- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX534AVV8C2R2 NXP USA Inc. | 32 |
| Datasheet | 15 Weeks | 529-FBGA | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2011 | i.MX53 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 1.5Gbps (1) | - | - | - | - | ROHS3 Compliant | ||
 MPC8306VMABDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | 369-LFBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | - | - | - | - | 133MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, SPI, TDM | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.61mm | 19mm | - | ROHS3 Compliant | ||
 MC68030FE25C NXP USA Inc. | In Stock | - | Datasheet | - | 132-BCQFP | - | - | - | - | 0°C~70°C TA | Tray | 2007 | M680x0 | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68030 | - | - | - | - | - | 25MHz | - | 68030 | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 P2020PSE2KZB NXP USA Inc. | 13 | - | Datasheet | - | 689-BBGA Exposed Pad | - | 689-TEPBGA II (31x31) | - | - | 0°C~125°C TA | Tray | 2009 | QorIQ P2 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P2020 | - | - | - | - | - | 1.2GHz | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68EN360CZQ25L NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | 46 | - | -40°C~85°C TA | Tray | 1995 | M683xx | e0 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | - | 5.25V | - | 4.75V | 25MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | NO | 32 | - | - | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | - | 1.86mm | 25mm | - | Non-RoHS Compliant | ||
 MC68EC000EI8R2 NXP USA Inc. | 250 | - | Datasheet | - | 68-LCC (J-Lead) | - | 68-PLCC (24.21x24.21) | - | - | 0°C~70°C TA | Tape & Reel (TR) | 1998 | M680x0 | - | Obsolete | 2 (1 Year) | - | - | - | - | - | - | - | - | - | - | MC68EC000 | - | - | - | - | - | 8MHz | - | EC000 | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LS1026ASN8T1A NXP USA Inc. | 44 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | - | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | - | SATA 6Gbps (1) | - | - | - | - | ROHS3 Compliant | ||
MPC860DPVR80D4 NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | - | - | - | Tray | 1995 | - | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | Not Qualified | 3.465V | 3.3V | 3.135V | 80 MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | 25mm | ROHS3 Compliant | ||
 MCIMX6Q5EZK08AD NXP USA Inc. | 27 |
| Datasheet | 15 Weeks | 569-LFBGA | YES | - | - | Commercial grade | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 569 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.4mm | 40 | - | S-PBGA-B569 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | - | 1.25mm | 12mm | - | ROHS3 Compliant | ||
 MPC8343ECVRAGDB NXP USA Inc. | 7 | - | - | 12 Weeks | 620-BBGA Exposed Pad | - | 620-PBGA (29x29) | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8343 | - | - | - | - | - | 400MHz | - | PowerPC e300 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC68360ZQ33L NXP USA Inc. | 205 | - | Datasheet | - | 357-BBGA | YES | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e0 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68360 | S-PBGA-B357 | - | 5.25V | - | 4.75V | 33MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | - | - | - | - | 32 | YES | YES | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | - | Non-RoHS Compliant | ||
 MPC8308ZQAGDA NXP USA Inc. | In Stock | - | - | 10 Weeks | 473-LFBGA | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Active | 3 (168 Hours) | - | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | - | 260 | - | - | 40 | MPC8308 | - | - | - | - | - | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
 MPC8535AVJANGA NXP USA Inc. | 2340 |
| - | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | 0°C~90°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | S-PBGA-B783 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR | PowerPC e500 | - | 32 | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (2) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | SATA 3Gbps (1) | - | 2.76mm | 29mm | - | ROHS3 Compliant | ||
MPC8536CVJAVLA NXP USA Inc. | 2115 | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | MPC8536 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 1.5GHz | MICROPROCESSOR | PowerPC e500 | - | 32 | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.76mm | 29mm | - | ROHS3 Compliant | ||
 MC8641DHX1500KE NXP USA Inc. | 2478 |
| Datasheet | 16 Weeks | 1023-BCBGA, FCCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC86xx | e0 | Obsolete | 3 (168 Hours) | - | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | MC8641 | S-CBGA-B1023 | - | 1.15V | 1.11.8/2.52.5/3.3V | 1.05V | 1.5GHz | MICROPROCESSOR | PowerPC e600 | 1500MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, RapidIO | - | - | - | - | - | - | - | - | 2.97mm | 33mm | - | Non-RoHS Compliant | ||
P2041NXE1MMB NXP USA Inc. | In Stock | - | Datasheet | - | 780-BBGA, FCBGA | - | - | - | - | -40°C~105°C TA | Tray | 2012 | QorIQ P2 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | P2041 | - | - | - | - | - | 1.2GHz | - | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | - | SATA 3Gbps (2) | - | - | - | - | ROHS3 Compliant | ||
MPC8544EVTAQG NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 1 (Unlimited) | 783 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 1.0GHz | MICROPROCESSOR | PowerPC e500 | 133MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | 3.38mm | 29mm | - | ROHS3 Compliant | ||
 MCIMX255AJM4AR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2013 | i.MX25 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX255 | S-PBGA-B400 | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | - | - | - | - | - | 26 | YES | YES | - | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | Keypad, LCD, Touchscreen | - | - | - | 1.6mm | 17mm | - | ROHS3 Compliant | ||
MPC862PCZQ66B NXP USA Inc. | 2815 |
| Datasheet | - | 357-BBGA | YES | - | - | - | -40°C~115°C TA | Tray | 2004 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC862 | S-PBGA-B357 | - | 3.465V | - | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 33MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.05mm | 25mm | - | Non-RoHS Compliant | ||
 SVF532R3K1CMK4 NXP USA Inc. | 40 | - | - | 15 Weeks | 364-LFBGA | YES | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF5xxR | e1 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | SVF532 | S-PBGA-B364 | - | 3.6V | - | 3V | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | 16 | YES | YES | 16 | FLOATING POINT | YES | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | 1.5mm | 17mm | - | ROHS3 Compliant |