- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- uPs/uCs/Peripheral ICs Type
- HTS Code
- Package Description
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
- Package Style
Attribute column
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pSemi Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8569ECVJAQLJB NXP Semiconductors | In Stock | - | Datasheet | 4 Weeks | YES | 783 | 133 MHz | NXP SEMICONDUCTORS | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | HBGA | 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | BGA783,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | - | Yes | 1.03 V | 0.97 V | 1 V | e1 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B783 | Not Qualified | - | 1067 MHz | MICROPROCESSOR, RISC | 32 | 3.94 mm | 16 | YES | YES | 64 | FLOATING POINT | YES | 29 mm | 29 mm | ||
MCIMX6U6AVM10ADR REV.1.4 NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC823ZT25Z3 NXP Semiconductors | In Stock | - | Datasheet | - | YES | 256 | - | NXP SEMICONDUCTORS | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | unknown | - | - | S-PBGA-B256 | - | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | - | - | YES | YES | - | FIXED POINT | YES | - | - | ||
XPC755BPX350LD NXP Semiconductors | In Stock | - | Datasheet | - | YES | 360 | - | NXP SEMICONDUCTORS | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Obsolete | - | - | 2.1 V | 1.9 V | 2 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | unknown | - | - | R-PBGA-B360 | - | - | 350 MHz | MICROPROCESSOR, RISC | - | - | - | YES | NO | - | FIXED POINT | NO | - | - | ||
XPC745BPX350LD NXP Semiconductors | In Stock | - | Datasheet | - | YES | 255 | - | NXP SEMICONDUCTORS | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | - | - | 2.1 V | 1.9 V | 2 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | unknown | - | - | R-PBGA-B255 | - | - | 350 MHz | MICROPROCESSOR, RISC | - | - | - | YES | NO | - | FIXED POINT | NO | - | - | ||
SCIMX6D5EYM10CD NXP Semiconductors | In Stock | - | Datasheet | - | YES | 624 | 24 MHz | NXP SEMICONDUCTORS | - | - | - | PLASTIC/EPOXY | HBGA | HBGA, | - | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Active | - | - | 1.5 V | 1.35 V | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | - | S-PBGA-B624 | - | - | 1000 MHz | MICROPROCESSOR | 64 | 1.6 mm | 16 | YES | YES | 64 | FIXED POINT | YES | 21 mm | 21 mm | ||
SCIMX6U6AVM083CR NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
P5021PSE72QC NXP Semiconductors | In Stock | - | Datasheet | - | YES | 1295 | - | NXP SEMICONDUCTORS | - | 105 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Yes | 1.23 V | 1.17 V | 1.2 V | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1295 | - | OTHER | 2200 MHz | MICROPROCESSOR, RISC | - | 3.53 mm | 16 | YES | YES | 64 | FIXED POINT | YES | 37.5 mm | 37.5 mm | ||
 PR31500ABC NXP Semiconductors | In Stock | - | Datasheet | - | YES | 208 | - | NXP SEMICONDUCTORS | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Obsolete | QFP | - | - | - | 3.3 V | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | Not Qualified | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 32 | - | - | - | - | - | - | - | - | - | ||
MC68VZ328CAG NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |