- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Input Voltage-Nom | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Speed | uPs/uCs/Peripheral ICs Type | Adjustable Threshold | Clock Frequency | Current - Supply | Input Voltage (Min) | Has ADC | DMA Channels | PWM Channels | Output Current-Max | Input Voltage (Max) | DAC Channels | Control Technique | Switcher Configuration | Interface IC Type | Switching Frequency-Max | Driver Number of Bits | Turn On Time | Output Peak Current Limit-Nom | Turn Off Time | ROM Programmability | Built-in Protections | Output Current Flow Direction | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC33816AE NXP USA Inc. | 5000 |
| - | 18 Weeks | Surface Mount | 64-LQFP Exposed Pad | YES | - | - | - | Automotive grade | -40°C~125°C | Tray | 2012 | - | e3 | Active | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | Solenoid Controller | - | 8542.39.00.01 | - | QUAD | GULL WING | 260 | 1 | 5V | 0.5mm | 40 | - | S-PQFP-G64 | - | - | 5.25V | - | - | 4.75V | - | ANALOG CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC32PF3001A3EP NXP USA Inc. | 39 |
| Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | - | - | - | -40°C~85°C | Tray | 2011 | - | - | Active | 3 (168 Hours) | 48 | EAR99 | - | Processor | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | - | - | 4.5V | - | - | 2.8V | 10 | POWER SUPPLY SUPPORT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC33912BACR2 NXP USA Inc. | 6391 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | - | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2003 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | System Basis Chip | - | 8542.39.00.01 | 5.5V~27V | QUAD | GULL WING | 260 | 1 | 13.5V | 0.8mm | 40 | MC33912 | S-PQFP-G32 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | 4.5mA | - | - | - | - | - | - | - | - | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | 10 µs | 0.11A | 10 µs | - | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC34VR5100A1EP NXP USA Inc. | 1318 | - | - | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | - | - | - | - | - | -40°C~105°C TA | Tray | 2016 | - | - | Active | 3 (168 Hours) | - | EAR99 | - | LS1 Communication Processors | - | 8542.39.00.01 | 2.8V~4.5V | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | SWITCHING REGULATOR | - | - | - | - | 450μA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF3000A3EP NXP USA Inc. | 24 | - | Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | - | - | Industrial grade | -40°C~85°C | Tray | 2008 | - | - | Active | 3 (168 Hours) | 48 | EAR99 | - | i.MX Processors | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | 260 | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | - | - | 4.5V | - | - | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||
 MWPR1516CFM NXP USA Inc. | 1865 | - | - | 22 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | 13 | 85°C | -40°C | - | - | Tray | 2002 | - | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | Wireless Power Receiver | - | 8542.31.00.01 | 3.5V~20V | QUAD | NO LEAD | 260 | - | 3.3V | 0.5mm | 40 | - | S-XQCC-N32 | - | - | - | - | INDUSTRIAL | - | - | - | 24 MHz | MICROCONTROLLER, RISC | - | 24MHz | 120mA | - | YES | NO | NO | - | - | NO | - | - | - | - | - | - | - | - | FLASH | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC34VR500V5ES NXP USA Inc. | 544 |
| Datasheet | 16 Weeks | Surface Mount | 56-VFQFN Exposed Pad | YES | - | - | - | Automotive grade | -40°C~105°C TA | Tray | 2011 | - | - | Active | 3 (168 Hours) | 56 | EAR99 | - | QorlQ LS1/T1 Communications Processors | ALSO OPRTS W/T CONTROL TECH PFM; ALSO OPRTS IN ADJ MODE FROM 0.625 TO 1.975V | 8542.39.00.01 | 2.8V~4.5V | QUAD | NO LEAD | NOT SPECIFIED | 1 | - | 0.5mm | NOT SPECIFIED | - | S-XQCC-N56 | Not Qualified | 3.6V | - | 2.8/4.5V | - | - | - | SWITCHING REGULATOR | - | - | - | - | 2A | 2.8V | - | - | - | 13.7A | 4.5V | - | PULSE WIDTH MODULATION | BUCK | - | 4000kHz | - | - | - | - | - | - | - | 0.9mm | 8mm | 8mm | ROHS3 Compliant | ||
 MC32PF1550A4EP NXP USA Inc. | 490 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | - | - | - | -40°C~85°C | Tray | - | - | - | Active | 3 (168 Hours) | - | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC33816AER2 NXP USA Inc. | 6000 | - | Datasheet | 18 Weeks | Surface Mount | 64-LQFP Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2011 | Automotive, AEC-Q100 | e3 | Active | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | Solenoid Controller | - | 8542.39.00.01 | 5V~32V | QUAD | GULL WING | 260 | 1 | 5V | 0.5mm | 40 | - | S-PQFP-G64 | - | - | 5.25V | - | - | 4.75V | - | ANALOG CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC34VR500V3ES NXP USA Inc. | 150 |
| Datasheet | 16 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2011 | - | e3 | Active | 3 (168 Hours) | 56 | EAR99 | Tin (Sn) | QorlQ LS1/T1 Communications Processors | ALSO OPRTS W/T CONTROL TECH PFM; ALSO OPRTS IN ADJ MODE FROM 0.625 TO 1.975V | 8542.39.00.01 | 2.8V~4.5V | QUAD | NO LEAD | 260 | 1 | - | 0.5mm | 40 | - | S-XQCC-N56 | Not Qualified | 3.6V | - | 2.8/4.5V | - | - | - | SWITCHING REGULATOR | - | - | - | - | 250μA | 2.8V | - | - | - | 13.7A | 4.5V | - | PULSE WIDTH MODULATION | BUCK | - | 4000kHz | - | - | - | - | - | - | - | 0.9mm | 8mm | 8mm | ROHS3 Compliant | ||
 MC13892CJVK NXP USA Inc. | 10086 |
| - | 12 Weeks | Surface Mount | 139-TFBGA | YES | - | - | - | - | -40°C~85°C | Tray | 2004 | - | e1 | Active | 3 (168 Hours) | 139 | EAR99 | TIN SILVER COPPER | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 1 | 3.6V | 0.5mm | 40 | MC13892 | S-PBGA-B139 | Not Qualified | - | 3.6V | 3.6V | - | 1.8V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 7mm | 7mm | ROHS3 Compliant | ||
 MCZ33810EKR2 NXP USA Inc. | 1500 |
| Datasheet | 12 Weeks | Surface Mount | 32-SSOP (0.295, 7.50mm Width) Exposed Pad | YES | - | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2006 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | Automotive | - | 8542.39.00.01 | 4.5V~36V | DUAL | GULL WING | 260 | 1 | 13V | 0.65mm | 40 | MCZ33810 | R-PDSO-G32 | Not Qualified | - | - | 3.3/59/18V | - | - | - | - | - | - | - | - | 10mA | - | - | - | - | 1A | - | - | - | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | 8 | 5 µs | 6A | 5 µs | - | TRANSIENT; OVER CURRENT | SINK | 2.45mm | 11mm | 7.5mm | ROHS3 Compliant | ||
MC32PF4210A1ES NXP USA Inc. | 1040 | - | Datasheet | 12 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | - | - | - | - | 0°C~85°C TA | Tray | 2018 | - | - | Active | 3 (168 Hours) | - | - | - | Audio, Video | - | - | 2.8V~4.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC33813AER2 NXP USA Inc. | 8000 | - | - | 18 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | - | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2004 | - | e3 | Active | 3 (168 Hours) | - | EAR99 | Matte Tin (Sn) | Small Engine | - | 8542.39.00.01 | 4.5V~36V | - | - | 260 | - | - | - | 40 | MC33813 | - | - | - | - | - | - | - | - | ANALOG CIRCUIT | - | - | - | - | 10mA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MWCT1013AVLH NXP USA Inc. | 824 |
| - | 13 Weeks | Surface Mount | 64-LQFP | - | - | - | - | - | -40°C~105°C TA | Tray | 2016 | Automotive, AEC-Q100 | - | Active | 3 (168 Hours) | - | EAR99 | - | Automotive | - | 8542.39.00.01 | 2.7V~3.6V | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33911BACR2 NXP USA Inc. | 2281 |
| Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | - | - | - | - | -40°C~125°C | Tape & Reel (TR) | 2004 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | System Basis Chip | - | 8542.39.00.01 | 5.5V~27V | QUAD | GULL WING | 260 | 1 | 13.5V | 0.8mm | 40 | MC33911 | S-PQFP-G32 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | 4.5mA | - | - | - | - | - | - | - | - | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | 10 µs | 0.11A | 10 µs | - | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC32PF3000A5EP NXP USA Inc. | 2300 |
| Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | - | - | Commercial grade | -40°C~85°C | Tray | 2011 | - | - | Active | 3 (168 Hours) | 48 | EAR99 | - | i.MX Processors | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | 260 | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | - | - | 4.5V | - | - | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||
MC32PF3001A7EP NXP USA Inc. | 2300 | - | Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | - | - | - | -40°C~85°C | Tray | 2009 | - | - | Active | 3 (168 Hours) | 48 | EAR99 | - | Processor | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | - | - | 4.5V | - | - | 2.8V | 10 | POWER SUPPLY SUPPORT CIRCUIT | - | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC33PF8100A0ES NXP USA Inc. | 520 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | - | - | Automotive grade | -40°C~105°C TA | Tray | - | - | - | Active | 3 (168 Hours) | - | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34910G5AC NXP USA Inc. | 32 |
| Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | - | - | - | - | -40°C~85°C | Tray | 2004 | - | e3 | Active | 3 (168 Hours) | 32 | EAR99 | MATTE TIN | System Basis Chip | - | 8542.39.00.01 | 5.5V~27V | QUAD | GULL WING | 260 | 1 | 13.5V | 0.8mm | 40 | MC34910 | S-PQFP-G32 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | 4.5mA | - | - | - | - | - | - | - | - | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | 10 μs | 0.11A | 10 μs | - | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 1.6mm | 7mm | 7mm | ROHS3 Compliant |