- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Usage Level | Operating Temperature | Packaging | Part Status | Moisture Sensitivity Level (MSL) | Applications | Voltage - Supply | Peak Reflow Temperature (Cel) | Time@Peak Reflow Temperature-Max (s) | Analog IC - Other Type | uPs/uCs/Peripheral ICs Type | Current - Supply | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MWCT1014SFVLL NXP USA Inc. | 472 |
| Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | General Purpose | 2.7V~5.5V | - | - | - | MICROCONTROLLER, RISC | - | ROHS3 Compliant | ||
 MC32PF1510A4EPR2 NXP USA Inc. | In Stock | - | Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tape & Reel (TR) | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC32PF1510A7EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tape & Reel (TR) | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC32PF1510A6EPR2 NXP USA Inc. | 46 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tape & Reel (TR) | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC32PF1510A4EP NXP USA Inc. | 100000 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tray | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34PF1550A5EPR2 NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~105°C | Tape & Reel (TR) | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34PF1510A3EP NXP USA Inc. | 1087 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~105°C | Tray | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34PF1550A7EP NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~105°C | Tray | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34PF1550A5EP NXP USA Inc. | 25 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~105°C | Tray | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
 MC34PF8100EREP NXP USA Inc. | 25 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ||
MC34PF8100EPEP NXP USA Inc. | 380 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | Industrial grade | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ||
MC33PF8200ETES NXP USA Inc. | 16 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ||
 MWCT1014SFVLHN NXP USA Inc. | 25 |
| Datasheet | 13 Weeks | Surface Mount | 64-LQFP | - | -40°C~105°C TA | Tray | Active | - | General Purpose | 2.7V~5.5V | - | - | - | - | - | ROHS3 Compliant | ||
MWCT1014SFVLLN NXP USA Inc. | 25 |
| Datasheet | 13 Weeks | Surface Mount | 100-LQFP | - | -40°C~105°C TA | Tray | Active | - | General Purpose | 2.7V~5.5V | - | - | - | MICROCONTROLLER, RISC | - | ROHS3 Compliant | ||
MC33PF8200ESES NXP USA Inc. | 9104 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ||
MC33PF8100CFES NXP USA Inc. | 100 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ROHS3 Compliant | ||
 MC32PF4210A3ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | 0°C~85°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | Audio, Video | 2.8V~4.5V | 260 | 40 | POWER SUPPLY SUPPORT CIRCUIT | - | - | ROHS3 Compliant | ||
MC32PF4210A4ESR2 NXP USA Inc. | 25 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | 0°C~85°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | Audio, Video | 2.8V~4.5V | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34PF4210A4ESR2 NXP USA Inc. | 25 |
| Datasheet | 12 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | Audio, Video | 2.8V~4.5V | - | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | ROHS3 Compliant | ||
MC34VR500VAESR2 NXP USA Inc. | 100000 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | - | - | - | - | 15mA | ROHS3 Compliant |