- Moisture Sensitivity Level (MSL)
- Mounting Type
- Package / Case
- Packaging
- Part Status
- Applications
- RoHS Status
- Factory Lead Time
- Operating Temperature
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- Published
Attribute column
Manufacturer
NXP PMIC - Power Management - Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Usage Level | Operating Temperature | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Applications | Voltage - Supply | Peak Reflow Temperature (Cel) | Time@Peak Reflow Temperature-Max (s) | Analog IC - Other Type | Telecom IC Type | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC32PF1550A7EPR2 NXP USA Inc. | 32 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
 MC32PF1550A9EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC32PF1550A7EP NXP USA Inc. | 32 |
| - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tray | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
 MWCT1011BVLHR NXP USA Inc. | 8550 |
| - | 12 Weeks | Surface Mount | 64-LQFP | - | - | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Wireless Charging | - | - | - | - | - | ROHS3 Compliant | ||
MC32PF1550A5EP NXP USA Inc. | In Stock | - | - | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C | Tray | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
MC32PF8121A0EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Industrial, IoT | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC32PF1550A8EP NXP USA Inc. | 49 |
| Datasheet | 14 Weeks | Surface Mount | 40-VFQFN Exposed Pad | - | -40°C~85°C TA | Tray | - | Active | 3 (168 Hours) | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC32PF8121F2EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Industrial, IoT | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC32PF8121EUEPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | Industrial, IoT | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC33PT2001AER2 NXP USA Inc. | 3000 | - | Datasheet | 28 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | -40°C~125°C TA | - | Automotive, AEC-Q100 | Active | - | Automotive, Solenoid Controller | 0V~72V | - | - | ANALOG CIRCUIT | - | - | ||
MC33VR5500V1ESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | - | - | - | - | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | - | - | - | - | ROHS3 Compliant | ||
MC33VR5500V0ESR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | - | - | - | - | Tape & Reel (TR) | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | ||
MWCT1R24ZVHT NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | - | - | - | - | Tray | - | Active | 3 (168 Hours) | - | - | - | - | - | TELECOM CIRCUIT | - | ||
MC34PF8100EPEPR2 NXP USA Inc. | 100000 | - | Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
MC34PF8100CFEPR2 NXP USA Inc. | 49 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
MC34PF8100A0EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | ||
MC34PF8100CCEPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
MC33PF8100CHESR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant | ||
MC34PF8100EQEPR2 NXP USA Inc. | 49 | - | Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | - | - | ROHS3 Compliant | ||
MC34PF8100F3EPR2 NXP USA Inc. | 32 |
| Datasheet | 2 Weeks | Surface Mount | 56-VFQFN Exposed Pad | - | -40°C~105°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | - | ROHS3 Compliant |