- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Applications | Voltage - Supply | Peak Reflow Temperature (Cel) | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Analog IC - Other Type | Current - Supply | Interface IC Type | Telecom IC Type | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC33PF8200DFES NXP USA Inc. | 32 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
 MC34PF1510A2EPR2 NXP USA Inc. | 49 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~105°C | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC32PF1510A5EP NXP USA Inc. | 100000 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~85°C | Tray | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC34PF1510A2EP NXP USA Inc. | 399 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC34PF1550A6EP NXP USA Inc. | 3920 | - | Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~105°C | Tray | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC33PF8100EAES NXP USA Inc. | 29 | - | Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
 MC33287DWR2 NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | -40°C~125°C | Tape & Reel (TR) | 2002 | - | Obsolete | 1 (Unlimited) | Contact Monitor | 7V~18V | - | unknown | - | MC33287 | - | 55μA | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | Non-RoHS Compliant | ||
MC34PF1510A7EPR2 NXP USA Inc. | 32 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~105°C | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC34PF8100CFEP NXP USA Inc. | 32 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
MC34PF8100EQEP NXP USA Inc. | 896 |
| Datasheet | 8 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | -40°C~105°C TA | Tray | - | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
MC32PF1550A6EPR2 NXP USA Inc. | 32 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC32PF1550A5EPR2 NXP USA Inc. | 23 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
 MC34PF1550A8EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~105°C TA | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
MC32PF1510A6EP NXP USA Inc. | 468 | - | Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~85°C TA | Tray | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MWCT1012VLFR NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 48-LQFP | -40°C~105°C TA | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Wireless Power Transmitter | 3V~3.6V | - | - | - | - | - | 1.7mA | - | TELECOM CIRCUIT | ROHS3 Compliant | ||
MC32PF1550A9EP NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 40-VFQFN Exposed Pad | -40°C~85°C TA | Tray | - | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
MC32PF8121F1EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | -40°C~85°C TA | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | Industrial, IoT | 2.5V~5.5V | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | ||
 MC32PF4210A2ES NXP USA Inc. | 32 |
| Datasheet | 12 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 0°C~85°C TA | Tray | - | - | Active | 3 (168 Hours) | Audio, Video | 2.8V~4.5V | 260 | - | 40 | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC33PF8101A0ESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | -40°C~105°C TA | Tape & Reel (TR) | - | - | Active | 3 (168 Hours) | High Performance i.MX 8 Processor Based | 2.5V~5.5V | 260 | - | 40 | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | ROHS3 Compliant | ||
MC33PT2001MAER2 NXP USA Inc. | 32 |
| Datasheet | 28 Weeks | Surface Mount | 64-LQFP Exposed Pad | -40°C~125°C TA | - | - | Automotive, AEC-Q100 | Active | - | Automotive, Solenoid Controller | 0V~72V | - | - | - | - | ANALOG CIRCUIT | - | - | - | - |