- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Number of Channels | Interface | Max Supply Voltage | Min Supply Voltage | Analog IC - Other Type | Operating Supply Current | Max Supply Current | Adjustable Threshold | Current - Supply | Data Rate | Interface IC Type | Driver Number of Bits | Telecom IC Type | Number of Transceivers | Turn On Time | Output Peak Current Limit-Nom | Turn Off Time | Built-in Protections | Output Current Flow Direction | Number of Receive Buffers | Number of Transmit Buffers | Height Seated (Max) | Length | Width | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC33FS6511CAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCZ33811EGR2 NXP USA Inc. | In Stock | - | Datasheet | - | - | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | - | - | -40°C~125°C | Tape & Reel (TR) | 2007 | - | e3 | Obsolete | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | - | Solenoid Monitor | - | 8542.39.00.01 | 7V~17V | DUAL | GULL WING | 260 | - | - | 1.27mm | 40 | MCZ33811 | R-PDSO-G16 | Not Qualified | - | - | 57/17V | - | - | - | - | - | - | - | - | - | 1mA | - | INTERFACE CIRCUIT | 5 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS4502CAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC35FS4502NAER2 NXP USA Inc. | 49 |
| Datasheet | 16 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC35FS6502CAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCZ33742EG NXP USA Inc. | 6 | - | - | - | Surface Mount | - | SOIC | - | 28 | 756.251879mg | - | - | - | - | - | - | - | - | - | - | 125°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24V | - | - | - | - | CAN, SPI | 27V | 4.5V | - | 42mA | 45mA | - | - | 1 Mbps | - | - | - | 1 | - | - | - | - | - | 1 | 1 | - | - | - | No SVHC | RoHS Compliant | Lead Free | ||
MC33FS6510CAER2 NXP USA Inc. | 10000 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS6500LAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS6512CAE NXP USA Inc. | 199 |
| Datasheet | 16 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tray | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 UJA1131HW/3V3Y NXP USA Inc. | 32 |
| Datasheet | 6 Weeks | - | Surface Mount | 48-TQFP Exposed Pad | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | - | - | Automotive | - | - | 2V~28V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.8mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC32PF1550A0EPR2 NXP USA Inc. | 32 |
| - | 14 Weeks | - | Surface Mount | 40-VFQFN Exposed Pad | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | - | - | Active | 3 (168 Hours) | - | - | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCZ33812EK NXP USA Inc. | In Stock | - | Datasheet | - | - | Surface Mount | 32-SSOP (0.295, 7.50mm Width) Exposed Pad | YES | - | - | -40°C~125°C | Tube | 2009 | - | e3 | Discontinued | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | - | - | Automotive | - | 8542.39.00.01 | 4.7V~36V | DUAL | GULL WING | 260 | 1 | 14V | 0.65mm | 40 | MCZ33812 | R-PDSO-G32 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | 10mA | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | - | - | 3A | - | TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE | SINK | - | - | 2.45mm | 11mm | 7.5mm | - | ROHS3 Compliant | - | ||
 MC34910G5ACR2 NXP USA Inc. | 32 |
| Datasheet | 12 Weeks | - | Surface Mount | 32-LQFP | YES | - | - | -40°C~85°C | Tape & Reel (TR) | 2004 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | - | - | System Basis Chip | - | 8542.39.00.01 | 5.5V~27V | QUAD | GULL WING | 260 | 1 | 13.5V | 0.8mm | 40 | MC34910 | S-PQFP-G32 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | 4.5mA | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | - | 10 μs | 0.11A | 10 μs | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | - | - | 1.6mm | 7mm | 7mm | - | ROHS3 Compliant | - | ||
 MC13892BJVL NXP USA Inc. | In Stock | - | Datasheet | - | - | Surface Mount | 186-LFBGA | - | - | - | -40°C~85°C | Tray | 2004 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | - | - | - | - | - | - | - | - | MC13892 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS6511NAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS4502NAE NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tray | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC33FS4502NAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC34PF3000A2EPR2 NXP USA Inc. | 32 | - | Datasheet | 16 Weeks | - | Surface Mount | 48-VFQFN Exposed Pad | YES | - | - | -40°C~105°C | Tape & Reel (TR) | 2014 | - | - | Active | 3 (168 Hours) | 48 | EAR99 | - | - | - | i.MX Processors | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | 260 | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | - | - | 4.5V | - | 2.8V | 12 | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.9mm | 7mm | 7mm | - | ROHS3 Compliant | - | ||
MC33FS6523NAE NXP USA Inc. | 884 |
| Datasheet | 17 Weeks | - | Surface Mount | 48-LQFP Exposed Pad | - | - | - | -40°C~125°C | Tray | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | System Basis Chip | - | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MC34VR5100A0EPR2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | - | Surface Mount | 48-VFQFN Exposed Pad | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | - | - | - | Active | 3 (168 Hours) | - | EAR99 | - | - | - | LS1 Communication Processors | - | 8542.39.00.01 | 2.8V~4.5V | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | SWITCHING REGULATOR | - | - | - | 450μA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |