- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Applications | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Adjustable Threshold | Current - Supply | Interface IC Type | Telecom IC Type | Turn On Time | Output Peak Current Limit-Nom | Turn Off Time | Built-in Protections | Output Current Flow Direction | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC34904C5EK NXP USA Inc. | In Stock | - | Datasheet | 16 Weeks | Surface Mount | 32-SSOP (0.295, 7.50mm Width) Exposed Pad | - | Industrial grade | -40°C~125°C | Tube | 2009 | - | - | Obsolete | 3 (168 Hours) | - | EAR99 | - | System Basis Chip | 8542.39.00.01 | 5.5V~28V | - | - | - | - | - | - | - | MC34904 | - | - | - | - | - | - | - | - | 2mA | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34PF1550A1EPR2 NXP USA Inc. | 7 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tape & Reel (TR) | - | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC35FS4501NAER2 NXP USA Inc. | 23 |
| Datasheet | 17 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS4501CAER2 NXP USA Inc. | 7 |
| Datasheet | 17 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6512NAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS4503NAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6512CAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6502NAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6501CAER2 NXP USA Inc. | 32 |
| Datasheet | 15 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS4502CAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34709VKR2 NXP USA Inc. | In Stock | - | Datasheet | 16 Weeks | Surface Mount | 130-LFBGA | YES | - | -40°C~85°C | Tape & Reel (TR) | 2004 | - | e1 | Active | 3 (168 Hours) | 130 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | Processor | 8542.39.00.01 | 3V~4.5V | BOTTOM | BALL | 260 | 1 | 3.6V | 0.5mm | 40 | MC34709 | S-PBGA-B130 | Not Qualified | 4.5V | 3/4.5V | 3V | 15 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | 370μA | - | - | - | - | - | - | - | 1.25mm | 8mm | 8mm | ROHS3 Compliant | ||
MC35FS6513NAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 UJA1131HW/FD/5V/4Y NXP USA Inc. | 32 |
| Datasheet | 6 Weeks | Surface Mount | 48-TQFP Exposed Pad | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | Automotive | - | 2V~28V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.8mA | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6500NAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33FS6503CAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~125°C | Tape & Reel (TR) | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1550A4EPR2 NXP USA Inc. | 32 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tape & Reel (TR) | - | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33FS6511NAE NXP USA Inc. | 10000 |
| Datasheet | 17 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~125°C | Tray | 2017 | - | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC33910G5ACR2 NXP USA Inc. | 4000 |
| Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | - | -40°C~125°C | Tape & Reel (TR) | 2004 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | System Basis Chip | 8542.39.00.01 | 5.5V~27V | QUAD | GULL WING | 260 | 1 | 13.5V | 0.8mm | 40 | MC33910 | S-PQFP-G32 | Not Qualified | - | - | - | - | - | - | 4.5mA | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | 10 μs | 0.11A | 10 μs | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC35FS4500NAER2 NXP USA Inc. | 32 |
| Datasheet | 17 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC35FS6503CAER2 NXP USA Inc. | 32 |
| Datasheet | 16 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | - | - | System Basis Chip | - | 1V~5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | INTERFACE CIRCUIT | - | - | - | - | - | - | - | - | ROHS3 Compliant |