- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Published | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Applications | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Adjustable Threshold | Current - Supply | Telecom IC Type | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC33PF8100CCES NXP USA Inc. | 7497 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | Automotive grade | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | - | - | - | High Performance i.MX 8, S32x Processor Based | - | 2.5V~5.5V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200A0ES NXP USA Inc. | 5000 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | Automotive grade | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | - | - | - | High Performance i.MX 8, S32x Processor Based | - | 2.5V~5.5V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC33909L3ADR2 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | YES | - | -40°C~125°C | Tape & Reel (TR) | - | e3 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | System Basis Chip | 8542.39.00.01 | 3.5V~28V | QUAD | GULL WING | 260 | 1 | 0.5mm | 40 | - | S-PQFP-G48 | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NO | 7mA | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC33909D5AD NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | YES | - | -40°C~125°C | Tray | - | e3 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | System Basis Chip | 8542.39.00.01 | 3.5V~28V | QUAD | GULL WING | 260 | 1 | 0.5mm | 40 | - | S-PQFP-G48 | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NO | 7mA | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC33909Q3ADR2 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | YES | - | -40°C~125°C | Tape & Reel (TR) | - | e3 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | System Basis Chip | 8542.39.00.01 | 3.5V~28V | QUAD | GULL WING | 260 | 1 | 0.5mm | 40 | - | S-PQFP-G48 | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NO | 7mA | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC33909L5AD NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | YES | - | -40°C~125°C | Tray | - | e3 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | System Basis Chip | 8542.39.00.01 | 3.5V~28V | QUAD | GULL WING | 260 | 1 | 0.5mm | 40 | - | S-PQFP-G48 | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NO | 7mA | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC33909D5ADR2 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 48-LQFP Exposed Pad | YES | - | -40°C~125°C | Tape & Reel (TR) | - | e3 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | System Basis Chip | 8542.39.00.01 | 3.5V~28V | QUAD | GULL WING | 260 | 1 | 0.5mm | 40 | - | S-PQFP-G48 | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NO | 7mA | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 TDA3682ST/N1C,112 NXP USA Inc. | In Stock | - | Datasheet | - | Through Hole | 13-SIP Formed Leads | - | - | -40°C~85°C | Tube | 2000 | - | Obsolete | 1 (Unlimited) | - | - | - | Automotive | - | 11.4V~18V | - | - | - | - | - | - | TDA3682 | - | - | - | - | - | - | 120μA | - | - | - | - | ROHS3 Compliant | ||
 TDA3683SD/N2S,112 NXP USA Inc. | In Stock | - | Datasheet | - | Through Hole | 23-SIP Formed Leads | - | - | -40°C~85°C | Tube | 2001 | - | Obsolete | 1 (Unlimited) | - | - | - | Ignition Buffer, Regulator | - | 9V~18V | - | - | - | - | - | - | TDA3683 | - | - | - | - | - | - | 300μA | - | - | - | - | Non-RoHS Compliant | ||
 MWCT1013VLHSTR NXP USA Inc. | In Stock | - | - | - | Surface Mount | 64-LQFP | - | - | -40°C~105°C TA | Tape & Reel (TR) | - | - | Obsolete | 1 (Unlimited) | - | - | - | General Purpose | - | 2.7V~3.6V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | ||
 TDA3618AJR/N3C,112 NXP USA Inc. | In Stock | - | Datasheet | - | Through Hole | 17-SIP Formed Leads | - | - | -40°C~85°C | Tube | 2001 | - | Obsolete | 1 (Unlimited) | - | - | - | Automotive | - | 11V~18V | - | - | - | - | - | - | TDA3618 | - | - | - | - | - | - | 400μA | - | - | - | - | ROHS3 Compliant | ||
 NX2A4WPZ NXP USA Inc. | 910 | - | Datasheet | - | Surface Mount | 42-UFBGA, WLCSP | - | - | -40°C~85°C | Bulk | - | - | Obsolete | 1 (Unlimited) | - | - | - | Wireless Power Receiver | - | 6.1V~18V | - | - | - | - | - | - | - | - | - | - | - | - | - | 12mA | - | - | - | - | ROHS3 Compliant | ||
 PCA9420UKZ NXP USA Inc. | 3 |
| Datasheet | 10 Weeks | Surface Mount | 25-UFBGA, WLCSP | - | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | - | - | Active | 1 (Unlimited) | - | - | - | Microcontroller, MCU | - | 3.3V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC32PF1510A3EP NXP USA Inc. | 10086 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tray | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A4EP NXP USA Inc. | 10 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A6EP NXP USA Inc. | 459 | - | Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | Industrial grade | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34PF8100CCEP NXP USA Inc. | 1300 |
| Datasheet | 8 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | - | - | - | High Performance i.MX 8, S32x Processor Based | - | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC32PF1510A1EP NXP USA Inc. | 9 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | Industrial grade | -40°C~85°C | Tray | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A1EP NXP USA Inc. | 9 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V~7V | - | - | 260 | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34PF3000A8EP NXP USA Inc. | 25 |
| Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | - | - | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | - | EAR99 | - | i.MX Processors | 8542.39.00.01 | 2.8V~5.5V | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant |