- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Operating Temperature | Packaging | Published | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | uPs/uCs/Peripheral ICs Type | Adjustable Threshold | Current - Supply | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC32PF8121F1EP NXP USA Inc. | 1288 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | - | Industrial, IoT | - | - | 2.7V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC32PF8121F2EP NXP USA Inc. | 25 |
| Datasheet | 26 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | - | - | Industrial, IoT | - | - | 2.7V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8200D2ES NXP USA Inc. | 10000 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8200DEES NXP USA Inc. | 240 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 TDA3616SF/N1,112 NXP USA Inc. | In Stock | - | Datasheet | - | Through Hole | 9-SIP Exposed Tab | - | 9-SIL MPF | -40°C~105°C | Tube | 1999 | Obsolete | 1 (Unlimited) | - | - | Processor | - | - | 5.6V~25V | - | - | - | - | - | - | - | TDA3616 | - | - | - | - | - | - | - | 95μA | - | - | - | ROHS3 Compliant | ||
 MC34PF1510A5EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A3EPR2 NXP USA Inc. | 10000 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1510A2EP NXP USA Inc. | 16 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tray | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1510A5EPR2 NXP USA Inc. | 16 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1550A7EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1510A7EP NXP USA Inc. | 100000 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tray | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A5EP NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tray | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1510A2EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~85°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC34PF1510A7EP NXP USA Inc. | 548 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tray | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC33PF3000A7ESR2 NXP USA Inc. | 544 |
| Datasheet | 16 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | -40°C~105°C | Tape & Reel (TR) | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | i.MX Processors | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 8542.39.00.01 | 2.8V~5.5V | QUAD | NO LEAD | 260 | 1 | 3.6V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N48 | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | - | YES | - | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||
MC34PF1550A6EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | - | -40°C~105°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | - | 3.8V~7V | - | - | 260 | - | - | - | 40 | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34PF8100CHEP NXP USA Inc. | 16 |
| Datasheet | 8 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8100CHES NXP USA Inc. | 9 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8100ERES NXP USA Inc. | 25 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | High Performance i.MX 8, S32x Processor Based | - | - | 2.7V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
 MWCT1014SFVLH NXP USA Inc. | 26400 |
| Datasheet | 15 Weeks | Surface Mount | 64-LQFP | - | - | -40°C~105°C TA | Tray | - | Active | 3 (168 Hours) | - | - | General Purpose | - | - | 2.7V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROCONTROLLER, RISC | - | - | - | - | - | ROHS3 Compliant |