- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Applications | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | uPs/uCs/Peripheral ICs Type | Adjustable Threshold | Current - Supply | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC34PF8100EREPR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC34PF8100CHEPR2 NXP USA Inc. | 40 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8100A0ESR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8100EQESR2 NXP USA Inc. | 4000 | - | Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | YES | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | 56 | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | QUAD | NO LEAD | - | 1 | 5V | 0.5mm | - | S-PQCC-N56 | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | - | YES | - | 1mm | 8mm | 8mm | - | ||
MC33PF8100ERESR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC34VR500VAES NXP USA Inc. | 100000 | - | Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | - | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 15mA | - | - | - | ROHS3 Compliant | ||
MC33PF8200A0ESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200DEESR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200DFESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200CXESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8200DHESR2 NXP USA Inc. | 100000 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8200DBESR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | - | ||
MC33PF8200DNESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | - | - | - | - | - | Tape & Reel (TR) | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200DMESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | - | - | - | - | - | Tape & Reel (TR) | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
 MWCT1014SFVLLR NXP USA Inc. | 12000 |
| Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | Automotive, Wireless Power Transmitter | 2.7V~5.5V | - | - | - | - | - | - | - | - | - | - | - | - | MICROCONTROLLER, RISC | - | - | - | - | - | ROHS3 Compliant | ||
MWCT1011A3VLH NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | - | - | - | - | - | Tray | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200ETESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8200DNES NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | - | - | - | - | - | Tray | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant | ||
MWCT1023IFVLL NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 100-LQFP | - | - | -40°C~105°C TA | Tray | Active | 3 (168 Hours) | - | Microcontroller, MCU | 1.71V~3.6V | - | - | - | - | - | - | - | - | - | - | - | - | MICROCONTROLLER, RISC | - | - | - | - | - | ROHS3 Compliant | ||
MC33PF8201A0ESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | - | -40°C~105°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | - | High Performance i.MX 8 Processor Based | 2.5V~5.5V | - | - | 260 | - | - | - | 40 | - | - | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - | - | - | ROHS3 Compliant |