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Manufacturer

NXP Logic - Gates and Inverters

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2204 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Contact plating

Mounting Type

Surface Mount

Number of pins

Material

Housing material

Housing Material

Body material

Number of Terminals

(Select First, Then Apply Filters) Compatible Series

Application area

Backlight voltage

Cable Section

Colour

Completeness

Connector

Connector pinout layout

Contacts pitch

Diameter after shrinkage

Diameter before shrinkage

Diameter of the protected wire (cable)

Dielectric strength

Electrical mounting

Expansion range

Gross weight

Gross Weight

Head and button shape

Heatsink shape

Ihs Manufacturer

Impact resistance

Indicator type

Individual hole manufacture

Kind of connector

LED operating life

Length of fingers

Lid fastening

Load Capacitance (CL)

Manufacturer Package Code

Material finishing

Maximum voltage

Mounting

Mounting diameter

Mounting flanges

Number of fingers

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Packaging size/quantity

Part Life Cycle Code

Part Package Code

Plate thickness

Protection class

Protection level

Relative humidity

Rohs Code

Row pitch

Spatial orientation

Supply Voltage-Nom (Vsup)

Switching cycles (electrical)

Switching scheme

Transport packaging size/quantity

Transport Packaging Size/Quantity

Type of connector

Type of heatsink

Weight gross

Operating temperature

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

Part Status

ECCN Code

Type

Number of Positions

Terminal Finish

Color

HTS Code

Pitch

Packing Method

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Depth

Insulation Height

Reach Compliance Code

Current rating

Time@Peak Reflow Temperature-Max (s)

Pin Count

Termination Style

JESD-30 Code

Qualification Status

Actuator Type

Lead length

Working Voltage

Panel Cutout Dimensions

Supply Voltage-Max (Vsup)

Contact resistance

Temperature Grade

Supply Voltage-Min (Vsup)

Insulation resistance

Contact Tail Length

Number of Levels

Illumination

Contact Mating Finish

Switch type

Family

Number of Inputs

Output Characteristics

Positions Per Level

Seated Height-Max

Header Orientation

Shelf Life Start

Operating temperature range

Operating Temperature Range

Rated current

Logic IC Type

Max I(ol)

Prop. Delay@Nom-Sup

Screening Level

Propagation Delay (tpd)

Schmitt Trigger

Shrink Temperature

Quantity

Translation

Requires

Rated voltage

2nd Connector Number of Positions Loaded

Profile

Saturation Current

Contacts

Backlight color

Shrink Ratio

Diameter

Height

Length

Width

Plating thickness

Wall thickness

Material Flammability Rating

Flammability rating

74LVC1G32GX
74LVC1G32GX

NXP Semiconductors

In Stock

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5

-

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

-

Transferred

SON

-

-

-

-

Yes

-

-

3.3 V

-

-

-

-

-

-

-

-

-

-

-

e3

-

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

-

DUAL

NO LEAD

NOT SPECIFIED

1

0.48 mm

-

-

unknown

-

NOT SPECIFIED

5

-

S-PDSO-N5

-

-

-

-

-

5.5 V

-

AUTOMOTIVE

1.65 V

-

-

-

-

-

-

LVC/LCX/Z

2

-

-

0.35 mm

-

-

-

-

-

OR GATE

-

-

-

10.5 ns

-

-

-

-

-

-

-

-

1

-

-

-

-

-

0.8 mm

0.8 mm

-

-

-

-

74AHCT1G32GW
74AHCT1G32GW

NXP Semiconductors

33500

-

Datasheet

-

-

YES

-

aluminium

-

-

-

5

-

-

-

-

aluminium

-

-

-

-

-

-

-

-

-

-

700 g

-

-

grilled

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

raw

-

for back plate

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, MO-203, SOT353-1, SC-88A, 5 PIN

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

TSSOT

11.5mm

-

-

-

Yes

-

-

5 V

-

-

-

-

-

extruded

-

-

-

-

-

e3

Yes

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

-

DUAL

GULL WING

260

1

0.65 mm

-

-

compliant

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

4.5 V

-

-

-

-

-

-

AHCT/VHCT/VT

2

-

-

1.1 mm

-

-

-

-

-

OR GATE

0.008 A

10 ns

-

10 ns

NO

-

-

-

-

-

universal

-

1

-

-

-

-

67.5mm

2.05 mm

1.25 mm

-

-

-

-

74AHC1G09GW
74AHC1G09GW

NXP Semiconductors

3000

-

Datasheet

-

-

YES

-

-

-

-

anodized aluminum

5

-

general

-

-

-

ribbed composite body; two end panels; fastening kit

-

-

-

-

-

-

-

-

-

-

121.10

-

-

NXP SEMICONDUCTORS

yes

-

yes

-

-

-

2x4 screws

50 pF

-

-

-

-

-

none

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

42*28*18.5/56

Transferred

TSSOT

-

-

IP52-53

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e3

Yes

-

-

Chassis for instrumentation from aluminum profile

-

Tin (Sn)

silver

8542.39.00.01

-

TR

DUAL

GULL WING

260

1

0.65 mm

100 (body) mm

-

compliant

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

2 V

-

-

-

-

-

-

AHC/VHC/H/U/V

2

OPEN-DRAIN

-

1.1 mm

-

-

-

-

-

AND GATE

0.008 A

8.5 ns

-

12.5 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

26 mm

2.05 mm

76 mm

-

-

-

-

74HC02D
74HC02D

NXP Semiconductors

5000

-

Datasheet

-

-

YES

-

-

-

-

-

14

-

-

-

-

-

-

-

-

-

-

-

-

500VAC

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

220 VAC or 24 VDC

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

SOP

3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14

SOP14,.25

RECTANGULAR

SMALL OUTLINE

-

Transferred

SOIC

-

-

-

-

Yes

-

-

5 V

-

normally closed (NC)

60*18*12/1000

-

-

-

2.63

80±5

-

-

-

e4

Yes

-

EAR99

-

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

8542.39.00.01

-

BULK

DUAL

GULL WING

260

4

1.27 mm

-

-

unknown

-

30

14

-

R-PDSO-G14

Not Qualified

-

14 mm

-

-

6 V

-

AUTOMOTIVE

2 V

≥100 MOhm

-

-

-

-

-

HC/UH

2

-

-

1.75 mm

-

-

-

-

2.5 A

NOR GATE

0.004 A

27 ns

-

27 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

body 15.6 mm, leads 14 mm

8.65 mm

3.9 mm

-

-

-

-

74LVC1G08GM
74LVC1G08GM

NXP Semiconductors

10000

-

Datasheet

-

-

YES

-

-

-

-

-

6

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

VSON

1 X 1.45 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT-886, SON-6

SOLCC6,.04,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

-

Transferred

SON

-

-

-

-

Yes

-

-

3.3 V

-

-

-

-

-

-

-

-

-

-

-

e3

-

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

TR

DUAL

NO LEAD

260

1

0.5 mm

-

-

compliant

-

30

6

-

R-PDSO-N6

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

1.65 V

-

-

-

-

-

-

LVC/LCX/Z

2

-

-

0.5 mm

-

-

-

-

-

AND GATE

0.024 A

6 ns

-

10.5 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

1.45 mm

1 mm

-

-

-

-

74LVC1G17GV
74LVC1G17GV

NXP Semiconductors

7040

-

Datasheet

-

Through Hole

YES

-

-

-

Liquid Crystal Polymer (LCP)

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

SOT753

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, SOT-753, SC-74A, 5 PIN

TSOP5/6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SC-74A

-

-

-

-

Yes

-

-

3 V

-

-

-

-

-

-

-

-

-40°C ~ 105°C

Bulk

COMBICON PC

e3

Yes

Active

EAR99

Header, Blade Pins, Shrouded (4 Side)

4

Tin (Sn)

Black

8542.39.00.01

0.250" (6.35mm)

TR

DUAL

GULL WING

260

1

0.95 mm

-

0.402" (10.20mm)

compliant

-

30

5

Solder

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

1.65 V

-

0.102" (2.60mm)

1

-

Tin

-

LVC/LCX/Z

1

-

4

1.1 mm

90°, Right Angle

24A

-

-

-

BUFFER

0.024 A

7 ns

-

14 ns

YES

-

-

800 V

-

-

-

Copper Alloy

1

-

-

-

-

-

2.9 mm

1.5 mm

-

-

UL94 V-0

-

74LVC1G04GW-Q100
74LVC1G04GW-Q100

NXP Semiconductors

16847

-

Datasheet

-

-

YES

-

-

-

-

-

5

har-stop, 22.3mm

-

-

10-15 mm2

-

-

-

-

-

D1 - 15/ d1 - 4x5 mm

D - 35 / d - 4x14 mm

-

-

-

-

-

30.10

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

L1 = 49 +/- 5 mm

-

-

-

-

-

-

-

-

4

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5

-

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

TSSOT

-

-

-

-

Yes

-

-

3.3 V

-

-

-

80*96*27/1000

-

-

-

-

-

Bulk

har-stop

e3

-

Active

-

Heat shrink glove from TPI series with adhesive layer

-

Tin (Sn)

Black

8542.39.00.01

-

-

DUAL

GULL WING

NOT SPECIFIED

1

0.65 mm

(L) - 139 mm

-

unknown

-

NOT SPECIFIED

5

-

R-PDSO-G5

-

E-Stop, Round

-

1000 V

22.3mm (Round)

5.5 V

-

AUTOMOTIVE

1.65 V

-

-

-

Non-Illuminated

-

-

LVC/LCX/Z

1

-

-

1.1 mm

-

-

-

-40...+90 °C

-

INVERTER

-

-

AEC-Q100

9.5 ns

-

90...130 °C

fingers - 4 with length 49 ± 5 mm

-

Contact Block(s)

-

-

-

1

-

-

2:1

after shrinkage (D1) - 15; (d1) - 4x5 mm

-

L = 135 +/- 5 mm

1.25 mm

-

-

-

-

74AUP1G08GX
74AUP1G08GX

NXP Semiconductors

3540

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

HVSON,

-

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

-

Transferred

SON

-

-

-

-

Yes

-

-

1.1 V

-

-

-

-

-

-

-

-

-

-

-

e3

-

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

-

DUAL

NO LEAD

NOT SPECIFIED

1

0.48 mm

-

-

unknown

-

NOT SPECIFIED

5

-

S-PDSO-N5

-

-

-

-

-

3.6 V

-

AUTOMOTIVE

0.8 V

-

-

-

-

-

-

AUP/ULP/V

2

-

-

0.35 mm

-

-

-

-

-

AND GATE

-

-

-

24 ns

-

-

-

-

-

-

-

-

1

-

-

-

-

-

0.8 mm

0.8 mm

-

-

-

-

74HC2G08DP-Q100
74HC2G08DP-Q100

NXP Semiconductors

In Stock

-

Datasheet

-

-

YES

-

-

-

-

-

8

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

3 MM, PLASTIC, SOT505-2, TSSOP-8

-

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SOIC

-

-

-

-

-

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

DUAL

GULL WING

-

2

0.65 mm

-

-

unknown

-

-

8

-

S-PDSO-G8

-

-

-

-

-

6 V

-

AUTOMOTIVE

2 V

-

-

-

-

-

-

HC/UH

2

-

-

1.1 mm

-

-

-

-

-

AND GATE

-

-

AEC-Q100

110 ns

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3 mm

3 mm

-

-

-

-

74HCT1G14GW
74HCT1G14GW

NXP Semiconductors

18750

-

Datasheet

-

-

YES

-

-

nickel-plated brass

-

-

5

-

-

12 V

-

-

-

-

-

-

-

-

-

2000 (50 Hz / 1 min) V

-

-

14.00

-

flat ring and button

-

NXP SEMICONDUCTORS

-

ring

-

-

≥40000 hours

-

-

50 pF

-

-

-

-

16 mm

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, SC-88A, 5 PIN

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SOIC

-

IP65

-

45...85 %

Yes

-

-

5 V

≥50000

ON-(ON) non-locking

62*27.5*28/150

-

-

-

-

-

-

-

-

e3

Yes

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

TR

DUAL

GULL WING

260

1

0.65 mm

-

-

compliant

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

≤50 mΩ

AUTOMOTIVE

4.5 V

≥1000 MΩ

-

-

-

-

Vandal-resistant button series LAS2-GQPF with backlight

HCT

1

-

-

1.1 mm

-

-

-25…+55 °C

-

3 A

INVERTER

0.002 A

51 ns

-

51 ns

YES

-

-

-

-

250 V

-

-

1

3Pin+2Pin

blue

-

-

-

2 mm

1.25 mm

-

-

-

-

74AHCT1G08GV
74AHCT1G08GV

NXP Semiconductors

2254

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

SOT753

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, SC-74A, SOT-753, 5 PIN

TSOP5/6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SC-74A

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e3

Yes

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

TR

DUAL

GULL WING

260

1

0.95 mm

-

-

unknown

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

4.5 V

-

-

-

-

-

-

HCT

2

-

-

1.1 mm

-

-

-

-

-

AND GATE

0.008 A

10.5 ns

-

10.5 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

2.9 mm

1.5 mm

-

-

-

-

74LVC2G17GW
74LVC2G17GW

NXP Semiconductors

8867

-

Datasheet

-

-

YES

-

-

-

-

-

6

-

-

-

-

-

-

-

-

-

-

-

8 mm

-

-

8-20 mm

1003.57

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, SC-88, SOT-363, SMT-6

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SOT-363

-

-

-

-

Yes

-

-

1.8 V

-

-

49*34*49/22

-

-

-

-

-

-

coil 100 m

-

e3

Yes

-

-

Black PET protective braided sleeving

-

Tin (Sn)

-

8542.39.00.01

-

TR

DUAL

GULL WING

260

2

0.65 mm

-

-

compliant

-

30

6

-

R-PDSO-G6

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

1.65 V

-

-

-

-

-

-

LVC/LCX/Z

1

-

-

1.1 mm

-

-

-

-

-

BUFFER

0.024 A

7.1 ns

-

13.1 ns

YES

-

-

-

-

-

-

-

1

-

-

-

12.0 mm

-

2 mm

1.25 mm

-

0.5 mm

-

-

74LVC00ABQ-Q100
74LVC00ABQ-Q100

NXP Semiconductors

In Stock

-

Datasheet

gold-plated

-

YES

66

-

-

-

-

14

-

-

-

-

-

-

socket

2x33

2.54mm

-

-

-

-

THT

-

6.04 g

-

-

-

NXP SEMICONDUCTORS

-

-

-

female

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

-

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

-

Transferred

QFN

-

-

-

-

Yes

2.54mm

straight

3.3 V

-

-

-

-

pin strips

-

-

-40...163°C

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

QUAD

NO LEAD

NOT SPECIFIED

4

0.5 mm

-

-

unknown

1.5A

NOT SPECIFIED

14

-

R-PQCC-N14

-

-

-

-

-

3.6 V

-

AUTOMOTIVE

1.65 V

-

-

-

-

-

-

LVC/LCX/Z

2

-

-

1 mm

-

-

-

-

-

NAND GATE

-

-

AEC-Q100

9.7 ns

-

-

-

-

-

60V

-

beryllium copper

1

-

-

-

-

-

3 mm

2.5 mm

0.75µm

-

-

UL94V-0

74LVC1G332GW-Q100
74LVC1G332GW-Q100

NXP Semiconductors

In Stock

-

Datasheet

gold-plated

-

YES

38

-

-

-

-

6

-

-

-

-

-

-

socket

2x19

2.54mm

-

-

-

-

THT

-

3.48 g

-

-

-

NXP SEMICONDUCTORS

-

-

-

female

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP,

-

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

-

-

-

-

-

-

2.54mm

straight

1.8 V

-

-

-

-

pin strips

-

-

-40...163°C

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

DUAL

GULL WING

-

1

0.65 mm

-

-

unknown

1.5A

-

-

-

R-PDSO-G6

-

-

-

-

-

5.5 V

-

AUTOMOTIVE

1.65 V

-

-

-

-

-

-

LVC/LCX/Z

3

-

-

1.1 mm

-

-

-

-

-

OR GATE

-

-

AEC-Q100

21.5 ns

-

-

-

-

-

60V

-

beryllium copper

-

-

-

-

-

-

2 mm

1.25 mm

0.75µm

-

-

UL94V-0

74HC1G32GW
74HC1G32GW

NXP Semiconductors

3000

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

1.25 MM, PLASTIC, MO-203, SOT-353, SC-88A, TSSOP-5

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

TSSOT

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e3

Yes

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

-

DUAL

GULL WING

260

1

0.65 mm

-

-

compliant

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

6 V

-

AUTOMOTIVE

2 V

-

-

-

-

-

-

HC/UH

2

-

-

1.1 mm

-

-

-

-

-

OR GATE

0.002 A

27 ns

-

135 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

2.05 mm

1.25 mm

-

-

-

-

74HC10D
74HC10D

NXP Semiconductors

1071

-

Datasheet

-

-

YES

-

-

-

-

-

14

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SO-14

SOP14,.25

RECTANGULAR

SMALL OUTLINE

-

Transferred

SOIC

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e4

Yes

-

EAR99

-

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

8542.39.00.01

-

-

DUAL

GULL WING

260

3

1.27 mm

-

-

unknown

-

30

14

-

R-PDSO-G14

Not Qualified

-

-

-

-

6 V

-

AUTOMOTIVE

2 V

-

-

-

-

-

-

HC/UH

3

-

-

1.75 mm

-

-

-

-

-

NAND GATE

0.004 A

29 ns

-

29 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

8.65 mm

3.9 mm

-

-

-

-

SN54LS86J
SN54LS86J

NXP Semiconductors

In Stock

-

Datasheet

-

-

NO

-

-

-

-

-

14

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

CERAMIC, DIP-14

-

RECTANGULAR

IN-LINE

-

Obsolete

-

-

-

-

-

-

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8542.39.00.01

-

-

DUAL

THROUGH-HOLE

-

4

-

-

-

unknown

-

-

-

-

R-CDIP-T14

-

-

-

-

-

5.5 V

-

MILITARY

4.5 V

-

-

-

-

-

-

LS

2

-

-

-

-

-

-

-

-

XOR GATE

-

-

-

30 ns

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

74HCT14PW
74HCT14PW

NXP Semiconductors

239

-

Datasheet

-

-

YES

-

-

-

-

-

14

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14

TSSOP14,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

TSSOP

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e4

Yes

-

-

-

-

Nickel/Palladium/Gold (Ni/Pd/Au)

-

8542.39.00.01

-

TUBE

DUAL

GULL WING

260

6

0.65 mm

-

-

unknown

-

30

14

-

R-PDSO-G14

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

4.5 V

-

-

-

-

-

-

HCT

1

-

-

1.1 mm

-

-

-

-

-

INVERTER

0.004 A

51 ns

-

51 ns

YES

-

-

-

-

-

-

-

1

-

-

-

-

-

5 mm

4.4 mm

-

-

-

-

74AHCT1G08GW
74AHCT1G08GW

NXP Semiconductors

1492

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

TSSOT

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e3

Yes

-

EAR99

-

-

Tin (Sn)

-

8542.39.00.01

-

TR

DUAL

GULL WING

260

1

0.65 mm

-

-

compliant

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

5.5 V

-

AUTOMOTIVE

4.5 V

-

-

-

-

-

-

HCT

2

-

-

1.1 mm

-

-

-

-

-

AND GATE

0.008 A

10.5 ns

-

10.5 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

2.05 mm

1.25 mm

-

-

-

-

74HC1G04GV
74HC1G04GV

NXP Semiconductors

100

-

Datasheet

-

-

YES

-

-

-

-

-

5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NXP SEMICONDUCTORS

-

-

-

-

-

-

-

50 pF

-

-

-

-

-

-

-

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

PLASTIC, SC-74A, 5 PIN

TSOP5/6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Transferred

SOIC

-

-

-

-

Yes

-

-

5 V

-

-

-

-

-

-

-

-

-

-

-

e3

Yes

-

-

-

-

Tin (Sn)

-

8542.39.00.01

-

-

DUAL

GULL WING

260

1

0.95 mm

-

-

unknown

-

30

5

-

R-PDSO-G5

Not Qualified

-

-

-

-

6 V

-

AUTOMOTIVE

2 V

-

-

-

-

-

-

HC/UH

1

-

-

1.1 mm

-

-

-

-

-

INVERTER

0.002 A

27 ns

-

135 ns

NO

-

-

-

-

-

-

-

1

-

-

-

-

-

2.9 mm

1.5 mm

-

-

-

-

Account Center (0 Items)

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