- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | Communication Protocol | SATA | Height Seated (Max) | Length | RoHS Status |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() MCIMX507CVK8BR2 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 416-LFBGA | YES | - | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 416 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.5mm | 40 | MCIMX507 | S-PBGA-B416 | Not Qualified | 1.15V | - | 0.95V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | YES | - | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | Boot Security, Cryptography, Secure JTAG | LCD | - | - | 1.52mm | 13mm | ROHS3 Compliant | ||
![]() MCIMX6QP4AVT8AA NXP USA Inc. | 2953 | - | Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.4V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | 26 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
![]() MPC8378CVRAGD NXP USA Inc. | In Stock | - | Datasheet | - | 689-BBGA Exposed Pad | - | - | -40°C~125°C TA | Tray | 2012 | MPC83xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8378 | - | - | - | - | - | 400MHz | - | PowerPC e300c4s | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MPC862PZQ66B NXP USA Inc. | In Stock | - | Datasheet | - | 357-BBGA | YES | - | 0°C~105°C TA | Tray | 2004 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A991 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC862 | S-PBGA-B357 | - | 3.465V | - | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
![]() MPC8536EAVJAQGA NXP USA Inc. | In Stock | - | - | 18 Weeks | 783-BBGA, FCBGA | YES | - | 0°C~90°C TA | Tray | 2006 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | S-PBGA-B783 | - | 1.05V | 11.5/1.81.8/3.3V | 0.95V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC | - | Cryptography | - | - | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||
![]() P3041NSN1PNB NXP USA Inc. | In Stock | - | Datasheet | - | 1295-BBGA, FCBGA | - | - | 0°C~105°C TA | Tray | 2006 | QorIQ P3 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P3041 | - | - | - | - | - | 1.5GHz | - | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
![]() XPC8240RVV250E NXP USA Inc. | In Stock | - | Datasheet | - | 352-LBGA | - | - | 0°C~105°C TA | Tray | 2001 | MPC82xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | PC8240 | - | - | - | - | - | 250MHz | MICROPROCESSOR, RISC | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() LS1023ASN8KNLB NXP USA Inc. | 44 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
![]() LS1043ASE7KNLB NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 621-FBGA, FCBGA | YES | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 621 | - | - | ALSO OPERATES AT 1V NOMINAL SUPPLY | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B621 | - | 0.93V | - | 0.87V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53 | - | 64 | 16 | YES | YES | - | 32 | FIXED POINT | YES | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | 2.07mm | 21mm | ROHS3 Compliant | ||
![]() MCIMX6L2EVN10ACR NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | 432-TFBGA | - | - | -40°C~105°C TA | Tape & Reel (TR) | - | i.MX6SL | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | ROHS3 Compliant | ||
![]() LS1023ASN8QQB NXP USA Inc. | 7 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
![]() LS1043ASN8PQB NXP USA Inc. | 44 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
![]() P2041NSE7PNAC NXP USA Inc. | 100 | - | Datasheet | 12 Weeks | 780-BBGA, FCBGA | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant | ||
![]() MPC603RRX200LC NXP USA Inc. | 444 | - | Datasheet | - | 255-BCBGA, FCCBGA | - | - | 0°C~105°C TA | Tray | 1998 | MPC6xx | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | MPC603 | - | - | - | - | - | 200MHz | - | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
![]() MCIMX7D3DVK10SD NXP USA Inc. | 600 | - | - | 16 Weeks | 488-TFBGA | YES | - | 0°C~95°C TJ | Tray | 2012 | i.MX7D | - | Active | 3 (168 Hours) | 488 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.4mm | 40 | - | S-PBGA-B488 | - | 1.25V | - | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | 16 | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | 1.1mm | 12mm | ROHS3 Compliant | ||
![]() MPC8533VJALFA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | 0°C~90°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | MPC8533 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | 16 | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, PCI | - | - | - | - | - | - | 2.8mm | 29mm | ROHS3 Compliant | ||
![]() MPC8308CZQADDA NXP USA Inc. | 32 | - | - | 10 Weeks | 473-LFBGA | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Active | 3 (168 Hours) | - | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | MPC8308 | - | - | - | - | - | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
![]() SPC5200CBV400BR2 NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | 272-BBGA | YES | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MPC52xx | e0 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1.27mm | 30 | PC5200 | S-PBGA-B272 | - | 1.58V | 1.53.3V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 66MHz | 32 | 32 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | - | 2.65mm | 27mm | Non-RoHS Compliant | ||
![]() MC68360CVR25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | -40°C~85°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 1.27mm | 40 | MC68360 | S-PBGA-B357 | - | - | - | - | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CPU32+ | 25MHz | - | 32 | YES | YES | - | 32 | - | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | - | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | 2.52mm | 25mm | ROHS3 Compliant | ||
![]() T1020NSN7PQB NXP USA Inc. | 2038 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | 0°C~105°C TA | Bulk | 2002 | QorIQ T1 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | 1Gbps (12) | 2 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | SATA 3Gbps (2) | - | - | ROHS3 Compliant |