | 12 Weeks | 352-LBGA | YES | - | - | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 1.9V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | 32 | YES | YES | - | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | 1.65mm | 35mm | Non-RoHS Compliant |