- Series
- Packaging
- Contact Finish Mating
- Current Rating
- Housing Material
- Contact Material - Mating
- Contact Material - Post
- Contact Resistance
- Factory Lead Time
- Material Flammability Rating
- Moisture Sensitivity Level (MSL)
- Mounting Type
Attribute column
Manufacturer
Preci-Dip Sockets for ICs, Transistors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Number of Pins | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Contact Finish Mating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | ECCN Code | Type | Additional Feature | HTS Code | Current Rating (Amps) | Current Rating | Pitch - Mating | Number of Contacts | Contact Finish - Post | Lead Length | Contact Resistance | Termination Post Length | Pitch - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | RoHS Status | Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 558-10-478M26-131104 Preci-Dip | 5 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 478 (26 x 26) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Open Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-144-12-000101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 144 (12 x 12) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | - | 0.100 2.54mm | - | - | - | 10mOhm | 0.164 4.16mm | 0.100 2.54mm | Open Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
546-83-192-14-001136 Preci-Dip | 7 |
| Datasheet | 10 Weeks | Through Hole | Through Hole | 192 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 192 (14 x 14) | Beryllium Copper | Bronze | Gold | -55°C~125°C | Bulk | 2012 | 546 | - | - | Active | 1 (Unlimited) | Press-Fit | - | PGA | - | - | - | 1A | 0.050 1.27mm | - | Tin | 2.4892mm | 10mOhm | 0.098 2.50mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
517-87-370-19-121111 Preci-Dip | 5 |
| Datasheet | 10 Weeks | Through Hole | Through Hole | 370 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 370 (19 x 19) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 517 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 3.175mm | 10mOhm | 0.125 3.18mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
546-83-182-14-001135 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 182 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 182 (14 x 14) | Beryllium Copper | Bronze | Gold | -55°C~125°C | Bulk | 2012 | 546 | - | - | Active | 1 (Unlimited) | Press-Fit | - | PGA | - | - | - | 1A | 0.050 1.27mm | - | Tin | 2.4892mm | 10mOhm | 0.098 2.50mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
514-87-256M16-000148 Preci-Dip | 44 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | 256 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 256 (16 x 16) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | 10mOhm | 0.055 1.40mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-255M16-001166 Preci-Dip | 49 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 255 (16 x 16) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-292M20-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 292 (20 x 20) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-256M16-000104 Preci-Dip | 44 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 256 (16 x 16) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
612-83-952-41-001101 Preci-Dip | 47 |
| Datasheet | 10 Weeks | Through Hole | Through Hole | 52 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 52 (2 x 26) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 612 | e3 | yes | Active | 1 (Unlimited) | Solder | EAR99 | DIP, 0.9 (22.86mm) Row Spacing | STANDARD: UL 94V-0 | 8536.69.40.40 | - | 1A | 0.100 2.54mm | 52 | Tin | 7.3914mm | 10mOhm | 0.291 7.39mm | 0.100 2.54mm | Carrier, Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-480M29-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 480 (29 x 29) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-504M29-001166 Preci-Dip | 49 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 504 (29 x 29) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-600M35-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 600 (35 x 35) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-400M20-000152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 400 (20 x 20) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-480M29-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 480 (29 x 29) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-400M20-000104 Preci-Dip | 49 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 400 (20 x 20) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-500M30-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 500 (30 x 30) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-388M26-001104 Preci-Dip | 5 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 388 (26 x 26) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-560M33-001104 Preci-Dip | 44 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 560 (33 x 33) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-560M33-001101 Preci-Dip | 5 |
| Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 560 (33 x 33) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - |