- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height Seated (Max) | Length | RoHS Status |
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![]() MPC859DSLCZP50A NXP USA Inc. | 492 | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC859 | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | 50MHz | MICROPROCESSOR, RISC | - | - | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | Non-RoHS Compliant | ||
![]() LS1021ASE7KQB NXP USA Inc. | 232 |
| Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 525 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B525 | - | 1.03V | - | 0.97V | 1.0GHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | Secure Boot, TrustZone® | - | 2D-ACE | - | SATA 6Gbps (1) | - | 2.07mm | 19mm | ROHS3 Compliant | ||
![]() MC68SEC000AE20 NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | 64-LQFP | YES | - | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Not For New Designs | 4 (72 Hours) | 64 | EAR99 | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | MC68SEC000 | S-PQFP-G64 | - | - | 5V | - | 20MHz | MICROPROCESSOR, RISC | EC000 | - | 32 | - | - | - | - | - | - | 3.3V 5.0V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() T4240NSE7QTB NXP USA Inc. | 660 |
| Datasheet | 18 Weeks | 1932-BBGA, FCBGA | YES | - | 0°C~105°C TA | Bulk | 2002 | QorIQ T4 | e1 | yes | Active | 3 (168 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 250 | 1.025V | 1mm | - | - | S-PBGA-B1932 | - | 1.055V | - | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | - | 3.33mm | 45mm | ROHS3 Compliant | ||
![]() T4240NXN7PQB NXP USA Inc. | 2689 |
| Datasheet | 18 Weeks | 1932-BBGA, FCBGA | YES | - | -40°C~105°C TA | Bulk | 2002 | QorIQ T4 | - | yes | Active | 3 (168 Hours) | - | - | - | - | BOTTOM | BALL | - | 1.025V | 1mm | - | - | S-PBGA-B1932 | - | 1.055V | - | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | - | - | - | - | SATA 3Gbps (2) | - | 3.33mm | 45mm | ROHS3 Compliant | ||
![]() MCIMX514AJM6CR2 NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | 529-LFBGA | YES | - | -40°C~125°C TJ | Tape & Reel (TR) | - | i.MX51 | e1 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | - | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | - | Keypad, LCD | - | - | - | 1.6mm | 19mm | ROHS3 Compliant | ||
![]() MC68360VR25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 357-BBGA | YES | - | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68360 | S-PBGA-B357 | - | 5.25V | - | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | - | 32 | YES | YES | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | ROHS3 Compliant | ||
![]() MPC8533EVTALF NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | 0°C~90°C TA | Tray | 2006 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | 783 | 3A001.A.3 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | MPC8533 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, PCI | Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | - | 2.8mm | 29mm | ROHS3 Compliant | ||
![]() MPC8378EVRANG NXP USA Inc. | In Stock | - | Datasheet | - | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2005 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | 689 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.05V | 1mm | - | MPC8378 | S-PBGA-B689 | - | 1.1V | - | 1V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | - | - | 15 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | - | Cryptography, Random Number Generator | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
![]() XPC8260CVVIFBC NXP USA Inc. | In Stock | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | -40°C~105°C TA | Tray | 2004 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | - | 1.9V | - | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | ROHS3 Compliant | ||
![]() MPC8358VVADDE NXP USA Inc. | In Stock | - | Datasheet | - | 740-LBGA | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | MPC8358 | - | - | - | - | - | 266MHz | - | PowerPC e300 | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC7457VG1000LC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 483-BCBGA, FCCBGA | YES | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e1 | - | Obsolete | 1 (Unlimited) | 483 | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7457 | S-CBGA-B483 | - | 1.35V | - | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | 3.2mm | 29mm | ROHS3 Compliant | ||
![]() SVF532R3K2CMK4 NXP USA Inc. | 88 |
| Datasheet | 15 Weeks | 364-LFBGA | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF5xxR | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC68EC060RC66 NXP USA Inc. | In Stock | - | Datasheet | - | 206-BPGA | - | 206-PGA (47.25x47.25) | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68EC060 | - | - | - | - | - | 66MHz | - | 68060 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
![]() MPC8266AZUPJDC NXP USA Inc. | In Stock | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 220 | - | 1.27mm | 30 | MPC8266 | S-PBGA-B480 | - | - | - | - | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | - | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
![]() LS1043AXN8KQB NXP USA Inc. | 11 | - | Datasheet | 18 Weeks | 780-FBGA, FCBGA | - | - | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | Secure Boot, TrustZone® | - | - | - | SATA 6Gbps (1) | - | - | - | ROHS3 Compliant | ||
![]() P2010NSE2KHC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | - | 1.1V | - | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | - | 16 | YES | YES | 64 | FLOATING POINT | YES | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | - | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
![]() T2080NSE8P1B NXP USA Inc. | 2043 | - | Datasheet | 18 Weeks | 896-BFBGA, FCBGA | - | - | 0°C~105°C TA | - | - | QorIQ T2 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.533GHz | - | PowerPC e6500 | - | - | - | - | - | - | - | - | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | - | DDR3, DDR3L | USB 2.0 + PHY (2) | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | - | - | - | ROHS3 Compliant | ||
![]() MCIMX6U6AVM08ADR NXP USA Inc. | 40 |
| Datasheet | 12 Weeks | 624-LFBGA | - | - | -40°C~125°C TJ | Tape & Reel (TR) | - | i.MX6DL | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC68EC060RC50 NXP USA Inc. | In Stock | - | Datasheet | - | 206-BPGA | - | 206-PGA (47.25x47.25) | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | MC68EC060 | - | - | - | - | - | 50MHz | - | 68060 | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant |