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  • Minimum Operating Supply Voltage
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  • Operating Temperature
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  • Supplier Package
  • Typical Operating Supply Voltage
  • Maximum Data Rate

Attribute column

Manufacturer

NXP Power over Ethernet (PoE)

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7 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Mounting Type

Mounting Feature

Shell/Shielding Material

Category

Maximum Data Rate

Maximum Operating Supply Voltage

Mfr

Minimum Operating Supply Voltage

Mounting

Package

Product Status

Qualification

RoHS

Supplier Package

Typical Operating Supply Voltage

Usage Level

Voltage Rated

Operating Temperature

Packaging

Series

Part Status

Termination

Temperature Coefficient

Connector Type

Type

Resistance

Color

Gender

Power Rating

Shielding

Ingress Protection

Resistor Type

Current Rating

Insulation Color

Pin Count

Contact Finish

Number of Contacts

Wire Gauge

Operating Supply Current

Number of Ports

Mating Cycles

Insulation

Terminal Type

Specifications

Screening Level

Number of Wire Entries

Resistance Tolerance

Features

Power Supply Type

Product Length

Product Width

Material Flammability Rating

In Stock

-

-

-

-

-

HITAG Reader Chip

-

5.5 V

-

4.5 V

Surface Mount

-

-

AEC-Q200

Compliant

SOIC

5.0000 V

Industrial grade

-

-40 to 85 °C

-

-

-

-

25 ppm/K

-

HITAG Reader Chip

33 kOhm

-

-

0.4 W

-

-

Sulfur Resistant

-

-

14

-

-

-

4 mA

-

-

-

-

-

Industrial

-

0.1

-

Analog

3.2 mm

1.6 mm

-

In Stock

-

-

-

-

-

LIN Core System

1 Mbps

28 V

-

4.5 V

Surface Mount

-

-

-

-

HTSSOP EP

5, 9, 12, 15, 18, 24 V

-

-

-40 to 125 °C

-

-

-

-

100.0000 ppm/°C

-

LIN Core System

68.1 Ohm

-

-

0.25 W

-

-

High Reliability, MIL-PRF-39017

-

-

32

-

-

-

0.075 mA

-

-

-

-

-

-

-

1

-

Analog

7.62

-

-

In Stock

-

-

-

-

-

Smart Label IC

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Bulk

--

Active

Crimp

-

-

Smart Label IC

-

Blue, Blue Stripe

-

-

-

-

-

-

-

-

-

-

16-20 AWG

-

-

-

Fully Insulated Heat Shrink

Butt Splice, Inline, Individual Openings

-

-

2

-

--

-

-

-

-

In Stock

-

-

-

-

-

CAN/Dual LIN Core System

1 Mbps

28 V

PEI-Genesis

4.5 V

Surface Mount

Bulk

Active

-

-

HTSSOP

5, 9, 12, 15, 18, 24 V

-

-

-40 to 125 °C

-

*

-

-

-

-

CAN/Dual LIN Core System

-

-

-

-

-

-

-

-

-

32

-

-

-

0.084 mA

-

-

-

-

-

-

-

-

-

Analog

-

-

-

In Stock

-

-

Surface Mount, Right Angle

Horizontal

Steel, Stainless

High-speed CAN Core System

1 Mbps

28 V

-

4.5 V

Surface Mount

-

-

-

-

HTSSOP

5, 9, 12, 15, 18, 24 V

-

30V

-30°C ~ 80°C

Tape & Reel (TR)

DX4

Active

Solder

-

USB - micro B

High-speed CAN Core System

-

-

Receptacle

-

Unshielded

--

-

0.5A, 1.8A

Black

32

Gold

5

-

0.082 mA

1

10000

-

-

USB 2.0

-

-

-

Pick and Place, Solder Retention

Analog

-

-

--

In Stock

-

-

-

-

-

LIN Core System

1 Mbps

28 V

-

4.5 V

Surface Mount

-

-

-

Non-Compliant

HTSSOP EP

5, 9, 12, 15, 18, 24 V

-

-

-40 to 125 °C

-

-

-

-

-

-

LIN Core System

-

-

-

-

-

-

-

-

-

32

-

-

-

0.075 mA

-

-

-

-

-

-

-

-

-

Analog

-

-

-

In Stock

-

-

-

-

-

High-speed CAN Core System

1 Mbps

28 V

-

4.5 V

Surface Mount

-

-

-

-

HTSSOP

5, 9, 12, 15, 18, 24 V

-

-

-40 to 125 °C

-

-

-

-

-

-

High-speed CAN Core System

-

-

-

-

-

-

-

-

-

32

-

-

-

0.082 mA

-

-

-

-

-

-

-

-

-

Analog

-

-

-