- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 LS1043ASN8MNLB NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | ROHS3 Compliant | ||
 P2020NXN2HFC NXP USA Inc. | 2878 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | S-PBGA-B689 | - | 1.1V | 1.05V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | 2.46mm | 31mm | - | ROHS3 Compliant | ||
 MC68EN302AG25BT NXP USA Inc. | In Stock | - | Datasheet | - | 144-LQFP | - | - | - | - | - | 0°C~70°C TA | Tray | 1997 | M683xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68EN302 | - | - | - | - | - | - | 25MHz | - | M68000 | - | - | - | - | - | - | - | - | - | 5.0V | 10Mbps (1) | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCIMX6S1AVM08AD NXP USA Inc. | 180 | - | Datasheet | 14 Weeks | 624-LFBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | - | i.MX6S | - | Active | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | S-PBGA-B624 | - | 1.5V | - | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 16 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | - | ROHS3 Compliant | ||
 MPC8536EBVJANGA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2006 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | MPC8536 | S-PBGA-B783 | - | 1.05V | 11.5/1.81.8/3.3V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC | - | Cryptography | - | SATA 3Gbps (2) | 2.76mm | 29mm | - | ROHS3 Compliant | ||
 MCIMX508CVK8BR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 416-LFBGA | YES | - | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 416 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.5mm | - | 40 | MCIMX508 | S-PBGA-B416 | Not Qualified | 1.15V | - | - | 0.95V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | Boot Security, Cryptography, Secure JTAG | EPDC, LCD | - | 1.52mm | 13mm | - | ROHS3 Compliant | ||
MPC8544EVTANG NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 1 (Unlimited) | 783 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8544 | S-PBGA-B783 | - | 1.05V | - | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | - | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | 2.8mm | 29mm | - | ROHS3 Compliant | ||
MPC8543VTANGB NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | - | 783-FCPBGA (29x29) | - | - | - | 0°C~105°C TA | Tray | 2009 | MPC85xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8543 | - | - | - | - | - | - | 800MHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 P1014NXN5DFA NXP USA Inc. | In Stock | - | Datasheet | - | 425-FBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2011 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | P1014 | S-PBGA-B425 | - | 1.05V | - | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | SATA 3Gbps (2) | 1.9mm | 19mm | - | ROHS3 Compliant | ||
 MC68340CAB25E NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | 144-BQFP | - | - | - | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | - | - | 25MHz | - | CPU32 | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MCIMX6S5EVM10ADR NXP USA Inc. | 500 |
| Datasheet | 15 Weeks | 624-LFBGA | - | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | - | i.MX6S | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | ROHS3 Compliant | ||
LS1023ASE8MQB NXP USA Inc. | 1500 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | ROHS3 Compliant | ||
P1011NXE2DFB NXP USA Inc. | In Stock | - | - | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 125°C | -40°C | - | Tray | 2002 | - | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | NOT SPECIFIED | P1011 | S-PBGA-B689 | - | 1.05V | - | AUTOMOTIVE | 0.95V | 533 MHz | MICROPROCESSOR, RISC | - | 100MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | 31mm | ROHS3 Compliant | ||
 MPC7410HX450LE NXP USA Inc. | 350 | - | Datasheet | 8 Weeks | 360-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Obsolete | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | - | 40 | MPC7410 | S-CBGA-B360 | - | 1.9V | - | - | 1.7V | 450MHz | MICROPROCESSOR, RISC | PowerPC G4 | 133MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | 3.2mm | 25mm | - | Non-RoHS Compliant | ||
 MPC8314EVRADDA NXP USA Inc. | 39 |
| Datasheet | 10 Weeks | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | S-PBGA-B620 | - | 1.05V | 13.3V | - | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | - | ROHS3 Compliant | ||
 MCIMX6Y7DVK05AA NXP USA Inc. | 5980 |
| Datasheet | 52 Weeks | 272-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | Active | 3 (168 Hours) | 272 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.5mm | compliant | - | - | S-PBGA-B272 | - | 1.5V | - | - | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | - | 16 | YES | - | 16 | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 4 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | 1.23mm | 9mm | - | RoHS Compliant | ||
P2040NXN7MMC NXP USA Inc. | 2340 |
| Datasheet | 12 Weeks | 780-BBGA, FCBGA | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P2040 | - | - | - | - | - | - | 1.2GHz | - | PowerPC e500mc | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | ROHS3 Compliant | ||
MCIMX6Y1DVK05AB NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 272-LFBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | ROHS3 Compliant | ||
 MPC8308VMADD NXP USA Inc. | In Stock | - | - | - | 473-LFBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | - | 40 | MPC8308 | S-PBGA-B473 | - | - | - | - | - | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
LS1026AXE8T1A NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | YES | - | 76 | - | - | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | - | 30 | - | S-PBGA-B780 | - | 1.03V | - | - | 0.97V | 1.8GHz | - | ARM® Cortex®-A72 | - | - | 14 | YES | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | - | ROHS3 Compliant |