- RoHS
- Max Operating Temperature
- Min Operating Temperature
- Case/Package
- Frequency
- Data Bus Width
- Number of Pins
- Max Frequency
- RAM Size
- Interface
- Memory Size
- Max Supply Voltage
Attribute column
Manufacturer
pSemi Embedded - Microcontroller, Microprocessor, FPGA Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Surface Mount | Number of Pins | Weight | Number of Terminals | ADC (Bit) | Case/Package | CPU Core | CPU Maximum Speed | DAC (Bit) | Date Of Intro | Direct Memory Access | GPIO Ports Number | Ihs Manufacturer | Internal Oscillator | Low-Voltage Detect | Memory Types | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Operating Voltage Range | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Peripheral/Function | Program Storage Size | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Watchdog | Watchdog Timers | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Peripherals | Program Memory Type | Data Bus Width | Halogen Free | Seated Height-Max | Number of Timers/Counters | Address Bus Width | Operating Temperature Range | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | Number of ADC Channels | Number of Cores | Length | Width | Radiation Hardening | REACH SVHC | Lead Free |
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 PIMX8DL1AVNFZAB NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
FS32K118LAT0MLH NXP Semicon | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
LPC1763FBF80K NXP Semicon | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MCIMX6Q4AVT10AC NXP Semiconductors | In Stock | - | Datasheet | 4 Weeks | - | - | YES | - | - | 624 | - | - | - | - | - | - | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 125 °C | -40 °C | - | - | PLASTIC/EPOXY | FBGA | FCBGA-624 | - | SQUARE | GRID ARRAY, FINE PITCH | Not Recommended | - | - | - | Yes | - | 1.5 V | 1.35 V | - | - | - | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B624 | - | AUTOMOTIVE | - | - | - | - | - | - | - | SoC | - | - | - | - | 2.16 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 21 mm | 21 mm | - | - | - | ||
MCIMX6S5DVM10AD NXP Semiconductors | In Stock | - | - | 16 Weeks | - | - | YES | - | - | 624 | - | - | - | - | - | - | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 95 °C | - | - | - | PLASTIC/EPOXY | LFBGA | MABGA-624 | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.5 V | 1.35 V | - | - | - | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B624 | - | OTHER | - | - | - | - | - | - | - | SoC | - | - | - | - | 1.6 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 21 mm | 21 mm | - | - | - | ||
MCIMX258CJM4A NXP Semiconductors | In Stock | - | Datasheet | 18 Weeks | - | - | YES | - | - | 400 | - | - | - | - | - | - | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | LFBGA | MAPBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.52 V | 1.38 V | 1.45 V | - | - | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | ALSO REQUIRES 3.3 V I/O SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B400 | Not Qualified | INDUSTRIAL | - | - | - | - | - | - | - | SoC | - | - | - | - | 1.6 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | - | - | - | ||
MCIMX6G2AVM07AB NXP Semiconductors | In Stock | - | Datasheet | 4 Weeks | - | - | YES | - | - | 289 | - | - | - | - | - | 2017-05-31 | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 125 °C | -40 °C | - | - | PLASTIC/EPOXY | LFBGA | BGA-289 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.3 V | 1.25 V | - | - | - | e2 | 5A992.C | Tin/Silver (Sn/Ag) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B289 | - | AUTOMOTIVE | - | - | - | - | - | 696 MHz | - | MULTIFUNCTION PERIPHERAL | - | - | - | - | 1.32 mm | - | 26 | - | - | - | YES | YES | 16 | - | FIXED POINT | YES | - | - | 14 mm | 14 mm | - | - | - | ||
MCIMX6Y2DVM05AB NXP Semiconductors | In Stock | - | - | 4 Weeks | - | - | YES | - | - | 289 | - | - | - | - | - | - | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 95 °C | - | - | - | PLASTIC/EPOXY | LFBGA | MAPBGA-289 | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.5 V | 1.275 V | - | - | - | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B289 | - | - | - | - | - | - | - | - | - | SoC | - | - | - | - | 1.32 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 14 mm | 14 mm | - | - | - | ||
MIMX8MM6DVTLZAA NXP Semiconductors | In Stock | - | - | 4 Weeks | - | - | YES | - | - | 486 | - | - | - | - | - | 2019-02-21 | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 95 °C | - | - | - | PLASTIC/EPOXY | LFBGA | FCBGA-486 | BGA486,27X27,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.05 V | 0.95 V | 1 V | - | - | e2 | 5A992.C | Tin/Silver (Sn/Ag) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.5 mm | compliant | - | 40 | S-PBGA-B486 | - | OTHER | - | - | - | - | - | - | - | SoC | - | - | - | - | 1.25 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 14 mm | 14 mm | - | - | - | ||
MK10DN512ZVLL10 NXP Semicon | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | ARM-M4 | 100MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | 512KB | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MCIMX353DJQ5C NXP Semiconductors | In Stock | - | Datasheet | 18 Weeks | - | - | YES | - | - | 400 | - | - | - | - | - | - | - | - | NXP SEMICONDUCTORS | - | - | - | 3 | - | 70 °C | -20 °C | - | - | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | - | Yes | - | 1.47 V | 1.33 V | 1.8 V | - | - | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | IT ALSO OPERATES AT 1.22 TO 1.47 V | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | 40 | S-PBGA-B400 | Not Qualified | OTHER | - | - | - | - | - | - | - | SoC | - | - | - | - | 1.6 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | - | - | - | ||
SPC5642AF2MLU1 NXP Semicon | In Stock | - | Datasheet | - | - | - | - | - | - | - | 12bit | - | - | 150MHz | - | - | Yes | 84 | - | Yes | Yes | - | - | - | - | - | 1.14V~5.25V | Tray | - | - | - | - | - | - | - | DMA;Watchdog | 2MB | true | - | - | - | - | - | Yes | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 128KB | - | - | FLASH | - | - | - | - | - | -40℃~+125℃ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 S9S12G128AMLH NXP Semicon | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 MKE14Z256VLH7 NXP Semicon | In Stock | - | Datasheet | - | - | - | - | - | - | - | 12bit | - | ARM-M0 | 72MHz | 8bit | - | Yes | 58 | - | Yes | Yes | - | - | - | - | - | 2.7V~5.5V | Tray | - | - | - | - | - | - | - | DMA;Low-Voltage Detection;PWM;Watchdog | 256KB | true | - | - | - | - | - | Yes | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32KB | - | - | FLASH | - | - | - | - | - | -40℃~+105℃ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 S912ZVC12F0VLF NXP Semicon | In Stock | - | - | - | - | - | - | - | - | - | 10bit | - | - | 32MHz | 8bit | - | - | 28 | - | Yes | - | - | - | - | - | - | 3.5V~40V | Tray | - | - | - | - | - | - | - | DMA;Watchdog | 128KB | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8KB | - | - | FLASH | - | - | - | - | - | -40℃~+105℃ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 LPC4320FBD144,551 NXP Semiconductors | In Stock | - | Datasheet | - | Tin | Surface Mount | - | 144 | - | - | - | LQFP | - | - | - | - | - | - | - | - | - | FLASH, ROMless | - | 83 | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | 8542310000 | - | - | - | - | Yes | - | - | - | 85 °C | -40 °C | - | - | 1.5 W | - | - | - | - | - | 204 MHz | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, MMC, SD, SPI, SSP, UART, USART, USB | 3.6 V | 2.2 V | 264 kB | Internal | - | 200 kB | - | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 32 b | - | - | 6 | - | - | ARM | 204 MHz | - | - | - | 83 | - | - | - | - | - | - | No | No SVHC | - | ||
 SPC5676RDK3MVU1 NXP Semiconductors | In Stock | - | Datasheet | - | - | - | - | 416 | - | - | - | - | - | - | - | - | - | - | - | - | - | FLASH | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | 125 °C | -40 °C | - | - | - | - | - | - | - | - | 180 MHz | - | - | - | - | CAN, EBI/EMI, SCI, SPI | - | - | 6 MB | Internal | - | 384 kB | - | DMA, POR, PWM | - | 32 b | Halogen Free | - | 3 | - | - | - | 184 MHz | - | - | - | - | - | - | - | - | - | - | No | - | - | ||
 MPC8315ECVRAGDA NXP Semiconductors | In Stock | - | Datasheet | - | Silver, Tin | Surface Mount | - | 620 | 4.272897 g | - | - | BGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | 105 °C | -40 °C | - | - | - | - | - | - | - | - | 400 MHz | - | - | - | - | - | 1.05 V | 950 mV | 32 kB | - | - | - | - | - | - | 32 b | Not Halogen Free | - | - | - | - | - | 50 MHz | - | - | - | - | - | - | - | 1 | - | - | - | No SVHC | Lead Free | ||
 MK20DN512ZVMC10 NXP Semiconductors | In Stock | - | Datasheet | - | - | Surface Mount | - | 121 | 167.687429 mg | - | - | MAPBGA | - | - | - | - | - | - | - | - | - | FLASH | - | 86 | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | Yes | - | - | - | 105 °C | -40 °C | - | - | - | - | - | - | - | - | 100 MHz | - | - | - | - | CAN, EBI/EMI, I2C, I2S, IrDA, SD, SPI, UART, USART, USB | 3.6 V | 1.71 V | 512 kB | Internal | - | 128 kB | - | DMA, I2C, LVD, POR, PWM, WDT | - | 32 b | Halogen Free | - | 22 | - | - | ARM | 100 MHz | - | - | - | 86 | - | - | - | - | - | - | No | No SVHC | Lead Free | ||
 S9S08DZ48F2CLH NXP Semiconductors | In Stock | - | Datasheet | - | - | Surface Mount | - | 64 | 346.544571 mg | - | - | LQFP | - | - | - | - | - | - | - | - | - | FLASH | - | 53 | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | Yes | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | - | - | 40 MHz | - | - | - | - | CAN, I2C, LIN, SCI, SPI | 5.5 V | 2.7 V | 48 kB | External | - | 3 kB | - | LVD, POR, PWM, WDT | - | 8 b | Halogen Free | - | 8 | - | - | S08 | 40 MHz | - | - | - | 54 | - | - | 24 | - | - | - | No | - | - |