- Series
- Packaging
- Contact Finish Mating
- Current Rating
- Housing Material
- Contact Material - Mating
- Contact Material - Post
- Contact Resistance
- Factory Lead Time
- Material Flammability Rating
- Moisture Sensitivity Level (MSL)
- Mounting Type
Attribute column
Manufacturer
Preci-Dip Sockets for ICs, Transistors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Number of Pins | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Contact Finish Mating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | ECCN Code | Type | Additional Feature | HTS Code | Current Rating (Amps) | Current Rating | Pitch - Mating | Number of Contacts | Contact Finish - Post | Lead Length | Contact Resistance | Termination Post Length | Pitch - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | RoHS Status | Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 514-83-255M16-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 255 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 255 (16 x 16) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | 10mOhm | 0.055 1.40mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
614-83-321-19-121144 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 321 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 321 (21 x 21) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 614 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 3.4544mm | 10mOhm | 0.136 3.45mm | 0.100 2.54mm | Carrier, Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-356M26-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 356 (26 x 26) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-256M16-000101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 256 (16 x 16) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-256M16-000166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 256 (16 x 16) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.100 2.54mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.100 2.54mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-256M20-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 256 (20 x 20) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-225-18-091101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 225 (18 x 18) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | e4 | - | Active | 1 (Unlimited) | Solder | EAR99 | PGA | STANDARD: UL 94V-0 | 8536.69.40.40 | 1A | - | 0.100 2.54mm | 224 | - | - | 10mOhm | 0.164 4.16mm | 0.100 2.54mm | Open Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
517-83-429-19-101111 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 429 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 429 (19 x 19) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 517 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 3.175mm | 10mOhm | 0.125 3.18mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
546-83-181-15-051135 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 181 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 181 (15 x 15) | Beryllium Copper | Bronze | Gold | -55°C~125°C | Bulk | 2012 | 546 | - | yes | Active | 1 (Unlimited) | Press-Fit | - | PGA | - | - | - | 1A | 0.050 1.27mm | - | Tin | 2.4892mm | 10mOhm | 0.098 2.50mm | 0.100 2.54mm | Open Frame | 29.5μin 0.75μm | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
514-87-500M30-001148 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 500 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 500 (30 x 30) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 514 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | - | 1A | 0.100 2.54mm | - | Tin | 1.397mm | 10mOhm | 0.055 1.40mm | 0.100 2.54mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-357M19-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 357 (19 x 19) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-420M26-001101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 420 (26 x 26) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-652M35-001166 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 652 (35 x 35) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.100 2.54mm | - | - | - | 10mOhm | 0.098 2.50mm | 0.100 2.54mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-432M31-001101 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 432 (31 x 31) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.111 2.83mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-456M26-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 456 (26 x 26) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-560M33-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 560 (33 x 33) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
550-10-520M31-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 520 (31 x 31) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
518-77-520M31-001105 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Through Hole | Through Hole | 520 | FR4 Epoxy Glass | 520 (31 x 31) | Beryllium Copper | Brass | Gold | -55°C~125°C | Bulk | 2012 | 518 | - | - | Active | 1 (Unlimited) | Solder | - | PGA | - | - | - | 1A | 0.050 1.27mm | - | - | 2.794mm | 10mOhm | 0.110 2.78mm | 0.050 1.27mm | Open Frame | Flash | - | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||
550-10-576M30-001152 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | - | Through Hole | - | FR4 Epoxy Glass | 576 (30 x 30) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 550 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - | ||
558-10-357M19-001104 Preci-Dip | In Stock | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | - | FR4 Epoxy Glass | 357 (19 x 19) | Brass | - | Gold | -55°C~125°C | Bulk | 2012 | 558 | - | - | Active | 1 (Unlimited) | Solder | - | BGA | - | - | 1A | - | 0.050 1.27mm | - | - | - | 10mOhm | 0.086 2.20mm | 0.050 1.27mm | Closed Frame | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | - |