- Series
- Packaging
- Contact Finish Mating
- Current Rating
- Housing Material
- Contact Material - Mating
- Contact Material - Post
- Contact Resistance
- Factory Lead Time
- Material Flammability Rating
- Moisture Sensitivity Level (MSL)
- Mounting Type
Attribute column
Manufacturer
Preci-Dip Sockets for ICs, Transistors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Number of Pins | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Contact Finish Mating | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Termination | ECCN Code | Type | HTS Code | Current Rating (Amps) | Current Rating | Pitch - Mating | Number of Contacts | Contact Finish - Post | Lead Length | Body Depth | Contact Style | Contact Resistance | Insulation Resistance | Mating Contact Pitch | Dielectric Withstanding Voltage | Termination Post Length | Pitch - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | RoHS Status | Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 550-10-520M31-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 520 (31 x 31) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
514-87-600M35-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 600 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 600 (35 x 35) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | - | - | 10mOhm | - | - | - | 0.055 1.40mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
518-77-357M19-001105 Preci-Dip | 5 |
| Datasheet | 10 Weeks | Through Hole | Through Hole | 357 | FR4 Epoxy Glass | 357 (19 x 19) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 518 | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | 0.050 1.27mm | - | - | 2.794mm | - | - | 10mOhm | - | - | - | 0.110 2.78mm | 0.050 1.27mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
558-10-400M20-000101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 400 (20 x 20) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | PGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
517-83-565-21-111111 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 565 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 565 (21 x 21) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 517 | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | 0.100 2.54mm | - | Tin | 3.175mm | - | - | 10mOhm | - | - | - | 0.125 3.18mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-80-296-19-131135 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 296 (19 x 19) | Beryllium Copper | Brass | Tin | -55°C~125°C | Bulk | 2012 | 550 | Active | 1 (Unlimited) | Solder | - | PGA | - | 1A | - | 0.100 2.54mm | - | - | - | - | - | 10mOhm | - | - | - | 0.126 3.20mm | 0.100 2.54mm | Open Frame | - | - | UL94 V-0 | ROHS3 Compliant | - | ||
514-87-256M20-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 256 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 256 (20 x 20) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | Active | 1 (Unlimited) | Solder | EAR99 | BGA | 8536.69.40.40 | - | 1A | 0.100 2.54mm | 256 | Tin | 1.397mm | 0.118 inch | RND PIN-SKT | 10mOhm | 10000000000Ohm | 0.05 inch | 700VAC V | 0.055 1.40mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-272M20-001166 Preci-Dip | 49 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 272 (20 x 20) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-256M20-001104 Preci-Dip | 5 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 256 (20 x 20) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-420M26-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 420 (26 x 26) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
514-87-432M31-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 432 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 432 (31 x 31) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | - | - | 10mOhm | - | - | - | 0.055 1.40mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-360M19-001152 Preci-Dip | 44 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 360 (19 x 19) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
518-77-292M20-001106 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 292 | FR4 Epoxy Glass | 292 (20 x 20) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 518 | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | 0.050 1.27mm | - | - | 1.5748mm | - | - | 10mOhm | - | - | - | 0.062 1.57mm | 0.050 1.27mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
558-10-456M26-001101 Preci-Dip | 5 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 456 (26 x 26) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | PGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-500M30-001104 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 500 (30 x 30) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-520M31-001101 Preci-Dip | 5 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 520 (31 x 31) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | PGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-456M26-001104 Preci-Dip | 49 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 456 (26 x 26) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
514-83-652M35-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 652 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 652 (35 x 35) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | - | - | 10mOhm | - | - | - | 0.055 1.40mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
558-10-576M30-001104 Preci-Dip | 49 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 576 (30 x 30) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | BGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-480M29-001101 Preci-Dip | 7 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 480 (29 x 29) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | Active | 1 (Unlimited) | Solder | - | PGA | - | 1A | - | 0.050 1.27mm | - | - | - | - | - | 10mOhm | - | - | - | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - |